Bulletin 2010/35 - European Patent Office
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(H01L) I.1(2)<br />

(51) H01L 23/367 (11) 2 224 480 A1<br />

(25) En (26) En<br />

(21) 09153656.5 (22) 25.02.2009<br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MK MT<br />

NL NO PL PT RO SE SI SK TR<br />

AL BA RS<br />

(54) • Verbesserte Struktur eines Kühlkörpers<br />

• The Improved Structure of a Radiator<br />

• Structure améliorée d'un radiateur<br />

(71) Chen, Te-Lung, No. 2, Alley 492, Hai Tien<br />

Road, Tainan City 709, CN<br />

(72) Chen, Te-Lung, Tainan City 709, CN<br />

(74) Lösch, Christoph Ludwig Klaus, Äussere<br />

Bayreuther Straße 230, 90411 Nürnberg, DE<br />

H01L 23/367 → (51) F28F 3/02<br />

(51) H01L 23/373 (11) 2 224 481 A1<br />

(25) En (26) En<br />

(21) 10152477.5 (22) 03.02.<strong>2010</strong><br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MK MT<br />

NL NO PL PT RO SE SI SK SM TR<br />

AL BA RS<br />

(30) 04.02.2009 JP 2009024167<br />

(54) • Halbleiterbauelement<br />

• Semiconductor device<br />

• Dispositif semi-conducteur<br />

(71) Kabushiki Kaisha Toyota Jidoshokki, 2-1,<br />

Toyoda-cho, Kariya-shi, Aichi 448-8671, JP<br />

(72) Mori, Shogo, Kariya-shi, Aichi 448-8671, JP<br />

Kono, Eiji, Kariya-shi, Aichi 448-8671, JP<br />

Toh, Keiji, Kariya-shi, Aichi 448-8671, JP<br />

(74) TBK-<strong>Patent</strong>, Bavariaring 4-6, 80336<br />

München, DE<br />

H01L 23/467 → (51) F28F 3/02<br />

H01L 23/49 → (51) H01L 31/0224<br />

(51) H01L 23/495 (11) 2 224 482 A2<br />

G06K 9/20<br />

(25) En (26) En<br />

(21) 09177264.0 (22) 26.11.2009<br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MK MT<br />

NL NO PL PT RO SE SI SK SM TR<br />

AL BA RS<br />

(30) 27.11.2008 US 324869<br />

(54) • Integrierter Trägerrahmen und Einfassungsstruktur<br />

sowie daraus hergestellte<br />

Vorrichtung<br />

• Integrated leadframe and bezel structure<br />

and device formed from same<br />

• Structure de boîtier et grille de connexion<br />

intégrée et dispositif formé à partir de celleci<br />

(71) UPEK, Inc., 5900 Christie Avenue, Emeryville,<br />

CA 94608, US<br />

(72) Bond, Robert Henry, Oakland, CA 96411, US<br />

Kramer, Alan, Berkeley, CA 94708, US<br />

Gozzini, Giovanni, Berkeley, CA 94708, US<br />

(74) Freeman, Jacqueline Carol, W.P.Thompson<br />

& Co. 55 Drury Lane, London WC2B 5SQ,<br />

GB<br />

H01L 23/52 → (51) H01L 21/3205<br />

H01L 23/60 → (51) H01L 25/16<br />

H01L 23/66 → (51) H03F 1/56<br />

(51) H01L 25/065 (11) 2 224 483 A1<br />

C09J 4/00 C09J 179/08<br />

H01L 21/52 H01L 25/07<br />

H01L 25/18<br />

Europäisches <strong>Patent</strong>blatt<br />

<strong>European</strong> <strong>Patent</strong> <strong>Bulletin</strong><br />

<strong>Bulletin</strong> européen des brevets<br />

(25) Ja (26) En<br />

(21) 08856532.0 (22) 02.12.2008<br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MT NL<br />

NO PL PT RO SE SI SK TR<br />

AL BA MK RS<br />

(86) JP 2008/071882 02.12.2008<br />

(87) WO 2009/072492 2009/24 11.06.2009<br />

(30) 04.12.2007 JP 2007313886<br />

(54) • LICHTEMPFINDLICHER KLEBSTOFF<br />

• PHOTOSENSITIVE ADHESIVE<br />

• ADHÉSIF PHOTOSENSIBLE<br />

(71) Hitachi Chemical Company, Ltd., 1-1, Nishi-<br />

Shinjuku 2-chome Shinjuku-ku, Tokyo 163-<br />

0449, JP<br />

(72) MASUKO, Takashi, Tsukuba-shi Ibaraki 300-<br />

4247, JP<br />

KAWAMORI, Takashi, Tsukuba-shi Ibaraki<br />

300-4247, JP<br />

MITSUKURA, Kazuyuki, Tsukuba-shi Ibaraki<br />

300-4247, JP<br />

KATOGI, Shigeki, Tsukuba-shi Ibaraki 300-<br />

4247, JP<br />

(74) von Kreisler Selting Werner, Deichmannhaus<br />

am Dom Bahnhofsvorplatz 1, 50667 Köln,<br />

DE<br />

(51) H01L 25/07 (11) 2 224 484 A1<br />

H01L 25/18<br />

(25) Ja (26) En<br />

(21) 08865477.7 (22) 28.11.2008<br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MT NL<br />

