The PLA at Home and Abroad - Strategic Studies Institute - U.S. Army

Edge: Assessing the Role of High-end Talent, New York: Cambridge
University Press, 2009.
2. Hu Jintao (胡锦涛),“Report to the 17th CCP National Congress,”
Xinhua News Agency, October 24, 2007, available from
news.xinhuanet.com/newscenter/2007-10/24/content_6938568_8.
htm; The White Paper of China’s Defense in 2008(2008年中国的国
防), State Council Information Office of China (国务院新闻办公
室), January 2009, available from www.gov.cn/zwgk/2009-01/20/
content_1210224.htm; “国家中长期科技发展规划纲要2006年-2020
年” (“National Medium and Long Science and Technology Development
Plans 2006-2020”), State Council of China, 2006, available
from www.most.gov.cn/kjgh/; “Eleventh Five-Year Development
and Reform Thoughts of National Defense Science and Technology
Industry,” State Council of China, 2006, available from www.
china-spacenews.com/n435777/n435778/n435790/29083.html. There
are dozens of related articles published in the past 30 years. For
instance, Liang Jun, Yuan Lin, “着眼核心军事能力建设,大力推
进武器装备发展” (“Building a Core Military Capacity, Promoting
Weapon Equipment Development”), 国防科技工业 (National
Defense S&T Industry), Issue 3, 2009. Also see Ren Haiping, “寓
军于民,统筹经济与国防建设的大趋势” (“On the Integration of
Military Industry with Civilian Industry”), 军事经济研究 (Military
Economic Research), Issue 2, 2005.
3. Includes the 11th FYP Defense White Papers and MLP for Science,
Technology and Industry for National Defense; “Hu Jintao’s
Report to the 17th Party Congress,” Xinhua News Agency, October
24, 2007, available from news.xinhuanet.com/newscenter/2007-10/24/
content_6938568_8.htm; The White Paper of China’s Defense in 2008,
State Council Information Office of China, January 2009, available
from www.gov.cn/zwgk/2009-01/20/content_1210224.htm; “National
Medium and Long Science and Technology Development Plans,
2006-2020,” State Council of China, 2006, available from www.
most.gov.cn/kjgh/; “Eleventh Five-Year Development and Reform
Thoughts of National Defense Science and Technology Industry,”
State Council of China, 2006.
4. The core electronic components are high-end general chips,
basic software, ultra large-scale integrated circuit manufacturing
technology, next-generation broadband wireless mobile communications,
high-end CNC machine tools, basic manufacturing
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