Geode GXLV Processor Series Low Power Integrated x86 Solutions

More documents

Recommendations

Info

Geode GXLV Processor Series6.0 Electrical SpecificationsThis section provides information on electrical connections,absolute maximum ratings, operating conditions,DC characteristics, and AC characteristics for the GeodeGXLV processor series. All voltage values in the electricalspecifications are with respect to V SS unless otherwisenoted. For detailed information on the PCI bus electricalspecification refer to Chapter 4 of the PCI Bus Specification,Revision 2.1.6.1 PART NUMBERS/PERFORMANCE CHARACTERISTICSThe GXLV series of processors is designated by threecore voltage specifications: 2.9V, 2.5V, and 2.2V. Eachcore voltage is offered in frequencies that are enabled byspecific system clock and internal multiplier settings. Thisallows the user to select the device(s) that best fit theirpower and performance requirements. This flexibilitymakes the GXLV processor series ideally suited for applicationswhere power consumption and performance(speed) are equally important.The part numbers in Table 6-1 designate the various combinationsof speed and power consumption available.Note that while there are three V CC2 (Core) voltages available,the V CC3 (I/O) voltage remains constant at 3.3V(nominal) in order to maintain LVTTL compatibility withexternal devices.Table 6-1. Performance CharacteristicsPart MarkingCoreVoltage(V CC2 )SystemClockFrequencyMultiplierCoreFrequencyMaximumPowerTypical Power(Note)80% Active IdleGXLV-266P 2.9V 70C 2.9V 33 MHz x8 266 MHz 7.8W 2.50WGXLV-266P2.9V85CGXLV-266B2.9V70CGXLV-266B2.9V85CGXLV-233P 2.5V 85C(Nominal)2.5V 33 MHz x7 233 MHz 5.6W 2.0WGXLV-233B2.5V85CGXLV-200P 2.2V 85C(Nominal)2.2V 33 MHz x6 200 MHz 4.1W 1.5WGXLV-200B2.2V85CGXLV-180P 2.2V 85C(Nominal)30 MHz x6 180 MHz 3.9W 1.25WGXLV-180B2.2V85CGXLV-166P 2.2V 85C 33 MHz x5 166 MHz 3.7W 1.0WGXLV-166B2.2V85CNote: Typical power consumption is defined as an average measured running Windows at 80% Active Idle(Suspend-on-Halt) with a display resolution of 800x600x8 bpp at 75 Hz.www.national.com 184 Revision 1.3
Electrical Specifications (Continued)6.2 ELECTRICAL CONNECTIONS6.2.1 Power/Ground Connections and DecouplingTesting and operating the GXLV processor requires theuse of standard high frequency techniques to reduce parasiticeffects. These effects can be minimized by filteringthe DC power leads with low-inductance decouplingcapacitors, using low-impedance wiring, and by connectingall V CC2 and V CC3 pins to the appropriate voltage levels.6.2.1.1 Power PlanesFigure 6-1 shows layout recommendations for splitting thepower plane between V CC2 (core: 2.2V, 2.5V, 2.9V) andV CC3 (I/O: 3.3V) volts in the BGA package. The illustrationassumes there is one power plane, and no componentson the back of the board.Figure 6-2 shows layout recommendations for splitting thepower plane between V CC2 (core: 2.2V, 2.5V, 2.9V) andV CC3 (I/O: 3.3V) volts in the SPGA package.Geode GXLV Processor Series3.3V Plane(V CC3 )A1 26A2.2V, 2.5V, or 2.9V Plane(V CC2 )3.3V Plane(V CC3 )Geode GXLVProcessor352 BGA - Top View3.3V Plane(V CC3 )2.2V, 2.5V, or 2.9V Plane(V CC2 )AF126AFLegend= High frequency capacitor= 220 µF, low ESR capacitor= 3.3V connection= 2.2V, 2.5V, or 2.9V connection3.3V Plane(V CC3 )Note: Where signals cross plane splits, it is recommended to includeAC decoupling between planes with 47 pF capacitors.Figure 6-1. BGA Recommended Split Power Plane and DecouplingRevision 1.3 185 www.national.com
Page 4 and 5:
Geode GXLV Processor SeriesTable of
