Handbook of Solvents - George Wypych - ChemTech - Ventech!

13.4 Effect of polymerization solvent 841
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13.4 EFFECT OF POLYMERIZATION SOLVENT ON THE CHEMICAL
STRUCTURE AND CURING OF AROMATIC POLY(AMIDEIMIDE)
Norio Tsubokawa
Faculty of Engineering, Niigata University, Niigata, Japan
13.4.1 INTRODUCTION
Aromatic poly(amide-imide) (PAI) has an outstanding resistance not only to the thermal operations
but also mechanical, electrical, and chemical operations. Although the properties
of PAI are inferior to those of aromatic polyimide (PI), which is one of the most heat-resistant
polymers, PAI has been widely utilized as a high performance heat resistant polymer as
well as PI, because PAI is superior to PI in its workability in industry. 1,2
In general, PAI is prepared by the following two processes: diamine process and
diisocyanate process. Diisocyanate process is achieved by the direct polycondensation of
trimellitic anhydride (TMAH) with aromatic diisocyanate, such as 4,4’-diphenylmethane
diisocyanate, in a polar solvent such as N-methyl-2-pyrrolidone (NMP) as shown in Eq.
[13.4.1]. 1-3 On the other hand, the diamine process is achieved by a two-step reaction: 1
(1) the polymerization (polycondensation and polyaddition) of trimellitic anhydride
chloride (TMAH-CI) with aromatic diamine, such as 4,4’diaminodiphenylether (DDE) or
4,4’diaminodiphenylmethane (DDM) in a polar solvent such as N,N-dimethylacetamide
(DMAc), to give poly(amic acid-amide) (PAAA) and
(2) the imidation of PAAA by heating as shown in Eq. [13.4.2].
[13.4.1]