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HIGH RELIABILITY PROCESSING<br />

METHODS ARE MIL STD 883<br />

3.1.9 Burn-In<br />

SCREEN<br />

[Spec Paragraph)<br />

3.1.10 Critical Elect. Para.<br />

(Go-No-Go or Datalog)<br />

3.1.11 HTRB<br />

3.1.12 Final Elect. Test<br />

(a) D.C. @ 25 C<br />

(b) D.C. @ Hi/Low Temp.<br />

(c) A.C. Para. @ 25 C<br />

(d) Functional Tests<br />

3.1.13 Radiographic Insp.<br />

3.1.14 Qualification and Quality<br />

Conformance Procedures<br />

3.1.15 External Visual<br />

CLASS "A"<br />

[Methods)<br />

1015125 C<br />

for 240 hours<br />

Per Elect. Spec.<br />

72 hrs@ 150 C<br />

Per Spec.<br />

Per Spec.<br />

Per Spec.<br />

Per Spec.<br />

Method 2012<br />

5005<br />

2009<br />

CLASS"B" CfLASS"B4" CLASS"C"<br />

[Methods) [Methods) [Methods)<br />

1015125 C 1015125 C None<br />

for 168 hours for 168 hours<br />

None None None<br />

None None None<br />

Per Spec'. Per Spec. Per Spec.<br />

None Per Spec. None<br />

Per Spec. Per Spec. None<br />

Per Spec. Per Spec. Per Spec.<br />

None None None<br />

5005 5005 5005<br />

2009 2009 2009<br />

Optional Additions.<br />

Class A<br />

All Classes<br />

All Classes<br />

All Classes<br />

- Scanning Electron<br />

Microscope Wafer<br />

Inspection<br />

- Read and Record Data (DC at<br />

Temperature) With Delta<br />

Calculations as Required<br />

- Switching Measurements at<br />

Temperature Extremes with<br />

Data<br />

- Lot Conformance Testing<br />

(Life Tests) and Generic<br />

Reliability Data.<br />

Classes A & B - Elevated Temperature,<br />

Burn-in.<br />

Through QPL 38510-11 dated 16 July, 1973,<br />

<strong>ITT</strong> qualificatic;m status is as follows:<br />

1) Full.Qualified Part I<br />

5400 5405<br />

5401 5410<br />

5402 5420<br />

5403 5430<br />

5404 5440<br />

545Q<br />

5451<br />

5453<br />

5454<br />

5470<br />

5472<br />

5473<br />

5474<br />

5486<br />

54H30<br />

------'TOTAL 20'-----<br />

Packages<br />

A -1/4 x 114 Flatpack<br />

C-14pinDip<br />

Lead Finishes<br />

, --A Package - A - Solder Dipped<br />

B - Tin Plated '<br />

C - Gold '<br />

C Package - B - Tin Plated<br />

C - Gold<br />

MIL 38510- JAN MICROCIRCUITS<br />

<strong>ITT</strong> also <strong>of</strong>fers a broad line <strong>of</strong> fully qualified<br />

MIL-38510 microcircuits. At this writing, 20<br />

devices are fully qualified and qualification<br />

plans are in process for an additional 21 types.<br />

The rigorous life qualification test are<br />

conducted in full compliance to Method 5005 <strong>of</strong><br />

MIL 883 and are available on all ceramic and<br />

. metal can integrated circuits.<br />

1-2<br />

2) Interim Qualification Part II<br />

5482 5407 54H72 54H10* .<br />

5483 5417 54H73 54HOO*<br />

5406 5442 54H30' 54H04*<br />

5416 54121 54H20'<br />

--------TOTAL 15---------<br />

These qualifications are rigorously controlled<br />

by the Defense Electronics Supply Center,<br />

Dayton, Ohio .<br />

• Flat Pack Only I

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