SIMPLORER User Manual V6.0 - FER-a

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126 Modeling with Circuit Components
Thermal Semiconductor Model
The structure of the thermal model is shown below.
If the built-in model is not sufficient for the simulation purpose, it is possible to use the model
output PEL to control a current source in a more complex thermal network. The simulated
junction temperature from this network can be fed into the electrical model. In this case
TYPE_THERM = 0 has to be set.
The thermal behavior can be defined with the parameter TYP_THERM. There are three levels
of the thermal behavior:
TYPE_THERM = 0
The junction temperature is set to the ambient temperature (Parameter 'TEMPAMB'). All temperature
dependent semiconductor parameters are re-calculated according to this temperature.
TYPE_THERM=1
The junction and case temperatures are influenced by the internal losses and the thermal resistances.
All thermal capacitances are ignored (static thermal model).
TYPE_THERM=2
The temperatures are calculated using a dynamic thermal model taking into account all thermal
resistances and capacitances.
Component Parameters TYPE THERM=0
Description [Unit] Parameter Name Data Type
Ambient Temperature [°C] TEMPAMB real
Component Parameters TYPE THERM=1 (+ Parameters of TYPE THERM=0)
Description [Unit] Parameter Name Data Type
Thermal Intrinsic Resistance [K/W] R_THERM_I real
Thermal Resistance Chip to Case [K/W] R_THERM_C real
Component Parameters TYPE THERM=2 (+ Parameters of TYPE THERM=0 and THERM=1)
Description [Unit] Parameter Name Data Type
Junction Temperature at Simulation Start [°C] TEMPJNCT0 real
Thermal Junction Capacitance [Ws/K] C_THERM_J real
Thermal Intrinsic Capacitance [Ws/K] C_THERM_I real
Thermal Ambient Capacitance [Ws/K] C_THERM_AMB real