Page 6 and 7:
Page 8:
Page 12 and 13:
Geode GXLV Processor SeriesArchitec
Page 15 and 16:
Architecture Overview (Continued)Ge
Page 17 and 18:
Architecture Overview (Continued)SD
Page 19 and 20:
2.0 Signal DefinitionsThis section
Page 21 and 22:
Signal Definitions (Continued)Index
Page 23 and 24:
Signal Definitions (Continued)PinNo
Page 25 and 26:
Signal Definitions (Continued)Table
Page 27 and 28:
Signal Definitions (Continued)PinNo
Page 29 and 30:
Signal Definitions (Continued)Table
Page 31 and 32:
Signal Definitions (Continued)2.2 S
Page 33 and 34:
Signal Definitions (Continued)2.2.2
Page 35 and 36:
Page 37 and 38:
Page 39 and 40:
Page 41 and 42:
3.0 Processor ProgrammingThis secti
Page 43 and 44:
Processor Programming (Continued)3.
Page 45 and 46:
Page 47 and 48:
Page 49 and 50:
Processor Programming (Continued)Bi
Page 51 and 52:
Processor Programming (Continued)Ta
Page 53 and 54:
Page 55 and 56:
Page 57 and 58:
Page 59 and 60:
Page 61 and 62:
Processor Programming (Continued)Th
Page 63 and 64:
Page 65 and 66:
Processor Programming (Continued)Ad
Page 67 and 68:
Page 69 and 70:
Processor Programming (Continued)Se
Page 71 and 72:
Page 73 and 74:
Processor Programming (Continued)TY
Page 75 and 76:
Processor Programming (Continued)Ta
Page 77 and 78:
Page 79 and 80:
Page 81 and 82:
Page 83 and 84:
Page 85 and 86:
Page 87 and 88:
Page 89 and 90:
Processor Programming (Continued)Wh
Page 91 and 92:
Page 93 and 94:
Page 95 and 96:
Page 97 and 98:
Integrated Functions (Continued)4.1
Page 99 and 100:
Page 101 and 102:
Integrated Functions (Continued)Mne
Page 103 and 104:
Page 105 and 106:
Integrated Functions (Continued)Bit
Page 107 and 108:
Page 109 and 110:
Page 111 and 112:
Integrated Functions (Continued)ACT
Page 113 and 114:
Page 115 and 116:
Page 117 and 118:
Page 119 and 120:
Integrated Functions (Continued)Tab
Page 121 and 122:
Integrated Functions (Continued)SDR
Page 123 and 124:
Page 125 and 126:
Page 127 and 128:
Page 129 and 130:
Page 131 and 132:
Page 133 and 134: Integrated Functions (Continued)Bit
Page 135 and 136: Integrated Functions (Continued)4.5
Page 137 and 138: Integrated Functions (Continued).Re
Page 139 and 140: Integrated Functions (Continued)640
Page 143 and 144: Integrated Functions (Continued)GX_
Page 145 and 146: Integrated Functions (Continued)11:
Page 147 and 148: Integrated Functions (Continued)Tab
Page 149 and 150: Integrated Functions (Continued)9:0
Page 163 and 164: Integrated Functions (Continued)Tab
Page 177 and 178: Power Management (Continued)CPU Sus
Page 179 and 180: Power Management (Continued)5.2.2 I
Page 181 and 182: Power Management (Continued)5.3 POW
Page 183: Power Management (Continued)Table 5
Page 187 and 188: Electrical Specifications (Continue
Page 207 and 208: 7.0 Instruction SetThis section sum
Page 209 and 210: Instruction Set (Continued)7.1.2.3
Page 217 and 218: Instruction Set (Continued)Table 7-
Page 219 and 220: Instruction Set (Continued)Instruct
Page 221 and 222: Instruction Set (Continued)JMP Unco
Page 233 and 234: Instruction Set (Continued)7.5 MMX
Page 235 and 236:
Instruction Set (Continued)PCMPEQB
Page 237 and 238:
Instruction Set (Continued)PUNPCKHW
Page 239 and 240:
Instruction Set (Continued)Table 7-
Page 241 and 242:
Package Specifications (Continued)C
Page 243 and 244:
Package Specifications (Continued)8
Page 245 and 246:
Package Specifications (Continued)S
Page 247:
Geode GXLV Processor Series Low Pow
show all

Geode GXLV Processor Series Low Power Integrated x86 Solutions

Create successful ePaper yourself

Delete template?

Save as template?