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FIGURE 21.17 The three drivers used for the experiment: (a) clocked buffer, (b) inverter, and (c) inverter with pFET and nFET as pull-ups. inputs xp and xp to model the capacitance of the interconnect. Two inverters were added to the converter outputs xl and to model the driving load of the converter. xl A single-rail-input, dual-rail-output clocked buffer (Fig. 21.17(a)) was used for the clock-powered approach. This clocked buffer was derived from the single-rail-output buffer by duplicating the bootstrap, the isolation, and the clamp transistors. The two inverters of the clocked buffer, as well as the converter and its output inverters, were powered from the same supply voltage Vdd. The clock phase ϕD swung to a voltage Vϕ (Fig. 21.17(a)). The input Din of the clocked buffer swung from 0 to Vdd. For the dual-supply-voltage approach, two drivers, powered from the low-supply-voltage VddL, drove the converter (Fig. 21.16(b)). The converter and its output inverters were powered from the same supply voltage Vdd. The inputs Din and Din of the two drivers swung from 0 to Vdd. Two different driver designs were used in the experiment. One was a regular inverter (Fig. 21.17(b)). The nFET of the inverter had the same width with the bootstrap transistors of the CB (Fig. 21.17(a)) and the pFET was set by the mobility ratio in the CMOS technology. The regular inverter becomes very slow as VddL is scaled down. This is because the gate-to-source voltage of the pull-up transistor is equal to VddL when the input is at 0 V. The operation of the pull-down nFET is not affected by VddL scaling because when it is on, its gate-tosource voltage is equal to Vdd, i.e., the voltage that Din swings to. To mitigate this effect, a second driver design with both an nFET and a pFET as pull-ups was used (Fig. 21.17(c)). As VddL decreases, the nFET pull-up can fully charge the output, given the significant voltage difference between VddL and Vdd. Simulation Results All circuits were laid out in Magic using the 0.5-µm Hewlett-Packard CMOS14B process parameters. The netlists extracted from the layout were simulated with HSPICE using the level-39 MOSFET models. The 150 fF load capacitances were added in the netlist as shown in Fig. 21.16. The delay to switch the DS P2LC output xl from zero to one and the required energy for switching the DS P2LC inputs (i.e., nodes xp and xp ) were simulated for the clock-powered and dual-supply-voltage cases. For the clockpowered case, it was assumed that all return energy was recovered. The supply voltage Vdd was held constant at 3.3 V for all the simulations. The isolation voltage Viso of the clocked buffer was set to 4.5 V. This was found to be a near-optimum point through HSPICE simulations. If the isolation voltage is too low, the boot node will not charge to the maximum possible voltage. If the isolation voltage is too high, then during bootstrapping, the boot node voltage will reach a point at which the isolation transistor turns on and charge flows backward from the boot node, thus diminishing the bootstrapping effect. © 2002 by CRC Press LLC D in (a) V iso 0.7 µm V iso 0.7 µm ϕ D 8.6 µm Dout 2.2 µm ϕ D 8.6 µm Dout 2.2 µm D in V ddL 26.8 µm Dout 8.6 µm (b) VddL 26.8 µm 8.6µm Din Din Dout 8.6 µm (c)
FIGURE 21.18 HSPICE waveforms for clock-powered approach when V ϕ is 2.4 V. FIGURE 21.19 Energy vs. delay for the driver experiment. For comparison purposes, it should be noted that the delay of a minimum size inverter (nFET width 0.7 µm, pFET width 2.2 µm) was recorded at 150 ps by simulating a 15-stage ring oscillator in HSPICE (supply voltage 3.3 V). The clock voltage swing, Vϕ, of the clock-powered logic, was varied from 1.1 to 3.3 V. Specifically, simulations were performed for the following clock voltage swings: 1.1, 1.2, 1.5, 1.8, 2.1, 2.4, 2.7, 3.0, and 3.3 V. Switching time Ts was varied from nearly 0 to 1 ns (0.001, 0.25, 0.50, and 1.0 ns). For all simulations the phase width Tw was set to 2.5 ns, whereas the phase high time Th was equal to Tw − 2Ts (see Fig. 21.16(a)). The delay was recorded from the point where the phase started switching until the output xl reached the 50% point (e.g., 1.65 V in Fig. 21.18). If the delays were evaluated from when the phase reached its 50% point, the clock-powered approach would be allowed a longer