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characterization, modeling, and design of esd protection circuits

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106 Chapter 4. Simulation: Calibration <strong>and</strong> Results<br />

effect <strong>of</strong> increasing drain current is <strong>of</strong>fset by the lowering <strong>of</strong> the electric field, which is<br />

proportional to Vds - Vgs . In the initial substrate simulations, Ib was about one order <strong>of</strong><br />

magnitude too high for the structures <strong>of</strong> both gate lengths, so simulations were then run<br />

with lower values <strong>of</strong> λn until an optimal value was found. For the best-fit case, with λn set<br />

at a little more than half its default value, the peak log(Ib ) for each Vds step is within 2% <strong>of</strong><br />

the measured value for the 0.5µm-gate structure <strong>and</strong> within 3% for the 3.0µm-gate<br />

structure, <strong>and</strong> the peak in Ib always occurs at the correct value <strong>of</strong> Vgs . However, for Vgs greater than 2.5V the simulated substrate current <strong>of</strong> both structures rolls <strong>of</strong>f more severely<br />

than the measured current, indicating that either the current <strong>and</strong> electric field pr<strong>of</strong>iles in<br />

the drain junction region are not correct or that the II model loses accuracy for lower<br />

electric fields. It may be possible to correct the latter case by further altering the II<br />

coefficients, but it is also possible that there is a limitation in the model. Despite the sharp<br />

roll-<strong>of</strong>f, the good fit in the peak Ib region was encouraging enough to allow the calibration<br />

to proceed to the breakdown characteristic.<br />

The breakdown <strong>of</strong> Fig. 4.40e results from avalanche multiplication <strong>of</strong> carriers caused by<br />

reverse biasing the drain-substrate junction. Since the hole current sunk by the substrate is<br />

equal to the electron current sourced by the drain, both types <strong>of</strong> carriers create avalanche<br />

pairs <strong>and</strong> thus λn <strong>and</strong> λp both determine the breakdown voltage. Since λn was already<br />

determined by the Ib-Vgs calibration, only λp was adjusted to calibrate BVDSS . This is<br />

analogous to the gate <strong>and</strong> drain-characteristic calibrations in which the gate curves were<br />

used to fit the E⊥ mobility coefficients <strong>and</strong> then the drain calibration was used to fit the<br />

remaining mobility coefficients. Surprisingly, the default, bulk value <strong>of</strong> λp resulted in a<br />

simulated BVDSS less than the measured BVDSS , meaning it had to be increased to fit the<br />

curves (structures for both gate lengths have the same breakdown voltage because this<br />

voltage does not depend on gate length). This suggests that λp had to be adjusted to<br />

compensate for a λn which is too low or that a majority <strong>of</strong> the simulated II generation<br />

occurs along the drain-substrate junction, where the mean free path is closer to its bulk<br />

value, rather than under the gate at the surface. To calibrate the breakdown curve, λp only<br />

had to be increased about 5% above its default value.<br />

After calibration <strong>of</strong> the breakdown curves was completed, simulations for all characteristics<br />

at both gate lengths were rerun with all <strong>of</strong> the calibrated coefficients in place. Not surprisingly,<br />

adding the impact ionization model to the drain simulations did increase Ids for<br />

large Vds in the 0.5µm structure, but it had no effect on the extracted saturation current,

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