Bulletin 2011/27 - European Patent Office
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(H01L) I.1(1)<br />

(51) H01L 21/677 (11) 2 340 556 A2*<br />

H01L 31/18<br />

(25) De (26) De<br />

(21) 09740259.8 (22) 18.09.2009<br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MK MT<br />

NL NO PL PT RO SE SI SK SM TR<br />

AL BA RS<br />

(86) EP 2009/006762 18.09.2009<br />

(87) WO 2010/031571 2010/12 25.03.2010<br />

(88) 14.05.2010<br />

(30) 18.09.2008 DE 202008012449 U<br />

(54) • HERSTELLVERFAHREN UND HERSTELL-<br />

VORRICHTUNG FÜR STRINGS<br />

• PRODUCTION METHOD AND PRODUC-<br />

TION DEVICE FOR STRINGS<br />

• PROCÉDÉ ET DISPOSITIF DE FABRICA-<br />

TION DE CHAÎNES D'ÉLÉMENTS SOLAI-<br />

RES<br />

(71) KUKA Systems GmbH, Blücherstraße 144,<br />

86165 Augsburg, DE<br />

(72) SCHÄRTL, Elisabeth, 85221 Dachau, DE<br />

VONTZ, Albert, 86836 Untermeitingen, DE<br />

SCHMID, Markus, 81679 München, DE<br />

HERZ, Frank, 86316 Friedberg, DE<br />

(74) Ernicke, Klaus Stefan, Schwibbogenplatz 2b,<br />

86153 Augsburg, DE<br />

H01L 21/8247 → (51) H01L <strong>27</strong>/115<br />

(51) H01L 23/31 (11) 2 340 557 A1*<br />

H01L 23/495<br />

(25) En (26) En<br />

(21) 09744194.3 (22) 13.10.2009<br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MK MT<br />

NL NO PL PT RO SE SI SK SM TR<br />

AL BA RS<br />

(86) IB 2009/054497 13.10.2009<br />

(87) WO 2010/049835 2010/18 06.05.2010<br />

(30) <strong>27</strong>.10.2008 EP 08105672<br />

(54) • MIKROELEKTRONISCHE KAPSELUNGS-<br />

BAUGRUPPE, VERFAHREN ZUM TRENNEN<br />

EINER MIKROELEKTRISCHEN KAPSE-<br />

LUNG<br />

• MICROELECTRONIC PACKAGE ASSEM-<br />

BLY, METHOD FOR DISCONNECTING A<br />

MICROELECTRONIC PACKAGE<br />

• ENSEMBLE BOÎTIER MICROÉLECTRO-<br />

NIQUE, PROCÉDÉ DE DÉCONNEXION D'UN<br />

BOÎTIER MICROÉLECTRONIQUE<br />

(71) NXP B.V., High Tech Campus 60, 5656 AG<br />

Eindhoven, NL<br />

(72) SCHOBER, Joachim Heinz, , AT<br />

(74) Williamson, Paul Lewis, NXP Semiconductors<br />

UK Ltd. Intellectual Property Department<br />

Betchworth House 57-65 Station Road,<br />

Redhill Surrey RH1 1DL, GB<br />

(51) H01L 23/433 (11) 2 340 558 A1*<br />

H01L 23/467<br />

(25) En (26) En<br />

(21) 09740987.4 (22) 12.10.2009<br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MK MT<br />

NL NO PL PT RO SE SI SK SM TR<br />

AL BA RS<br />

(86) IB 2009/054468 12.10.2009<br />

(87) WO 2010/044047 2010/16 22.04.2010<br />

(30) 17.10.2008 EP 08166854<br />

(54) • KÜHLANORDNUNG<br />

• COOLING ARRANGEMENT<br />

• AGENCEMENT DE REFROIDISSEMENT<br />

(71) Koninklijke Philips Electronics N.V., Groenewoudseweg<br />

1, 5621 BA Eindhoven, NL<br />

(72) VAN DER TEMPEL, Leendert, NL-5656 AE<br />

Eindhoven, NL<br />

Europäisches <strong>Patent</strong>blatt<br />

<strong>European</strong> <strong>Patent</strong> <strong>Bulletin</strong><br />

