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_ <strong>ITT</strong> _________<br />

<strong>ITT</strong>1800<br />

~DIlliT~L-D-U~A~L~F~I""'!""!"VE _IN_P~U~T~G~A~T-.-E<br />

SEMICONDUCTORS<br />

Package: Dual In-Line and Flat Pack<br />

DTL DUAL FIVE<br />

INPUT GATE<br />

The <strong>ITT</strong>1800 is a dual five input NAND/NOR gate.<br />

The device is similar to the <strong>ITT</strong>930 in all respects,<br />

except for the replacement <strong>of</strong> the expander node<br />

with a standard input diode.<br />

ABSOLUTE MAXIMUM RATINGS'<br />

Characteristics<br />

Units<br />

Pinout: Dual In-Line and Flat Pack<br />

Supply Voltage (VCC). -55°C to<br />

+ 125°C. Continuous ............................... -5 to +8 Volts<br />

Supply Voltage (VCe). Pulsed.< 1 ..................... + i 2 Volts<br />

Output Current. Into Outputs ..................................... 30 mA<br />

Input Forward Current ............................................. -10 mA<br />

Input Reverse Current .................................................... 1 mA<br />

Operating Temperature ............................ -55 to +125 °c<br />

Storage Temperature ............................... -65 to + 150°C<br />

Operating Junction Temperature2 ........................ + 175°C<br />

Input Voltage Applied to Input.. .......... -1.5 to +5.5 Volts<br />

Lead Temperature (soldering •. 60 sec ....................... 300 ° F<br />

A 0-+::1-'''"-1:.<br />

B<br />

C<br />

o<br />

E<br />

CIRCUIT SCHEMATIC<br />

..;r""I>!--- H<br />

A--riCl-'<br />

I<br />

J<br />

,K<br />

L<br />

TYPICAL<br />

RESISTOR<br />

VALUES<br />

R,=2.0K<br />

R2= 1.75 K<br />

R3=5.0 K<br />

R4=6.0 K<br />

NOTES:<br />

1. Above which useful life may be impaired.<br />

2. Allow 300·e/Watt OJ-A for 1/4" x 1/4"<br />

flatpack and dual in-line. Allow 50·e/Watt<br />

OJ-C for TO-5; lBO·e/Watt OJ-C for 1/4"<br />

x 1/4" flat pack and dual in-line. Heat removal<br />

in 1/4" x 1/4" flatpack is highly dependent<br />

upon contact surfaces or air flow and on lead<br />

attachment and thermal paths thru leads, as<br />

well as number <strong>of</strong> soldered leads.<br />

4-26

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