STM32F101xx, STM32F102xx, STM32F103xx, STM32F105xx and ...

RM0008
Power control (PWR)
4 Power control (PWR)
Low-density devices are STM32F101xx, STM32F102xx and STM32F103xx
microcontrollers where the Flash memory density ranges between 16 and 32 Kbytes.
Medium-density devices are STM32F101xx, STM32F102xx and STM32F103xx
microcontrollers where the Flash memory density ranges between 64 and 128 Kbytes.
High-density devices are STM32F101xx and STM32F103xx microcontrollers where the
Flash memory density ranges between 256 and 512 Kbytes.
Connectivity line devices are STM32F105xx and STM32F107xx microcontrollers.
This section applies to the whole STM32F10xxx family, unless otherwise specified.
4.1 Power supplies
The device requires a 2.0-to-3.6 V operating voltage supply (V DD ). An embedded regulator
is used to supply the internal 1.8 V digital power.
The real-time clock (RTC) and backup registers can be powered from the V BAT voltage when
the main V DD supply is powered off.
Figure 4.
Power supply overview
(V SSA ) V REF-
(from 2.4 V up to V DDA ) V REF+
(V DD ) V DDA
(V SS ) V SSA
V DDA domain
A/D converter
Temp. sensor
Reset block
PLL
V SS
V DD
V DD domain
I/O Ring
Standby circuitry
(Wakeup logic,
IWDG)
Voltage Regulator
1.8 V domain
Core
Memories
digital
peripherals
Low voltage detector
V BAT
Backup domain
LSE crystal 32K osc
BKP registers
RCC BDCR register
RTC
Note: 1 V DDA and V SSA must be connected to V DD and V SS , respectively.
Doc ID 13902 Rev 9 53/995