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characterization, modeling, and design of esd protection circuits

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154 Chapter 5. Design <strong>and</strong> Optimization <strong>of</strong> ESD Protection Transistor Layout<br />

circuit. This would lead to an unpredictable, low-voltage failure to which our <strong>modeling</strong><br />

cannot be applied.<br />

5.2 Application<br />

NMOS ESD test structures were laid out <strong>and</strong> characterized using TLP <strong>and</strong> HBM testing<br />

for an AMD 0.35µm CMOS process. The <strong>design</strong> space covers finger widths between 25<br />

<strong>and</strong> 150µm, DGS between 4.4 <strong>and</strong> 7.4µm, <strong>and</strong> SGS between 2.2 <strong>and</strong> 4.2µm for singlefinger<br />

structures <strong>and</strong> multiple-finger structures with two to six fingers. In order to keep the<br />

number <strong>of</strong> test structures in the <strong>design</strong> space relatively small, gate length was not used as a<br />

factor in this study. The total <strong>design</strong> space, comprised <strong>of</strong> 18 structures, is not optimal<br />

because layout was not performed with empirical <strong>modeling</strong> in mind. Catalyst requires 20<br />

structures in order to calculate model coefficients for all linear, quadratic, <strong>and</strong> interaction<br />

terms for four factors. However, since not all possible model terms are needed to describe<br />

the responses, our <strong>design</strong> space is adequate. The responses for which model equations are<br />

derived are Vsb , Rsb , IHBM,ws , <strong>and</strong> VHBM,ws . The trigger voltage, Vt1 , is not modeled<br />

because it is mainly dependent on gate length <strong>and</strong> gate-bounce resistance, parameters<br />

which are not varied.<br />

Model terms for each response are chosen based on physical reasoning <strong>and</strong> observed<br />

single-factor dependencies. Examining the snapback voltage first, note that since Vsb is<br />

the voltage required to sustain parasitic bipolar operation, it should be the sum <strong>of</strong> the<br />

BVCEO <strong>of</strong> the intrinsic device <strong>and</strong> the ohmic drops in the source <strong>and</strong> drain diffusions. The<br />

intrinsic device size is a constant in the <strong>design</strong> space since gate length is not varied, <strong>and</strong><br />

therefore<br />

V sb<br />

= + a1( DGS)<br />

+ a2 ( SGS)<br />

. (5.51)<br />

a 0<br />

The snapback resistance should always be proportional to the total device width, assuming<br />

all fingers are conducting. Thus, the Rsb response is normalized by the total width <strong>and</strong> Eq.<br />

(5.50) is rewritten as<br />

R sb<br />

⋅ ( Wn)<br />

= b0 + b1( DGS)<br />

+<br />

b2 ( SGS)<br />

. (5.52)

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