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Chapter 10 Memory Subsystem.pdf

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Device<br />

D2D<br />

OCM_ROM OCM_RAM<br />

ROM (32K bytes)<br />

-Boot code<br />

USB HS<br />

DAP<br />

OCM subsystem<br />

RAM (64K bytes)<br />

Public Version<br />

www.ti.com On-Chip <strong>Memory</strong> <strong>Subsystem</strong><br />

<strong>10</strong>.3 On-Chip <strong>Memory</strong> <strong>Subsystem</strong><br />

<strong>10</strong>.3.1 OCM <strong>Subsystem</strong> Overview<br />

The on-chip memory subsystem consists of two separate on-chip memory controllers, one connected to<br />

an on-chip ROM (OCM_ROM) and the other connected to an on-chip RAM (OCM_RAM). Each memory<br />

controller has its own dedicated interface to the L3 interconnect.<br />

Figure <strong>10</strong>-78 is an overview of the OCM subsystem.<br />

Figure <strong>10</strong>-78. OCM <strong>Subsystem</strong> Overview<br />

2D/3D Display System<br />

graphics subsystem DMA<br />

MPU<br />

subsystem<br />

L3 interconnect<br />

IVA2<br />

SDRAM controller<br />

subsystem<br />

SDRAM external<br />

memory<br />

Camera<br />

subsystem<br />

GPMC<br />

USB<br />

Flash ROM, NAND<br />

external memories<br />

Multiple L3 initiators (such as remote devices) have access to the RAM through 2D/3D graphics, the MPU<br />

subsystem, sDMA, the camera subsystem, the display subsystem, IVA2, and USB.<br />

ROM is used for direct boot code and boot from external NAND flash.<br />

SPRUGN4L–May 20<strong>10</strong>–Revised June 2011 <strong>Memory</strong> <strong>Subsystem</strong><br />

Copyright © 20<strong>10</strong>–2011, Texas Instruments Incorporated<br />

Ocm-003<br />

2313

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