ITT - Index of

INTEGRATED CIRCUITS DICE AND WAFERS
All ITT integrated circuits are available both in wafer and in chip
form. Since the completed individual encapsulated product is·
capable of being more extensively and thoroughly tested than the
wafer, these specifications are limited to the capability of the chip
and the attendant testing equipment.
USE
DTL and Linear circuits are normally supplied with plain
backing. Gold backing can be furnished upon special
request. All other circuits are supplied with gold backing.
Recommended die attach temperature Is 420·C for either
type of backing. A 98% gold, 2% silicon preform is
recommended for die attach with all plain-backed chips.
One mil aluminum wire, ultrasonically bonded to the pads,
is recommended for connecting the chip to the circuit.
PACKAGING FOR SHIPMENT
Wafers will be shipped in the plastic package shown.
Chips will be packaged in carriers as indicated.
I. C. WAFER PACKAGE
IDENTIFICATION
All integrated circuit dice will be identified by the
appropriate three or four-digit code, together with the
individual suffix number indicating the temperature range.
For example, a 930 limited-temperature range chip would
be a "930-5." A 930 full-temperature range chip would be a
"930-1."
CHIP PACKAGE
MIL AND HI-REL SEMICONDUCTORS
Virtually all ITT Semiconductors are available with
hi-rei processing. IC's, for example, can be processed
for any portions of, or all of, MIL-STO-883 and
MIL38510. Many diodes and transistors are available
as JAN, JAN/TX, or MI L types.
Whenever you need hi-rei semiconductors, check
ITT. Your local representative can give up-to-date
information on availability, price, etc.
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