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Suprem III - Stanford Technology CAD Home Page

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<strong>Suprem</strong>-<strong>III</strong> User´s Manual<br />

XDX Num The distance from the surface of the layer at which the nominal grid<br />

spacing, DX, applies.<br />

(unit: microns.)<br />

(default: 0.)<br />

(synonym: )<br />

Log Specifies that the crystalline orientation of the deposited silicon is .<br />

(unit: )<br />

(default: false.)<br />

(synonym: )<br />

Log Specifies that the crystalline orientation of the deposited silicon is .<br />

(unit: )<br />

(default: false.)<br />

(synonym: )<br />

Log Specifies that the crystalline orientation of the deposited silicon is .<br />

(unit: )<br />

(default: false.)<br />

(synonym: )<br />

The DEPOSITION statement is used to deposit a given thickness of the specified material on top of the existing<br />

structure. The material deposited may be either undoped or doped uniformly with one of the available impurity<br />

types. If the material to be deposited is of the same type as is already present in the top layer of the structure, then<br />

the material is added to the existing top layer. If the top layer material is of a different type than that being deposited,<br />

then a new layer is created for the deposited material.<br />

If single crystal silicon is being deposited, then the crystalline orientation must also be specified. If<br />

polysilicon is being deposited, then the deposition temperature must also be specified. The resulting polysilicon<br />

grain size will be calculated from the deposition temperature and pressure unless overridden by the user via the<br />

GRAINSIZE parameters.

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