start time than the conventional case. To eliminate this advantage, the delay was evaluated as described previously (see Fig. 21.18). VddL was varied identically to Vϕ for the conventional case. The switching time of the inputs Din and Din was 1 ps. Delay was measured from the Din 50% point to the xl 50% point (i.e., 1.65 V). The energy versus delay results (Fig. 21.19) show that the delay of the inverter increases significantly as VddL is reduced. At 3.3 V, the delay is approximately 0.7 ns, whereas at 1.1 V, the delay is nearly 3.6 ns (not shown in Fig. 21.19). The conventional driver with the two pull-ups (Fig. 21.17(c)) has a performance © 2002 by CRC Press LLC Energy (pJ) Wave phD bootNode xp xl 10 0 10 -1 Symbol Voltages (lin) ***************************** 4.8 4.6 4.4 4.2 4 3.8 3.6 3.4 boot node 3.2 3 2.8 2.6 2.4 2.2 2 1.8 x l 1.6 1.4 1.2 1 800m 600m 400m 200m 0 ϕ D x ∧ϕ p D 11n 11.5n 12n 12.5n 13n 13.5n 14n Time (lin) (TIME) 14.5n 15n 15.5n Delay 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 Delay (ns) Inverter Modified Inv. CB (0.001ns) CB (0.25ns) CB (0.50ns) CB (1.00ns)
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© 2002 by CRC Press LLC
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© 2002 by CRC Press LLC Fernanda p
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Locating Your Topic Several avenues
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Krste Asanovic Massachusetts Instit
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7 8 9 Architectures for Low Power P
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SECTION VII Communications and Netw
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45 Testing of Synchronous Sequentia
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Hiroshi Iwai Tokyo Institute of Tec
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FIGURE 1.2 FIGURE 1.3 © 2002 by CR
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1.2 Downsizing below 0.1 © 2002 by
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FIGURE 1.9 Subthreshold leakage cur
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FIGURE 1.13 Epitaxial channel [9].
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gate length reduction was accelerat
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of the prediction. Until only sever
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FIGURE 1.22 Clarke number of elemen
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1.5 Source and Drain Figure 1.25 sh
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FIGURE 1.27 Retrograde profile. FIG
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TABLE 1.6 Trend of Interconnect by
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TABLE 1.9a Trend of DRAM Cell: Stac
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FIGURE 1.36 Trend of gate length. F
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References 1. D. Kahng and M. M. At
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40. B. H. Lee, R. Choi, L. Kang, S.
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outputs of the gate regardless of t
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FIGURE 2.4 circuit. This is the bas
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FIGURE 2.8 Two different realizatio
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FIGURE 2.12 Multifunction circuitry
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Dynamic Logic Circuits The basic id
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transistors in the pull-down networ
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In Fig. 2.21(d), the cross-coupled
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FIGURE 2.23 Different configuration
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In some literature, the authors lik
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Concluding Remarks The feature size
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FIGURE 2.30 Other pass-transistor c
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FIGURE 2.34 Dual-rail, pass-transis
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Shannon expansion, as shown below,
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FIGURE 2.41 Logic circuit for Out =
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FIGURE 2.45 Example decomposed BDD.
