MMC2107 - Freescale Semiconductor

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Mechanical Specifications Freescale Semiconductor, Inc. 23.3 Bond Pins nc... Freescale Semiconductor, I The MMC2107 die has a total of 144 bond pads. Of these, the pads that are not bonded out in the 100-pin package are distributed around the circumference of the die. This optional group of pins includes: A[22:0] R/W EB[3:0] CSE[1:0] TC[2:0] OE CS[3:0] 3 x V DD 3 x V SS For more detailed information, see Section 4. Signal Description. Technical Data MMC2107 – Rev. 2.0 610 Mechanical Specifications MOTOROLA For More Information On This Product, Go to: www.freescale.com
Freescale Semiconductor, Inc. Mechanical Specifications Package Information for the 144-Pin LQFP 23.4 Package Information for the 144-Pin LQFP nc... Freescale Semiconductor, I The production 144-pin package characteristics are: • Joint-Electron Device Engineering Council (JEDEC) standard • Low-profile quad flat pack (LQFP) • Dimension: 20 x 20 mm • Lead pitch: 0.5 mm • Thin: 1.4 mm • Case number: 918-03 • Clam shell socket: Yamaichi part #IC51-1444-1354 • Open face socket: Yamaichi part #IC201-1444-034 23.5 Package Information for the 100-Pin LQFP The production 100-pin package characteristics are: • JEDEC standard • Low-profile quad flat pack (LQFP) • Dimension: 14 x 14 mm • Lead pitch: 0.5 mm • Thin: 1.4 mm • Case number: 983-02 • Clam shell socket: Yamaichi part #IC51-1004-809 • Open face socket: Yamaichi part #IC201-1004-008 MMC2107 – Rev. 2.0 Technical Data MOTOROLA Mechanical Specifications 611 For More Information On This Product, Go to: www.freescale.com
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MMC2107 - Freescale Semiconductor

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