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characterization, modeling, and design of esd protection circuits

characterization, modeling, and design of esd protection circuits

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2.3. Overview <strong>of</strong> Protection Circuit Design 43<br />

Bond pad<br />

V CC<br />

M1 Rdiff M2<br />

Input<br />

VSS Fig. 2.18 Combination resistor/transistor ESD input <strong>protection</strong> circuit, featuring a<br />

diffused resistor (Rdiff ) between wide (M1) <strong>and</strong> narrow (M2) NMOS<br />

transistors. Resistance from gate to ground is not shown.<br />

in Fig. 2.18. The narrow transistor is <strong>design</strong>ed with a minimal gate length so that its<br />

parasitic bipolar transistor will turn on quickly <strong>and</strong> clamp the input voltage during a short<br />

ESD event. During a longer event the wide transistor, which may have a longer gate length<br />

<strong>and</strong> turn-on time, absorbs the majority <strong>of</strong> ESD current. The well resistor creates a voltage<br />

drop which ensures that the drain voltage <strong>of</strong> the wide transistor will build up to the<br />

breakdown value instead <strong>of</strong> being clamped at Vsb <strong>of</strong> the narrow transistor. This circuit<br />

only begins to suggest the creativity that can be used in <strong>design</strong>ing <strong>protection</strong> <strong>circuits</strong>, but it<br />

exemplifies the implementation <strong>of</strong> different devices to provide <strong>protection</strong> across a broad<br />

range <strong>of</strong> the EOS/ESD spectrum.<br />

In closing out this section on ESD <strong>circuits</strong>, it should be mentioned that a CMOS I/O<br />

<strong>protection</strong> transistor usually consists <strong>of</strong> several “fingers” <strong>of</strong> devices in parallel coming <strong>of</strong>f<br />

an I/O pad rather than a single, very wide MOSFET (Fig. 2.19). This <strong>design</strong> method is<br />

used because ESD-current robustness increases with device width <strong>and</strong> multiple fingers<br />

furnish a compact way <strong>of</strong> providing a large effective width on a circuit in which space is at<br />

a premium. Also, a single narrow metal finger coming <strong>of</strong>f <strong>of</strong> the contact pad will have a<br />

higher current density than several fingers in parallel <strong>and</strong> thus will be more susceptible to<br />

damage. One important drawback <strong>of</strong> such “multifingered” devices is that due to r<strong>and</strong>om<br />

variations between fingers it is almost never the case that all fingers <strong>of</strong> a <strong>protection</strong> device<br />

will turn on simultaneously during an ESD event. Instead, after one device breaks down<br />

<strong>and</strong> quickly enters the snapback mode, the drain voltage <strong>of</strong> all the devices is clamped at<br />

the snapback voltage since they are all tied to the input. As the current increases, the

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