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FIGURE 2.50 Diffusion-area sharing
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FIGURE 2.54 Relationship between co
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29. Shiple, T. R., Hojati, R., Sang
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FIGURE 2.58 DTMOS devices: (a) stan
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the design into a BDD representatio
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FIGURE 2.63 Circuit diagram of 2-in
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FIGURE 2.67 Synthesis of 2-input AN
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pass-transistor logic, constrained
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16. Bryant, R., Graph-based algorit
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As shown in Fig. 2.79, the MOSFET d
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n + SiO 2 FIGURE 2.80 No reverse bo
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structures are a powerful solution
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SiO 2 Epitaxial Si Double Layered P
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PD-SOI Application to High-Performa
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LO FIGURE 2.91 History effects. sta
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weight, lower cost, a wireless inte
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TABLE 2.7 Performance of sub-1 V MT
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X X FIGURE 2.99 1 V A/D converter u
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When the communication range is 10
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13. Nakashima, S., et al., Thicknes
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FIGURE 3.1 Conventional ECL circuit
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FIGURE 3.4 FIGURE 3.5 IPULL-DOWN, f
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FIGURE 3.7 V REG voltage regulator
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FIGURE 3.10 Layout of inverter gate
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FIGURE 3.14 Power consumption versu
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I/O Pads, is 60 mW for the multiple
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FIGURE 3.21 Maximum data rate vs. V
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John C. McCallum National Universit
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enchmark took between 15.7 and 5115
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The improvements in line widths, ch
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performance. Extensive lists of SPE
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TABLE 4.6 Functions of Memory and S
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Memory Price ($/MB) FIGURE 4.3 Cost
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TABLE 4.8 Disk Drive Characteristic
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4.6 Summary The performance of comp
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53. Curnow, H. J., and Wichmann, B.
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Computer Systems and Architecture
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advances that have been made in dev
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Server Types Servers are optimized
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Total Cost of Ownership Another con
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edundant memory-bit steering, and s
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majority of the users. Hardware opt
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processor implementations. In later
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FIGURE 5.7 an operand. For larger c
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Example 2 This example contrasts th
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Unlike the Defoe, the IA-64 archite
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This 3-phase approach fails to expl
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6. Scott Rixner, William J. Dally,
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Shared-memory vector architectures
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The vector ISA usually fixes the ma
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FIGURE 5.12 A vector unit construct
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use of loops optimized for certain
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9. Espasa, R., Advanced Vector Arch
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thread management (including run-ti
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In the message passing model, inter
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multithreaded hardware, possibly by
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synchronization) and usually contai
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a common register space, it is impo
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FIGURE 5.16 When a load request is
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list a few helpful references to wh
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38. S. Wallace, B. Calder, and D. T
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Of course, SIMD machines have limit
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computation, it will decrease execu
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FIGURE 5.19 An 8 × 8 baseline netw
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Since then, we have seen constant e
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Stack: Data: Text: Virtual Space FI
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FIGURE 5.25 Shared memory. Shared m
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0 2 GB Text Init. Data Bss Heap . .
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In general, if the necessary transl
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Mark Smotherman Clemson University
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Studies of Instruction-Level Parall
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Modern Designs Most high-performanc
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The principle of register renaming
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FIGURE 6.2 issued into the RS, (ii)
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Issue Dispatch FIGURE 6.4 The proce
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FIGURE 6.6 Scope of register renami
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FIGURE 6.9 State transition diagram
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Thus, the maximal number of instruc
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In addition, if rename buffers are
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it, whose role will be explained su
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As Fig. 6.13 shows, the latest proc
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for recovery. Both processors incor
