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Handbook of Solvents - George Wypych - ChemTech - Ventech!

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13.4 Effect <strong>of</strong> polymerization solvent 845<br />

tent <strong>of</strong> cyclic imide bond and all imide bonds <strong>of</strong> PAI-1 and PAI-2 further increased by heating<br />

<strong>of</strong> the corresponding PAAAs at 180°C for 2 h followed by heat treatment at 260°C for 2<br />

h. The content <strong>of</strong> amide bond decreased by heating <strong>of</strong> PAAA at 180°C for 2 h, but increased<br />

by post-heating at 260°C for 2 h.<br />

Table 13.4.4. IR absorbance ratio and insoluble part <strong>of</strong> samples after heat treatment in<br />

air [Data from reference 7]<br />

Sample<br />

No.<br />

Heat treatment Absorbance ratio<br />

Insoluble<br />

part<br />

%<br />

Temperature Time Cyclic imide Amide All imide<br />

o<br />

C<br />

h D1780/D1510 D1530/D1510 D1380/D1510 PAAA-1 0.05 0.68 0.37 0<br />

PAI-1 180 2 0.24 0.43 0.57 0<br />

PAI-1 260 2 0.33 0.56 0.71 76.7<br />

PAAA-2 0.10 0.59 0.36 0<br />

PAI-2 180 2 0.26 0.45 0.58 0<br />

PAI-2 260 2 0.31 0.50 0.64 16.8<br />

13.4.3.2 Curing PAI by post-heating<br />

The formation <strong>of</strong> the insoluble part in NMP was observed and the amount <strong>of</strong> insoluble part<br />

formed by heating <strong>of</strong> PAI-1 (obtained in MEK/water mixed solvent) was larger than that by<br />

heating <strong>of</strong> PAI-2 (obtained in DMAc).<br />

The increase <strong>of</strong> imide and amide bond content by post-heating at 260°C is considered<br />

as follows: the imidation <strong>of</strong> amic acid structure may be proceeded by both intermolecular<br />

and intramolecular imidation. The latter produces cyclic imide bond, but the former produces<br />

acyclic imide bond to give crosslinking material as shown in Eq. [13.4.3].<br />

Since PAIs obtained by heating <strong>of</strong> PAAAs at 180°C are completely soluble in NMP,<br />

the intramolecular imidation preferentially proceeds at 180°C, but intermolecular imidation<br />

scarcely proceeds.<br />

On the other hand, by post-heating at 260°C, the crosslinking reaction proceeds by the<br />

intermolecular imidation <strong>of</strong> terminal carboxyl groups <strong>of</strong> PAI with remaining amic-acid<br />

structure (Eq. [13.4.4]) and the amide bond in main chain <strong>of</strong> PAI (Eq. [13.4.5]) to give the<br />

insoluble part in NMP. The reaction induced the increase <strong>of</strong> imide bond content <strong>of</strong> PAI after<br />

post-heating. The increase <strong>of</strong> amide bond after post-heating may be due to the formation <strong>of</strong><br />

crosslinking structure by the amidation <strong>of</strong> terminal amino groups <strong>of</strong> PAI with carboxyl<br />

groups <strong>of</strong> PAI in main chain (Eq. [13.4.5]-[13.4.8]).<br />

Therefore, PAI obtained from the heating <strong>of</strong> PAAA obtained in MEK/water mixed<br />

solvent, which has many carboxyl groups, produces more insoluble part by post-heating.<br />

Figure 13.4.2 shows the effect <strong>of</strong> heating temperature on the curing <strong>of</strong> PAI obtained by<br />

heating <strong>of</strong> PAAA at 180°C in MEK/water mixed solvent and DMAc. As shown in Figure<br />

13.4.2, by post-heating at 280°C for2hinair, insoluble part in NMP reached 100%, indicating<br />

the almost complete curing <strong>of</strong> PAIs. It is interesting to note that PAIs formed by heating<br />

<strong>of</strong> PAAA obtained in MEK/water mixed solvent (PAI-1 and PAI-3) were found to be cured

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