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Handbook of Solvents - George Wypych - ChemTech - Ventech!

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14.1 Adhesives and sealants 851<br />

tured with solvents for shoes, food packaging, and textile and plastic film lamination.<br />

Current technologies use TPU in the form <strong>of</strong> a hot melt, as a reactive PUR and as a thermoplastic<br />

laminating film. 3 Reactive hot-melts were first introduced in the early 1980s and<br />

since than have grown very rapidly. After application the adhesive is cured by moisture. 14<br />

These adhesives are already in use by the automotive industry (bonding carpet to door panels,<br />

tray assembly, lenses to headlamp housing, and lamination <strong>of</strong> foam to fabric) and in furniture<br />

and building products (moldings, picture frames, decorative foil, edgebanding), in<br />

bookbinding, and in the footwear industry. Polyurethane water dispersions are expected to<br />

grow 8-10%/year from the current 5,000-6,000 tones/year market in Europe. 14 Applications<br />

are similar to those <strong>of</strong> hot melts.<br />

UV-curable pressure-sensitive adhesives are the most recent application <strong>of</strong> the advancing<br />

radiation curing technology. 16 Low viscosity formulations allow the use <strong>of</strong> standard<br />

application techniques with several advantages such as improved production rate, energy<br />

efficiency, improved properties <strong>of</strong> the final products, and new potential applications for<br />

pressure-sensitive additives in thicker films with mechanical performance. It is expected<br />

that radiation cured materials will expand at a rate <strong>of</strong> 10%/year. 17 Adhesives constitute 16%<br />

by value and 13% by volume <strong>of</strong> radiation cured products (two major applications for radiation<br />

cured materials are coatings and inks). Henkel introduced a series <strong>of</strong> water-based laminating<br />

adhesives. 18 Hot melt systems, high-solids solvent systems with a 3 times higher<br />

solids content, and water based adhesives have been introduced to textile lamination to replace<br />

traditional low-solids solvent-based adhesives. 19<br />

Odor elimination is the additional benefit which has helped to drive the replacement <strong>of</strong><br />

solvent-based systems. 20 In packaging materials, most odors are related to the solvents used<br />

in inks, coatings and adhesives. Also, coalescing solvents from water-based systems caused<br />

odors. Elimination <strong>of</strong> solvent is a priority but solvent replacement may also change the response<br />

to the odor because solvents such as toluene and xylene smell like lubricating oils or<br />

turpentine whereas isopropanol smells more like a disinfectant. Odors stem not only from<br />

solvents but also from products <strong>of</strong> the thermal and UV degradation <strong>of</strong> other components and<br />

solvents. 20<br />

In view <strong>of</strong> the above efforts, it is surprising that the majority <strong>of</strong> recent patents on adhesives<br />

are for solvent-based systems. 21-26 The new inventions include a universal primer, 21 an<br />

adhesive composition in which solvents have been selected based on Snyder’s polarity<br />

(only solvents which belong to group III are useful in adhesive for automotive applications<br />

to avoid a deleterious effect on paint), 22 a low VOC adhesive for pipes and fittings, 23 a solvent-containing<br />

heat-resistant adhesive based on siloxane polyimide, 24 a water-based<br />

polyimide adhesive, 25 and two-component solvent-free polyurethane adhesive system for<br />

use in automotive door paneling. 26<br />

REFERENCES<br />

1 R Vabrik, G Lepenye, I Tury, I Rusznak, A Vig, International Polym. Sci. Technol., 25, No.3, T/1-9<br />

(1998).<br />

2 D Raftery, M R Smyth, R G Leonard, International J. Adhesion Adhesives, 17, No.4, 349-52 (1997).<br />

3 J B Samms, L Johnson, J. Adhesive Sealant Coun., Spring 1998. Conference proceedings, Adhesive &<br />

Sealant Council, Orlando, Fl., 22nd-25th March 1998, p. 87.<br />

4 A Stevenson, D Del Vechio, N Heiburg, Simpson R, Eur. Rubber J., 181, 1, 2829, (1999).<br />

5 K Menzefricke, Adhesive Technol., 15, No.1, 6-7 (1998).<br />

6 L White, Eur. Rubber J., 179, No.4, 24-5 (1997).<br />

7 J Baker, Eur. Chem. News, 69, No.1830, 20-2 (1998).

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