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FIGURE C. The principle of direct i
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13. White, S. and Reysa, J., PowerP
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FIGURE 6.14 A branch flowing throug
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is that mispredictions limit the pr
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fetch engine to identify which inst
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FIGURE 6.17 A schematic for a bimod
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FIGURE 6.20 A schematic for a GAg g
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FIGURE 6.22 A schematic for a hybri
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time this branch is seen, those bit
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FIGURE 6.23 Branch prediction accur
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11. Price, C., MIPS IV Instruction
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transporting digital bits, whereas
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FIGURE 6.25 The system architecture
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Finally, because the main task of n
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Pradip Bose IBM T. J. Watson Resear
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frequency © 2002 by CRC Press LLC
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The “mips” metric for performan
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Hence, in this paper, we do not dwe
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FIGURE 7.4 Parallel SIMD architectu
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dynamic prediction of such idle mod
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FIGURE 7.7 High-level block-diagram
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(measured as a performance over pow
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Steady-state BIPS FIGURE 7.9 Perfor
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8. Larson, A. G., “Cost-effective
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Jozo J. Dujmović San Francisco Sta
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x FIGURE 8.1 Movement of the disk I
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The critical distance x ∗ is Ther
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Hence, the average seek time for th
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FIGURE 8.4 Four-parameter exponenti
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Access Time [ms] 2 0 0 FIGURE 8.6 M
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TABLE 8.1 Classification of Eight B
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The traditional load independent me
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Response Time [seconds] 290 270 250
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FIGURE 8.14 Prediction errors e(p)
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8.2 Performance Evaluation: Techniq
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is generally the most important mea
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tool to profile programs on the Alp
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driven simulation has two major pro
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A variety of profiling tools exist
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SPLASH, the SPLASH suite was create
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different types and complexity eith
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Table 8.8 provides sources for the
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37. MediaBench benchmarks, http://w
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(a) Instruction Cache (b) Trace Cac
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PE 0 Local Register File local bypa
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The large trace processor instructi
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11. S. Melvin, M. Shebanow, and Y.
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complement numbers. Sign magnitude
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where ak, bk, and ck are the inputs
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k + 1, etc. Extending to a third st
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a 12:15 b 12:15 4-Bit RCA s 12:15 F
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FIGURE 9.8 Two’s complement subtr
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FIGURE 9.10 Unsigned 6 by 6 array m
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Digit Recurrent Division The most c
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FIGURE 9.14 Nonrestoring division.
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The Newton-Raphson division algorit
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FIGURE 9.18 Floating-point addition
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9.2 Fast Adders and Multipliers Gen
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FIGURE 9.20 Half-adder circuit. is
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gi pi FIGURE 9.22(b) Carry skip cir
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Assuming that a single level of the
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Array-Type Multiplier The simplest
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p1i,j p2i,j p3i,j p4i,j FIGURE 9.27
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The partial product PP j is to be c
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The sum SGN of the whole extended b
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FIGURE 9.31 54 × 54-bit parallel m
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6. Svensson, C. and Tjarnstrom, R.,
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Design Techniques III 10 Timing and
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FIGURE 10.1 Typical chip interface.
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Loop Components PLLs and DLLs share
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delay is some fraction of the input
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esults from the voltage across the
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© 2002 by CRC Press LLC TABLE 10.2
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db(H( ω)) FIGURE 10.6 PLL closed-l
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ω )/G O) db(T(ω ph(T( )/π) FIGUR
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Phase Margin (deg) FIGURE 10.10 PLL
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FIGURE 10.11 Measured PLL jitter hi
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FIGURE 10.13 DLL output jitter sens
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FIGURE 10.18 PLL output jitter sens
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Active supply filters employ amplif
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FIGURE 10.19 Single-ended delay ele
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Frequency (GHz) FIGURE 10.23 Freque
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FIGURE 10.25 Push-pull charge pump.
