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Handbook of Solvents - George Wypych - ChemTech - Ventech!

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14.8 Electronic industry 919<br />

14.8.6 COST COMPARISON OF DIFFERENT CLEANING PROCESSES<br />

Figure 14.8.18. Comparison <strong>of</strong> overall process costs between different cleaning<br />

processes.<br />

Long-term cost analysis<br />

experience on different<br />

cleaning processes have<br />

been summarized in Figure<br />

14.8.18 which describes<br />

the overall<br />

process costs <strong>of</strong> the different<br />

cleaning applications<br />

discussed.<br />

Whereby the overall process<br />

costs are divided<br />

into four main sections:<br />

• Investment costs,<br />

• Costs for the cleaning<br />

agent,<br />

• Costs for the disposal<br />

<strong>of</strong> used media/ recycling cost, and<br />

• Energy costs.<br />

By analyzing the numbers, the following key conclusions on the different cleaning<br />

processes are substantial:<br />

• The total annual process costs are always connected with the throughput, but not<br />

necessarily in a linear function.<br />

• The lowest investment costs can be achieved by using an aqueous-based or Novec TM<br />

HFE-cosolvent cleaning process.<br />

• Closed vapor degreasing and Novec TM HFE-cosolvent processes are more<br />

competitive regarding waste disposal.<br />

• A water-based cleaning process is the most competitive regarding media costs.<br />

REFERENCES<br />

1 C. J. Tautscher, Effects on Electronic Products, Marcel Dekker Inc., New York, 1991.<br />

2 M. Hanek, System integration in Micro Electronics, Tutorial 4, Nürnberg, May 4-6, 1999.<br />

3 N. Loew, EPP Europe, 10 ,44 (1999).<br />

4 M. Hanek, R. Schreinert, Galvanotechnik, 83, 1370 (1992).<br />

5 F. Cala, A. E. Winston, <strong>Handbook</strong> <strong>of</strong> Aqueous Cleaning Technology for Electronic Assemblies,<br />

Elektrochemical Publications Ltd., Ashai House, Church Road, Port Erin, Isle <strong>of</strong> Man, British Isles, 1996.<br />

6 N. Loew, EPP Europe, 1/2, 24 (2000).<br />

7 S. J. Sackinger, F. G. Yost, Material Technology, 9, 58 (1994).<br />

8 J.M. Price, Proceedings Nepcon East`94, 365 (1994).<br />

9 B. N. Ellis, Cleaning and Contamination <strong>of</strong> Electronics Components and Assemblies, Electrochemical<br />

Publications Ltd, Port Erin, Isle <strong>of</strong> Man, British Isles, 1986.<br />

10 B. N. Ellis, Circuit World, 19, 1, (1992).<br />

11 http:\\www.Kyzen.com.<br />

12 M. Hanek, N. Loew, Unveröffentliche Ergebnisse, Dr. Wack Chemie, Ingolstadt, Germany, 1999.<br />

13 M. E. Hayes, R. E. Miller, US Patent No. 4,640,719, 1987.<br />

14 L.Futch, K. R. Hrebenar, M. E. Hayes, US Patent No. 4,934,391, 1990.<br />

15 M. Hanek, O. K. Wack, Patent No. 0587917, 1995.<br />

16 K. Lessmann, Proceedings, Nepcon West `94, 2219 (1994).<br />

17 H. Gruebel, Galvanotechnik, 87, (1996).<br />

18 M. Hanek, Productronic, 11, 39, 1997.<br />

19 P.Schlossarek, Surface Mount Technology, 7, (1994).

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