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U. Glaeser

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29.2 Power Dissipation in Digital Circuits<br />

This section provides a brief overview of power dissipation basics to render this document self-contained.<br />

Four major sources of power dissipation are used in digital circuits:<br />

• Switching or dynamic power (Psw) • Short-circuit or direct-path power (Psc) • Leakage power (Pleak) • Static power (Pstat) The total chip power is given by the following Eq. (29.1):<br />

© 2002 by CRC Press LLC<br />

(29.1)<br />

The switching power dissipation is the dominant component and is due to the charging and discharging<br />

of all capacitive nodes in the circuit. It is given by Eq. (29.2):<br />

(29.2)<br />

where a is the switching activity (0 ≤ a ≤ 1),<br />

C is the total capacitance of all capacitive nodes in the circuit,<br />

VDD<br />

is the supply voltage, and f is the clock frequency. In case the internal nodes of the circuit do not<br />

experience a full voltage swing from 0 V to , Eq. (29.2) is modified as follows:<br />

V<br />

DD<br />

(29.3)<br />

where Vswing<br />

is the low voltage swing.<br />

Short-circuit power ( Psw)<br />

is dissipated when there is a transient direct path from VDD<br />

to ground during<br />

switching: During the rising (or falling) transition of static CMOS gates from VTN<br />

to VDD<br />

– VTP<br />

( VDD<br />

–<br />

VTP<br />

to VTN)<br />

a direct path from VDD<br />

to ground exists through a PMOS and NMOS stack that are both in<br />

their ON region. If the rise and fall times of the digital circuit are kept well under control (a small fraction<br />

of the period), short-circuit power is rarely a design issue. A comprehensive analysis on short-circuit<br />

power in static CMOS circuits can be found in [3].<br />

Two main types of leakage power are available. The first is subthreshold leakage and involves finite<br />

channel conductance in the NMOS and PMOS OFF regions. The second is reverse bias junction leakage<br />

and it involves source and drain-to-substrate PN junction leakage. Figure 29.1 shows the subthreshold<br />

and junction leakage components.<br />

The subthreshold current is typically the dominant component of leakage power. Low-voltage process<br />

technologies that rely on reduced threshold voltages to maintain performance are especially susceptible<br />

to increased subthreshold leakage. Threshold reduction results in large increases in leakage currents as<br />

Idsat a percentage of device. Leakage currents can be especially important in low activity embedded DSP<br />

systems (i.e., pagers) that are mostly in standby mode. In such cases, system battery life is mainly dependent<br />

on Pleak. Techniques for reducing Pleak include the use of multiple VT<br />

devices (MTCMOS) [4] and<br />

substrate bias control variable threshold CMOS [5]. Commercial signal processors use such techniques<br />

for leakage reduction [6].<br />

FIGURE 29.1<br />

Leakage current components.<br />

Ptotal = Psw + Psc + Pleak + Pstat P sw<br />

P sw<br />

=<br />

=<br />

Subthreshold<br />

Current<br />

2<br />

aCVDD f<br />

aCV DDV swing f<br />

Reverse Bias<br />

Junction<br />

Leakage<br />

Current

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