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Bulletin 2010/35 - European Patent Office

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(H05K) I.1(2)<br />

• CARTE DE CIRCUIT IMPRIMÉ, SON PRO-<br />

CÉDÉ DE FABRICATION, ET APPAREIL<br />

RADIOFRÉQUENCE<br />

(71) Huawei Technologies Co., Ltd., Huawei<br />

Administration Building Bantian, Longgang<br />

District, Shenzhen Guangdong 518129, CN<br />

(72) YANG, Ruiquan, Shenzhen Guangdong<br />

518129, CN<br />

SHENG, Haiqiang, Shenzhen Guangdong<br />

518129, CN<br />

LI, Hongcai, Shenzhen Guangdong 518129,<br />

CN<br />

(74) Kreuz, Georg Maria, Huawei Technologies<br />

Riesstrasse 25, 80992 München, DE<br />

H05K 3/12 → (51) H05K 3/38<br />

H05K 3/18 → (51) H05K 3/38<br />

(51) H05K 3/20 (11) 2 224 795 A1<br />

H01L 51/00<br />

(25) De (26) De<br />

(21) 09010991.9 (22) 27.08.2009<br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MK MT<br />

NL NO PL PT RO SE SI SK SM TR<br />

AL BA RS<br />

(30) 26.02.2009 DE 102009010434<br />

(54) • Verfahren zur Herstellung einer Metallstruktur<br />

auf einem Substrat<br />

• Method for producing a metal structure on<br />

a substrate<br />

• Procédé destiné à la fabrication d'une<br />

structure de métal sur un substrat<br />

(71) ZYRUS Beteiligungsgesellschaft mbH & Co.<br />

<strong>Patent</strong>e I KG, Berliner Strasse 1, 12529<br />

Schönefeld / OT Waltersdorf, DE<br />

(72) Rostami, Bardia, Dr., 22299 Hamburg, DE<br />

Kruse, Jan, Dr., 22089 Hamburg, DE<br />

Uelzen, Thorsten, Dr., 21698 Bargstedt, DE<br />

Becker, Eike, 38102 Braunschweig, DE<br />

(74) Kloth, Matthias, White & Case LLP Jungfernstieg<br />

51, 20<strong>35</strong>4 Hamburg, DE<br />

(51) H05K 3/20 (11) 2 224 796 A1<br />

H01L 51/00<br />

(25) De (26) De<br />

(21) 09014782.8 (22) 27.11.2009<br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MK MT<br />

NL NO PL PT RO SE SI SK SM TR<br />

AL BA RS<br />

(30) 26.02.2009 DE 102009010434<br />

(54) • Vorrichtung und Verfahren zur Herstellung<br />

eines leitfähigen strukturierten Polymerfilms<br />

• Method for producing a metal structure on<br />

a substrate<br />

• Procédé destiné à la fabrication d'une<br />

structure de métal sur un substrat<br />

(71) ZYRUS Beteiligungsgesellschaft mbH & Co.<br />

<strong>Patent</strong>e I KG, Berliner Strasse 1, 12529<br />

Schönefeld / Waltersdorf, DE<br />

(72) Kruse, Jan, Dr., 22089 Hamburg, DE<br />

Uelzen, Thorsten, Dr., 21689 Bargstedt, DE<br />

Rostami, Bardia, Dr., 22299 Hamburg, DE<br />

Becker, Eike, 38102 Braunschweig, DE<br />

(74) Rohnke, Christian, White & Case LLP<br />

Jungfernstieg 51, 20<strong>35</strong>4 Hamburg, DE<br />

H05K 3/34 → (51) B23K <strong>35</strong>/363<br />

H05K 3/36 → (51) H01R 12/22<br />

(51) H05K 3/38 (11) 2 224 797 A1<br />

H05K 3/12 H05K 3/18<br />

(25) Ja (26) En<br />

(21) 08848612.1 (22) 11.11.2008<br />

Europäisches <strong>Patent</strong>blatt<br />

<strong>European</strong> <strong>Patent</strong> <strong>Bulletin</strong><br />

<strong>Bulletin</strong> européen des brevets<br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MT NL<br />

NO PL PT RO SE SI SK TR<br />

AL BA MK RS<br />

(86) JP 2008/070530 11.11.2008<br />

(87) WO 2009/063883 2009/21 22.05.2009<br />

(30) 13.11.2007 JP 2007293873<br />

(54) • VERFAHREN ZUR BILDUNG EINER<br />

ELEKTROLEITFÄHIGEN DÜNNEN LEITUNG<br />

• METHOD FOR FORMING ELECROCON-<br />

DUCTIVE THIN LINE<br />

• PROCÉDÉ DE FORMATION D'UNE LIGNE<br />

MINCE ÉLECTROCONDUCTRICE<br />

(71) Seiren Co., Ltd., 1-10-1 Keya, Fukui-shi<br />

Fukui 918-8560, JP<br />

(72) TSUBOTA, Masanori, Fukui-shi Fukui 918-<br />

8560, JP<br />

SHIOMI, Hidekazu, Fukui-shi Fukui 918-<br />

8560, JP<br />

OGATA, Hiroshi, Fukui-shi Fukui 918-8560,<br />

JP<br />

(74) HOFFMANN EITLE, <strong>Patent</strong>- und Rechtsanwälte<br />

Arabellastrasse 4, 81925 München, DE<br />

H05K 5/02 → (51) H05K 1/02<br />

(51) H05K 7/20 (11) 2 224 798 A1<br />

H05K 1/02<br />

(25) Ja (26) En<br />

(21) 08864<strong>35</strong>2.3 (22) 12.12.2008<br />

(84) AT BE BG CH CY CZ DE DK EE ES FI FR GB<br />

GR HR HU IE IS IT LI LT LU LV MC MT NL<br />

NO PL PT RO SE SI SK TR<br />

AL BA MK RS<br />

(86) JP 2008/072660 12.12.2008<br />

(87) WO 2009/081769 2009/27 02.07.2009<br />

(30) 21.12.2007 JP 2007329993<br />

(54) • LEITERPLATTENSTRUKTUR MIT HITZE-<br />

SCHUTZ<br />

• CIRCUIT BOARD STRUCTURE HAVING<br />

MEASURES AGAINST HEAT<br />

• STRUCTURE DE CIRCUITS IMPRIMÉS<br />

COMPORTANT DES DISPOSITIONS<br />

CONTRE LA CHALEUR<br />

(71) Yazaki Corporation, 4-28, Mita 1-chome,<br />

Minato-ku Tokyo 108-8333, JP<br />

(72) SHIRAIWA, Hiroki, Kakegawa-shi Shizuoka<br />

437-1414, JP<br />

KIYOSUE, Kazuomi, Kakegawa-shi Shizuoka<br />

437-1414, JP<br />

NAKASHIMA, Akinori, Kakegawa-shi Shizuoka<br />

437-1414, JP<br />

SUGIURA, Tomohiro, Kakegawa-shi Shizuoka<br />

437-1414, JP<br />

YAMAZAKI, Noriyoshi, Kakegawa-shi Shizuoka<br />

437-1414, JP<br />

UMEZAKI, Minoru, Kakegawa-shi Shizuoka<br />

437-1414, JP<br />

(74) Viering, Jentschura & Partner, Grillparzerstrasse<br />

14, 81675 München, DE<br />

H05K 9/00 → (51) H05K 1/02<br />

364<br />

Anmeldungen<br />

Applications<br />

Demandes (<strong>35</strong>/<strong>2010</strong>) 01.09.<strong>2010</strong>

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