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Geode GXLV Processor Series Low Power Integrated x86 Solutions

Geode GXLV Processor Series Low Power Integrated x86 Solutions

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Package Specifications (Continued)SymbolAA1A2aaaBDD1D2E1E2FLS1MeaningTable 8-3. Mechanical Package Outline LegendDistance from seating plane datum to highest point of bodySolder ball heightLaminate thickness (excluding heat spreader)CoplanarityPin or solder ball diameterLargest overall package outline dimensionLength from outer pin center to outer pin centerHeat spreader outline dimensionBGA: Solder ball pitchSPGA: Linear spacing between true pin position centerlinesDiagonal spacing between true pin position centerlinesFlatnessDistance from seating plane to tip of pinLength from outer pin/ball center to edge of laminate<strong>Geode</strong> <strong>GXLV</strong> <strong>Processor</strong> <strong>Series</strong>Revision 1.3 245 www.national.com

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