Geode GXLV Processor Series Low Power Integrated x86 Solutions

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Geode GXLV Processor SeriesPackage Specifications (Continued)Example 1Assume P (max) = 5W and T A (max) = 40°C.Therefore:T C– T Aθ CA= ---------------------P( 85 – 40)θ CA= ----------------------5θ = 9 CAExample 2Assume P (max) = 10W and T A (max) = 40°C.Therefore:T C– T Aθ CA= ---------------------P( 85 – 40)θ CA= ----------------------9θ = 5 CAIn this case, the heatsink under consideration is more thanadequate since at 5W worst case, it can maintain a 40°Ccase temperature rise above ambient (θ CA =9)whenamaximum of 45°C (θ CA = 8) is required.In this case, the heatsink under consideration is NOT adequateto maintain the 45°C case temperature rise aboveambient for a 9W processor.For more information on thermal design considerations orheatsink properties, refer to the Product Selection Guide ofany leading vendor of thermal engineering solutions.www.national.com 242 Revision 1.3
Package Specifications (Continued)8.2 MECHANICAL PACKAGE OUTLINESDimensions for the BGA package are shown in Figure 8-2. Figure 8-3 shows the SPGA dimensions. Table 8-3 gives thelegend for the symbols used in both package outlines..889REF.DD1S1SeatingPlaneZaaa ZGeode GXLV Processor SeriesDE1B1.51.5A1A2AMillimetersInchesD2SymMin Max Min MaxA 1.45 2.23 0.057 0.088A1 0.50 0.70 0.020 0.028A2 0.43 0.83 0.017 0.033aaa 0.20 0.008B 0.60 0.90 0.024 0.035D 34.80 35.20 1.370 1.386D1 31.55 31.95 1.242 1.258D2 32.80 35.20 1.291 1.386E1 1.12 1.42 0.044 0.056F 0.35 0.014S1 1.42 1.82 0.056 0.072FCU HeatSpreaderA01 Index Chamfer1.5mmonaside45 Degree AngleFigure 8-2. 352-Terminal BGA Mechanical Package OutlineRevision 1.3 243 www.national.com
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Architecture Overview (Continued)Ge
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2.0 Signal DefinitionsThis section
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Power Management (Continued)5.2.2 I
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Geode GXLV Processor Series Low Power Integrated x86 Solutions

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