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<strong>ITT</strong><br />

DTL QUAD TWO-INPUT AND GATE ITI1806<br />

. FAST DTL QUAD TWO-INPUT AND GATE ITI1807<br />

- -----<br />

SEMICONDUCTORS<br />

Dll QUAD TWO­<br />

INPUT AND GATE<br />

FAST OTL QUAD<br />

TWO-INPUT AND GATE<br />

Package: Dual In-Line and Flat Pack<br />

The <strong>ITT</strong>1806 and 1807 perform the logical AND<br />

function. Thus the device can be used to<br />

expand the inputs <strong>of</strong> other DTL NAND, OR, or<br />

NOR gates, or flip flops, greatly simplifying<br />

logic design. As with all <strong>ITT</strong> DTL gates, the<br />

outputs can be tied together to perform the<br />

wire-AND function.<br />

Pinout: Dual In-Line and Flat Pack<br />

the <strong>ITT</strong>1806 incorporates a 6K output pull-up<br />

resistor which .allows for a fan-out <strong>of</strong> up to 8<br />

DTL loads.<br />

The <strong>ITT</strong>1807 incorporates a 2K output pull-up<br />

resistor which typically results in a 30% faster<br />

rise time witli capacitive loads at a fan-out <strong>of</strong><br />

up to 7DTL loads.<br />

SCHEMATIC DIAGRAM -.EACH GATE<br />

Vee<br />

ABSOLUTE MAXIMUM RATINGS'<br />

Characteristics<br />

Units<br />

1.75K<br />

Supply Voltage (VCe), -55°C to +125°C,<br />

Continuous ................................... -.5 to +8.0 Volts<br />

Supply Voltage (VCC), Pulsed,< 1 sec .... + 12 Volts<br />

Output Current. Into Outputs ........................... 30 mA<br />

Input Forward Current ................................... -1 0 mA<br />

Input Reverse Current .......................................... 1 mA<br />

Operating Temperature ................... -55 to + 125°C<br />

Storage Temperature ...................... -65 to + 150°C<br />

Operating Junction Temperature 2 ............... + 175°C<br />

Input Voltage Applied to Input. -1.5 to +5.5 Volts<br />

Lead Temp. (soldering, 60 sec.) ....................... 300° F<br />

NOTES:<br />

1. Above which useful life may be impaired.<br />

2. Allow 300·C/Watt OJ-A for 1/4" x 1/4"<br />

flatpack and dual in-line. Allow 50·C/Watt<br />

OJ-C for TO-5; 180·C/Watt OJ-C for 1/4"<br />

x 114" flatpack and dual in-line. Heat removal<br />

in 1/4" x 1/4" flatpack is highly dependent<br />

upon contact surfaces or air flow and on lead<br />

attachment and thermal paths thru leads, as<br />

well as number <strong>of</strong> soldered leads.<br />

A<br />

B<br />

2K<br />

5K<br />

RI = 6K FOR IB06<br />

R = 2K FOR 1807<br />

c<br />

GND<br />

4-28

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