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U. Glaeser

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Merits of the SOI structure<br />

Merits of the fully depleted transistor<br />

FIGURE 2.78 Features of a fully depleted SOI transistor.<br />

FIGURE 2.79 Small junction capacitance.<br />

in lower junction capacitance due to the SOI structure is a remarkable advantage considering the trend<br />

of reducing the LSI supply voltage in order to reduce power consumption.<br />

In SOI structures, there is no MOS reverse body effect, because the body is electrically floating due to<br />

the presence of the buried oxide layer, as shown in Fig. 2.80. In MOSFETs on a bulk Si substrate, the<br />

body, which is to say the p-well, is connected to ground, so when the circuit is operating, the body<br />

potential, V BS, is always negative. Thus, if threshold voltage of MOSFETs (V th) rises, the drain current<br />

decreases. When the supply voltage is 1 V or more in n-MOSFETs on an SOI substrate, holes generated<br />

in the high electric field drain region accumulate in the body region and create a positive body bias. Thus<br />

the V BS becomes positive, V th is reduced, and the drain current increases. This feature results in better<br />

performance than is obtained with MOSFETs on bulk Si substrate in the case of logic gates that consist<br />

of stacked MOSFETs and pass transistor logic gates.<br />

For the development of multifunction LSI chips, the implementation of a mixed analog/digital (mixedsignal<br />

LSI) chip, which is a single chip on which reside RF circuits and analog-digital conversion circuits<br />

rather than just a digital signal processing block, is desired as a step toward realizing the system-on-a-chip.<br />

© 2002 by CRC Press LLC<br />

Low capacitance near source/drain<br />

High-speed operation at low voltages<br />

No substrate bias effect<br />

High speed<br />

Low crosstalk<br />

Analog-digital mixed-signal circuits<br />

Steep subthreshold characteristic<br />

High-speed operation at low voltages<br />

Small body potential floating effect<br />

Stable operation<br />

Drain current<br />

NMOS PMOS<br />

N+ N+ P+<br />

Buried oxide layer<br />

SOI substrate<br />

Fully depleted<br />

∆V th<br />

Conventional Bulk Device Ultrathin-Film SOI Device<br />

n +<br />

P-Substrate<br />

Field Oxide<br />

n +<br />

P-Substrate<br />

Partially depleted<br />

Gate voltage<br />

Field Oxide<br />

Buried Oxide<br />

Depletion Layer<br />

P+

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