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Circuit Summary In general, all DLL
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5. T. Lee, et al., “A 2.5V CMOS D
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introduced in [3], is used to repre
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FIGURE 10.31 Setup and hold time ti
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FIGURE 10.34 Max-timing diagrams fo
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FIGURE 10.37 Time borrowing for sin
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FIGURE 10.39 Max-timing for single-
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Min-Timing In contrast to max-timin
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FIGURE 10.46 Min-timing diagrams fo
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FIGURE 10.49 Edge-triggered, flip-f
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FIGURE 10.51 FIGURE 10.52 Max-timin
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FIGURE 10.53 Transparent-high latch
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FIGURE 10.57 Complementary TSPC tra
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FIGURE 10.61 A positive, edge-trigg
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FIGURE 10.66 Pulsed latches. FIGURE
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assigned, based on the subcircuit t
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FIGURE 10.71 Scan chain for dual-ph
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and SEB, which are complementary, c
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when used as a flip-flop, the NAND3
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FIGURE 10.75 Integrated memory for
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Memory Cell Bit# Bit FIGURE 10.78 A
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FIGURE 10.80 Modeling process varia
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FIGURE 10.83 A column circuit. FIGU
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advantage of this circuit, compared
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K. Wayne Current University of Cali
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11.2 Nonvolatile Multiple-Valued Me
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Multiple-Valued EEPROM and Flash Me
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direct properly scaled and logicall
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Current comparators are a critical
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FIGURE 11.4 Current-mode CMOS quate
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FIGURE 11.6 Current-mode CMOS quate
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observed with these circuits are ab
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FIGURE 11.11 Current-mode CMOS quat
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FIGURE 11.12 Current-mode CMOS latc
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FIGURE 11.14 Current-mode CMOS anal
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esults confirm the DC transfer func
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19. T. T. Dao, “Threshold I2L and
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FIGURE 12.1 Device technologies use
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selected depending on the number of
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Architecture of Newer Generation FP
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FIGURE 12.6 An example of a simple
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tools, the + 1 operation is a speci
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download the programming data to th
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FIGURE 13.1 High-performance microp
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FIGURE 13.4 TABLE 13.1 combinationa
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accurate wire modelling while limit
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FIGURE 13.6 Dual-rail, multiple-out
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FIGURE 13.10 Effect of output inver
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FIGURE 13.11 Unfooted dynamic 4:1 m
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(4) the limit of designers to manag
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© 2002 by CRC Press LLC IV Design
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FIGURE 14.1 FIGURE 14.2 newer semic
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The cost impact of power consumptio
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In any case, the move toward “Gre
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This static current is obviously un
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14.2 Power Estimation As we saw in
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lock as a function of various param
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FIGURE 14.8 Sleep transistors to co
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FIGURE 14.12 Data enabling. In addi
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Power Reduction through CAD Tools P
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AMPS AMPS is a circuit power optimi
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Masayuki Miyazaki Hitachi, Ltd. 15.
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15.3 Supply Voltage Management Supp
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FIGURE 15.4 MT-CMOS balloon circuit
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FIGURE 15.9 EVT-CMOS circuit design
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FIGURE 15.12 VT-CMOS block diagram
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FIGURE 15.15 SA-V t CMOS scheme wit
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FIGURE 15.17 Floating-point datapat
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Vivek De Intel Corporation Ali Kesh
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FIGURE 16.3 n-channel ID vs. VG sho
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Gate-Induced Drain Leakage (I 4) GI
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FIGURE 16.7 Two-nMOS stack in a two
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FIGURE 16.11 Four-input NAND NMOS s
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FIGURE 16.12 Distribution of standb
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Die count FIGURE 16.16 (a) Adaptive
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due to adaptive body bias worsens w
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Thomas D. Burd University of Califo
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the parameter to be maximized since
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17.3 Dynamically Varying Voltage If
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The voltage converter required for
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FIGURE 17.7 DVS improvement for UI
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FIGURE 17.10 Measured throughput vs
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FIGURE 17.12 Sources of noise margi
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FIGURE 17.15 Ring oscillator adapti
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FIGURE 17.17 Sense-amp delay variat
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Christian Piguet CSEM: Centre Suiss
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Some Basic Rules There are some bas
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TABLE 18.2 Looped 8-bit Multiply Pr
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FIGURE 18.4 new architecture paradi
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FIGURE 18.6 FIGURE 18.7 the second
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FIGURE 18.9 FIGURE 18.10 With latch
Page 594 and 595: 18.6 Low-Power Memories As memories
Page 596 and 597: connected to the main bitline (only
Page 598 and 599: is today only about a factor of 2 d
Page 600 and 601: Katsunori Seno SONY Corporation 19.
