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-163- Suprem-III User´s Manual layer material type thickness dx dxmin top bottom orientation no. (microns) (microns) node node or grain size 3 NITRIDE 0.0800 0.0100 0.0010 254 262 2 OXIDE 0.0406 0.0100 0.0010 263 266 1 SILICON 6.1265 0.0100 0.0010 267 500 Integrated Dopant layer Net Total no. active chemical active chemical 3 0.0000e+00 0.0000e+00 0.0000e+00 0.0000e+00 2 0.0000e+00 2.4201e+09 0.0000e+00 2.4201e+09 1 4.8995e+14 4.8995e+14 4.9037e+14 4.9037e+14 sum 4.8995e+14 4.8995e+14 4.9037e+14 4.9037e+14 Integrated Dopant layer ARSENIC ANTIMONY no. active chemical active chemical 3 0.0000e+00 0.0000e+00 0.0000e+00 0.0000e+00 2 0.0000e+00 2.4201e+09 0.0000e+00 0.0000e+00 1 7.9866e+11 7.9866e+11 4.8936e+14 4.8936e+14 sum 7.9866e+11 8.0108e+11 4.8936e+14 4.8936e+14 Integrated Dopant layer BORON no. active chemical 3 0.0000e+00 0.0000e+00 2 0.0000e+00 7.3250e-01 1 2.1099e+11 2.1099e+11 sum 2.1099e+11 2.1099e+11 Junction Depths and Integrated Dopant Concentrations for Each Diffused Region layer region type junction depth net total no. no. (microns) active Qd chemical Qd 3 1 n 0.0000 0.0000e+00 0.0000e+00 2 1 n 0.0000 0.0000e+00 2.4201e+09 1 2 n 0.0000 4.9004e+14 4.9025e+14 1 1 p 4.0558 9.6256e+10 1.0673e+11 Save the simulation structure at this point for use in subsequent processing. End Suprem-III
-164- Suprem-III User´s Manual Suprem-III simulation of the active device region after drive-in of the buried layer.
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