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Configuration Handbook - Kamami.pl

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External Flash Memory InterfaceFigure 3–9. Enhanced <strong>Configuration</strong> Device InterfacesFlashDeviceControllerDevice<strong>Configuration</strong>InterfacePLD(s)ExternalFlash InterfaceStacked Chip PackagePLD orProcessorAp<strong>pl</strong>ications that require remote update capabilities for on-boardprogrammable logic (Stratix series devices), and ap<strong>pl</strong>ications that usesoft-embedded processor cores (for exam<strong>pl</strong>e, the Nios ® embeddedprocessor) typically use the external flash memory interface feature.For soft-embedded processor core ap<strong>pl</strong>ications, the controller configuresthe programmable logic by using configuration data stored in the flashmemory. On successful configuration, the embedded processor uses theexternal flash interface to boot up and run code from the same flashmemory, eliminating the need for a stand-alone flash memory device.For ap<strong>pl</strong>ications requiring remote system configuration capabilities, aprocessor or PLD can use the external flash interface to store an updatedconfiguration image into a new page in flash memory (the external flashinterface cou<strong>pl</strong>ed with dynamic configuration). You can obtain newconfiguration data from a local intelligent host or through the Internet.Reconfiguring the system with the new page updates the systemconfiguration.fFor more information on im<strong>pl</strong>ementing remote and local system updateswith enhanced configuration devices, refer to the Using Remote System<strong>Configuration</strong> with Stratix & Stratix GX Devices chapter in the Stratix<strong>Handbook</strong>, or the Remote System Upgrades with Stratix II Devices chapter inthe Stratix II <strong>Handbook</strong>.Currently, EPC4 and EPC16 configuration devices support the externalflash interface. For support of this feature in other enhancedconfiguration devices, contact Altera Ap<strong>pl</strong>ications.3–12 Altera Corporation<strong>Configuration</strong> <strong>Handbook</strong>, Volume 2 April 2007

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