Page 602 and 603: FIGURE 19.2 FIGURE 19.3 This is a c
Page 604 and 605: FIGURE 19.6 FIGURE 19.7 FPGA sacrif
Page 606 and 607: FIGURE 19.9 RAWn precharge FIGURE 1
Page 608 and 609: a fixed given standard. References
Page 610 and 611: Hendrawan Soeleman Purdue Universit
Page 612 and 613: for a short period of time when bot
Page 614 and 615: Total Average Power Putting togethe
Page 616 and 617: Signal Probability Calculation In c
Page 618 and 619: Example Given y = x 1 + x 2. Find P
Page 620 and 621: A B F FIGURE 20.7 Unfactorized and
Page 622 and 623: etween successive transitions is a
Page 624 and 625: FIGURE 20.9 A logic gate and its co
Page 626 and 627: Results Using Probabilistic Techniq
Page 628 and 629: FIGURE 20.12 Probabilistic and stat
Page 630 and 631: 14. VLSI Microprocessors: A Guide t
Page 632 and 633: 0 V to a voltage V in time T throug
Page 634 and 635: a small fraction of circuit nodes t
Page 636 and 637: FIGURE 21.6 (a) E-R latch, (b) timi
Page 638 and 639: FIGURE 21.8 Potential E-R latch for
Page 640 and 641: The only difference between the two
Page 642 and 643: FIGURE 21.14 (a) Clock-powered stat
Page 646 and 647: FIGURE 21.20 Energy-delay product (
Page 648 and 649: FIGURE 21.22 AC-1 clock-driver sche
Page 650 and 651: clock-powered nodes accounted for 8
Page 652 and 653: Two generations of clock-powered mi
Page 654 and 655: 29. Athas, W. C., Tzartzanis, N., M
Page 656 and 657: Wayne Wolf Princeton University 22.
Page 658 and 659: so a CPU could be built in reconfig
Page 660 and 661: optimized processes. Although embed
Page 662 and 663: FIGURE 22.4 they are most useful wh
Page 664 and 665: • How should processes be allocat
Page 666 and 667: 25 memory system activity. If the c
Page 668 and 669: Jonathan W. Valvano University of T
Page 670 and 671: FIGURE 23.2 6808, I/O ports A and B
Page 672 and 673: personnel so that they are proficie
Page 674 and 675: BDM can provide the ability to obse
Page 676 and 677: minor modifications to the finite s
Page 678 and 679: Many components are included in a d
Page 680 and 681: will saturate resulting in a bang-b
Page 682 and 683: Two approaches are used to synchron
Page 684 and 685: Fred J. Taylor University of Florid
Page 686 and 687: The output of a linear system havin
Page 688 and 689: FIGURE 24.2 Effects of windowing an
Page 690 and 691: frequency range ±f Nyquist = ±f s
Page 692 and 693: performance, complexity, and precis
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overflows of intermediate sums. Tha
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24.7 Applications “DSP” has bec
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DSP (Digital Signal Processor) or D
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PC as a Terminal (Modem) The PC is
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characteristics: • Fixed pictures
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HDTV (and Digital Television) If th
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Modem Banks This is the first of th
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25.7 Automotive, Industrial Althoug
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36. MITEL Semiconductor: www.semico
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26.2 Digital Filters The theory of
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|H | 1 FIGURE 26.1 Frequency select
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TABLE 26.1 Filter Design Comparison
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frequency response involves some al
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Impulse Response 0.2 0.15 0.1 0.05
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This constrained magnitude problem
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FIGURE 26.8 Block diagram of the ge
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11. Ikehara, M., Tanaka, H., and Ku
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Adam Dabrowski Poznan University To
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−12 2 The reference in this case
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FIGURE 27.1 Two-band filter bank: (
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FIGURE 27.5 Critical bandwidth and
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FIGURE 27.7 Threshold of audibility
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FIGURE 27.10 Critical band index in
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FIGURE 27.13 Simplified model of th
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All described masking effects are e
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where From Eqs. (27.32) and (27.33)
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eal-time. Although floating-point p
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FIGURE 27.19 Overlapped, power comp
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FIGURE 27.21 Symmetrical FIR filter
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In the MPEG-1 encoder an efficient
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These first two approaches can be m
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FIGURE 27.27 ADPCM: (a) encoder, (b
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FIGURE 27.30 General scheme of the
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A new standard MPEG-7, named the mu
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FIGURE 27.32 AC-3 encoder. FIGURE 2
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29. Marven, C. and Ewers, G., A sim
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FIGURE 28.1 FIGURE 28.2 of the huma
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FIGURE 28.5 image of reasonable qua
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Consider the case of a simple 2-D
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FIGURE 28.8 A sampled spatiotempora
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oth high spatial frequency componen
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If it were separable (that is, H(ξ
