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<strong>ITT</strong><br />

DTLDUAL FOUR-INPUT GATE<br />

FAST DTL DUAL FOUR-INPUT GATE<br />

<strong>ITT</strong>930<br />

<strong>ITT</strong>961<br />

..... -----<br />

SEMICONDUCTORS<br />

DTl DUAL<br />

FOUR-INPUT ·GATE<br />

fAST DTl DUAL<br />

fOUR-I·NPUT GATE<br />

Package:. Dual In~Line and Flat Pack<br />

The <strong>ITT</strong>930 and <strong>ITT</strong>961 elements are dual<br />

four-input NAND/NOR gates.<br />

In addition to performing the positive NAND and<br />

negative NOR logic functions. the gates can be<br />

cross-coupled to form a flip-flop or the outputs can<br />

be tied together to perform the "wired OR"<br />

function. Both gate inputs may be extended using<br />

<strong>ITT</strong>933 elements to allow increased fan-in.<br />

The <strong>ITT</strong>930 im;orporates a 6K output pull-up<br />

resistor which allows for a fan-out <strong>of</strong> up to 8 DTL<br />

loads.<br />

The <strong>ITT</strong>961 incorporates a 2 K output pull-up<br />

resistor which typically results in a 30% faster rise<br />

time with capacitive loads at a fan-out <strong>of</strong> up to 7<br />

DTL loads.<br />

ABSOLUTE MAXIMUM RATINGS 1<br />

Characteristics<br />

UnitS<br />

Supply Voltage (Vcd. -55°C to +125°C.<br />

Continuous ................................... -.5 to +B.O Volts<br />

Supply Voltage (V cd. Pulsed. < 1 sec .... + 12 Volts<br />

Output Current. Into Outputs ........................... 30 rnA<br />

Input Forward Current ................................... -10 rnA<br />

Input Reverse Current .......................................... 1 rnA<br />

Operating Temperature ................... -55 to + 125°C<br />

Storage Temperature ...................... -65 to + 150°C<br />

Operating Junqtion Temperature 2 •...••••.••.•.• + 175°C<br />

Input Voltage Applied to Input. -1.5 to +5.5 Volts<br />

Lead Temp. (soldering. 60 sec.) ....................... 300° F<br />

NOTES:<br />

1. Above which useful life may be impaired.<br />

2. Allow 300·C/Watt OJ-A for 1/4". x 1/4".<br />

flatpack and dual in-line. Allow 50·C/Watt<br />

OJ-C for TO-5; 180·C/Watt OJ-C for 1/4"<br />

x 1/4" flatpack and dual in-line. Heat removal<br />

in 1/4" x 1/4" flatpack is highly dependent<br />

upon contact surfaces or air flow and on lead<br />

attachment and thermal paths thru leads, as<br />

well as number <strong>of</strong> soldered leads.<br />

Pinout: Dual In-Line and Flat Pack<br />

A o-II

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