<strong>Bulletin</strong> européen des brevets<br />

(74) Bekkers, Joost J.J, Philips Intellectual Property<br />

& Standards P.O. Box 220, 5600 AE<br />

Eindhoven, NL<br />

H01L 23/467 → (51) H01L 23/433<br />

(51) H01L 23/485 (11) 2 340 559 A1*<br />

H01L 21/60<br />

(25) En (26) En<br />

(21) 08822547.9 (22) 16.09.2008<br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MT NL<br />

NO PL PT RO SE SI SK TR<br />

AL BA MK RS<br />

(86) US 2008/076543 16.09.2008<br />

(87) WO 2010/033107 2010/12 25.03.2010<br />

(54) • PB-FREIE LOTHÜGEL MIT VERBESSERTEN<br />

MECHANISCHEN EIGENSCHAFTEN<br />

• PB-FREE SOLDER BUMPS WITH<br />

IMPROVED MECHANICAL PROPERTIES<br />

• PERLES DE SOUDURE SANS PLOMB À<br />

PROPRIÉTÉS MÉCANIQUES AMÉLIORÉES<br />

(71) Agere Systems, Inc., 1110 American Parkway,<br />

NE, Allentown, PA 18109, US<br />

(72) BACHMAN, Mark, Sinking Spring, PA 19608,<br />

US<br />

OSENBACH, John, W., Kutztown, PA 19530,<br />

US<br />

(74) Williams, David John, Page White & Farrer<br />

Bedford House John Street, London WC1N<br />

2BF, GB<br />

H01L 23/485 → (51) H01L 21/60<br />

H01L 23/495 → (51) H01L 21/56<br />

H01L 23/495 → (51) H01L 23/31<br />

H01L 23/495 → (51) H05K 3/00<br />

H01L 23/522 → (51) H01L 21/02<br />

H01L 25/065 → (51) H01L 21/60<br />

(51) H01L 25/07 (11) 2 340 560 A1*<br />

(25) En (26) En<br />

(21) 08705437.5 (22) 25.01.2008<br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MT NL<br />

NO PL PT RO SE SI SK TR<br />

(86) SI 2008/000006 25.01.2008<br />

(87) WO 2009/093982 2009/31 30.07.2009<br />

(54) • LEISTUNGSSCHALTMODUL<br />

• POWER SWITCHING MODULE<br />

• MODULE DE COMMUTATION DE PUIS-<br />

SANCE<br />

(71) Iskralab D.o.o., Polje 15, 5290 Sempeter Pri<br />

Novi Gorici, SI<br />

(72) TRONTELJ, Janez, 1000 Ljubljana, SI<br />

PODRZAJ, Jurij, 1292 Ig, SI<br />

H01L <strong>27</strong>/02 → (51) H01L 21/02<br />

H01L <strong>27</strong>/06 → (51) H01L 21/02<br />

(51) H01L <strong>27</strong>/115 (11) 2 340 561 A1*<br />

H01L 21/8247 H01L 21/28<br />

H01L 21/336 H01L 29/49<br />

H01L 29/792 H01L 29/423<br />

(25) En (26) En<br />

(21) 09759779.3 (22) 22.10.2009<br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MK MT<br />

NL NO PL PT RO SE SI SK SM TR<br />

AL BA RS<br />

(86) IB 2009/054675 22.10.2009<br />

(87) WO 2010/046873 2010/17 29.04.2010<br />

106<br />

Anmeldungen<br />

Applications<br />

Demandes (<strong>27</strong>/<strong>2011</strong>) 06.07.<strong>2011</strong><br />