NO PL PT RO SE SI SK TR<br />

AL BA MK RS<br />

(86) JP 2008/071605 28.11.2008<br />

(87) WO 2009/081689 2009/27 02.07.2009<br />

(30) 25.12.2007 JP 2007331<strong>35</strong>3<br />

(54) • HALBLEITERMODUL<br />

• SEMICONDUCTOR MODULE<br />

• MODULE SEMI-CONDUCTEUR<br />

(71) Toyota Jidosha Kabushiki Kaisha, 1 Toyotacho,<br />

Toyota-shi, Aichi 471-8571, JP<br />

(72) OGAWA, Naoki, Toyota-shi Aichi 471-8571,<br />

JP<br />

(74) Smith, Samuel Leonard, et al, J.A. Kemp &<br />

Co. 14 South Square Gray's Inn, London<br />

WC1R 5JJ, GB<br />

H01L 25/07 → (51) H01L 25/065<br />

(51) H01L 25/16 (11) 2 224 485 A2<br />

H01L 33/48 H01L 23/60<br />

H01L 23/60<br />

(25) En (26) En<br />

(21) 10153784.3 (22) 17.02.<strong>2010</strong><br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MK MT<br />

NL NO PL PT RO SE SI SK SM TR<br />

AL BA RS<br />

(30) 25.02.2009 TW 98106001<br />

(54) • Gehäuse für lichtemittierende Diode<br />

• Light emitting diode package<br />

• Boîtier de diode électroluminescente<br />

(71) Everlight Electronics Co., Ltd., No.25 Lane<br />

76, Sec.3 Chung Yang Road, Tucheng T'ai<br />

pei, TW<br />

(72) Chen, Yi-Wen, Taiwan, ROC, Taipei, TW<br />

(74) Chamberlain, Alan James, Haseltine Lake<br />

LLP Redcliff Quay 120 Redcliff Street, Bristol<br />

BS1 6HU, GB<br />

H01L 25/18 → (51) H01L 25/065<br />

H01L 25/18 → (51) H01L 25/07<br />

326<br />

Anmeldungen<br />

Applications<br />

Demandes (<strong>35</strong>/<strong>2010</strong>) 01.09.<strong>2010</strong><br />

H01L 27/06 → (51) H01L 21/8249<br />

H01L 27/105 → (51) H01L 21/8246<br />

(51) H01L 27/146 (11) 2 224 486 A2<br />

(25) En (26) En<br />

(21) 10153785.0 (22) 17.02.<strong>2010</strong><br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MK MT<br />

NL NO PL PT RO SE SI SK SM TR<br />

AL BA RS<br />

(30) 25.02.2009 TW 98106002<br />

(54) • QNF-Gehäusestruktur für Chip<br />

• Quad flat non-leaded chip package structure<br />

• Structure quadruple et plate de conditionnement<br />

de puce sans plomb<br />

(71) Everlight Electronics Co., Ltd., No. 25, Lane<br />

76 Sec. 3, Chung Yang Road, Tucheng City /<br />

Taipei County, TW<br />

(72) Lai, Lu-Ming, Taipei, Taiwan, ROC, TW<br />

(74) Chamberlain, Alan James, Haseltine Lake<br />

LLP Redcliff Quay 120 Redcliff Street, Bristol<br />

BS1 6HU, GB<br />

(51) H01L 27/146 (11) 2 224 487 A2<br />

(25) En (26) En<br />

(21) 10154616.6 (22) 25.02.<strong>2010</strong><br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MK MT<br />

NL NO PL PT RO SE SI SK SM TR<br />

AL BA RS<br />

(30) 25.02.2009 TW 98106002<br />

06.02.<strong>2010</strong> TW 99103647<br />

(54) • Optoelektronische Halbleitervorrichtung<br />

und optoelektronische QNF-Vorrichtung<br />

• Semiconductor optoelectronic device and<br />

quad flat non-leaded optoelectronic device<br />

• Dispositif opto-électronique semi-conducteur<br />

et dispositif opto-électronique sans<br />

plomb à structure quadruple et plate<br />

(71) Everlight Electronics Co., Ltd., No. 25, Lane<br />

76 Sec. 3, Chung Yang Road, Tucheng City /<br />

Taipei County, TW<br />

(72) Lai, Lu-Ming, Taiwan, ROC, Taipei, TW<br />

(74) Chamberlain, Alan James, Haseltine Lake<br />

LLP Redcliff Quay 120 Redcliff Street,<br />

Bristol, Avon BS1 6HU, GB<br />

(51) H01L 27/148 (11) 2 224 488 A1<br />

(25) En (26) En<br />

(21) 10006024.3 (22) 25.07.2005<br />

(84) DE FR IT<br />

(30) 29.07.2004 JP 2004221981<br />

(54) • Festkörper-Bildaufnahmevorrichtung, Herstellungsverfahren<br />

und Ansteuerverfahren<br />

dazu, und Kamera<br />

• Solid-state imaging device, production<br />

method and drive method thereof, and<br />

camera<br />

• Capteur d'image à l'état solide, procédé de<br />

fabrication et méthode de commande, et<br />

caméra<br />

(71) Sony Corporation, 1-7-1 Konan Minato-ku,<br />

Tokyo 108-0075, JP<br />

(72) Kanbe, Hideo, Tokyo, 108-0075, JP<br />

(74) Müller - Hoffmann & Partner, <strong>Patent</strong>anwälte<br />

Innere Wiener Strasse 17, 81667 München,<br />

DE<br />

(62) 05016095.1 / 1 622 202<br />

H01L 27/24 → (51) H01L 45/00<br />

H01L 29/12 → (51) H01L 29/739<br />

H01L 29/423 → (51) C22B 59/00

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