(30) 23.10.2008 EP 08167453<br />

(54) • MEHRTRANSISTOR-SPEICHERZELLE<br />

• MULTI-TRANSISTOR MEMORY CELL<br />

• CELLULE DE MÉMOIRE À PLUSIEURS<br />

TRANSISTORS<br />

(71) NXP B.V., High Tech Campus 60, 5656 AG<br />

Eindhoven, NL<br />

(72) GOLUBOVIC, Dusan, Redhill, Surrey RH1<br />

1DL, GB<br />

(74) Crawford, Andrew, NXP Semiconductors<br />

Intellectual Property and Licensing Department<br />

Betchworth House 57-65 Station Road,<br />

Redhill, Surrey RH1 1DL, GB<br />

H01L <strong>27</strong>/15 → (51) H01L 33/00<br />

(51) H01L <strong>27</strong>/24 (11) 2 340 562 A2*<br />

(25) En (26) En<br />

(21) 09744<strong>27</strong>6.8 (22) 22.10.2009<br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MK MT<br />

NL NO PL PT RO SE SI SK SM TR<br />

AL BA RS<br />

(86) US 2009/061687 22.10.2009<br />

(87) WO 2010/048408 2010/17 29.04.2010<br />

(88) 19.08.2010<br />

(30) 23.10.2008 US 108017 P<br />

(54) • AUF KOHLENSTOFF BASIERENDE SPEI-<br />

CHERELEMENTE, DIE VERRINGERTE<br />

DELAMINATION AUFWEISEN, UND VER-<br />

FAHREN ZU IHRER BILDUNG<br />

• CARBON-BASED MEMORY ELEMENTS<br />

EXHIBITING REDUCED DELAMINATION<br />

AND METHODS OF FORMING THE SAME<br />

• ÉLÉMENTS-MÉMOIRES À BASE DE CAR-<br />

BONE PRÉSENTANT UN DÉLAMINAGE<br />

RÉDUIT ET LEURS PROCÉDÉS DE FABRI-<br />

CATION<br />

(71) Sandisk 3D LLC, 601 McCarthy Boulevard,<br />

Milpitas, CA 95035, US<br />

(72) XU, Huiwen, Sunnyvale, CA 94087, US<br />

(74) Tothill, John Paul, Dehns St Bride's House<br />

10 Salisbury Square, GB-London EC4Y 8JD,<br />

GB<br />

H01L 29/423 → (51) H01L <strong>27</strong>/115<br />

H01L 29/49 → (51) H01L <strong>27</strong>/115<br />

H01L 29/792 → (51) H01L <strong>27</strong>/115<br />

(51) H01L 31/00 (11) 2 340 563 A2*<br />

(25) De (26) De<br />

(21) 09783435.2 (22) 25.09.2009<br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MK MT<br />

NL NO PL PT RO SE SI SK SM TR<br />

AL BA RS<br />

(86) EP 2009/062461 25.09.2009<br />

(87) WO 2010/049225 2010/18 06.05.2010<br />

(88) 10.03.<strong>2011</strong><br />

(30) 31.10.2008 DE 102008054099<br />

(54) • ANORDNUNG UND VERFAHRENSWEISE<br />

ZUR NUTZUNG DER WÄRMEENTSTE-<br />

HUNG AN PHOTOVOLTAIKANLAGEN<br />

INNERHALB HAUSTECHNISCHER ANLA-<br />

GEN<br />

• ARRANGEMENT AND METHOD FOR UTI-<br />

LIZING THE HEAT BUILT UP ON PHOTO-<br />

VOLTAIC SYSTEMS OF DOMESTIC<br />

INSTALLATIONS<br />

• AGENCEMENT ET PROCÉDÉ D'EXPLOITA-<br />

TION DE LA CHALEUR DÉGAGÉE PAR DES<br />

INSTALLATIONS PHOTOVOLTAÏQUES À<br />

L'INTÉRIEUR D'INSTALLATIONS DOMES-<br />

TIQUES<br />

(71) Reichert, Heiko, Georgstraße 11, 06108<br />

Halle, DE

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