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The first hypothesis (the less plau
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FIGURE 28.17 The real (top) and ima
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FIGURE 28.18 The resolution of a ti
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FIGURE 28.20 Motion estimation by b
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where the superscripts n and n + 1
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must be found via a finite set of o
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The methods in this subsection are
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FIGURE 28.28 The split phase. Using
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35. Y.-T. Wu, T. Kanade, J. Cohn, a
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29.2 Power Dissipation in Digital C
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additional power benefits. Efficien
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Power savings are higher than simpl
Page 802 and 803:
A priori knowledge of data stream d
Page 804 and 805:
FIGURE 29.7 DCT Chip [my DCT] avera
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19. S. Uramoto et al. A 100 MHz 2-D
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Anna Hać University of Hawaii 30.1
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Using TCP/IP also makes the network
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this is for one mobile host which i
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TDMA Time-division multiple access
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path delay. The two measures of the
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are under the control of the system
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the bandwidth reserved in the targe
Page 822 and 823:
Chik-Kong Ken Yang University of Ca
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FIGURE 31.3 attenuation (dB) -3.0 -
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FIGURE 31.5 to handle large voltage
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p_o V bias FIGURE 31.8 High-impedan
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out[n] a0 FIGURE 31.11 Transmitter
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FIGURE 31.15 Receiver design using
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digitally by first feeding the inpu
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FIGURE 31.19 90 o locking using XOR
Page 838 and 839:
Power of these links is becoming an
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46. Takahashi, T. et al., “A CMOS
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Many computer programs exhibit some
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32.3 Related Memory Models, Hierarc
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32.6 External Sorting and Related P
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uns, each striped across the disks.
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Matrix transposition is the special
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of satellite images is over one ter
Page 854 and 855:
TABLE 32.3 Best Known I/O Bounds fo
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e accessed directly in a single I/O
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implementations of priority queues
Page 860 and 861:
By the reduction in [52], a data st
Page 862 and 863:
set of experiments on various text
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3. A. Acharya, M. Uysal, and J. Sal
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44. J. L. Bentley and J. B. Saxe. D
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85. P. Ferragina and F. Luccio. Dyn
Page 870 and 871:
128. V. Kumar and E. Schwabe. Impro
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173. H. Samet. The Design and Analy
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Peter J. Varman Rice University 33.
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need for fast transfers, up to 1 Gb
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In contrast to prefetching that mas
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The ERF algorithm was analyzed in [
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increment lowestPriorityOnDisk(disk
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External or out-of-core algorithms
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33. M. Kallahalla and P. J. Varman.
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advanced, reaching the point where
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FIGURE 34.3 FIGURE 34.4 defines the
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FIGURE 34.5 Trellis representation
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FIGURE 34.7 Data and servo sectors.
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References 1. S. H. Charrap, P. L.
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High-frequency noise is then remove
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The various components of (34.3) ar
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sequences are more complex, and occ
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ange of 10 −12 -10 −15 . Anothe
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strategies are reviewed, which have
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FIGURE 34.13 Magnitude response for
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taps as an approximation of the Typ
Page 912 and 913:
FIGURE 34.18 CTF BER performance de
Page 914 and 915:
TABLE 34.1 Examples of Equalizers I
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(i) Symbol rate VCO based timing re
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Symbol Rate Timing Recovery Schemes
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where B = B 1 + B 2 + 1 is the size
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in � out � d(k) FIGURE 34.26 Ti
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�(k) z -L FIGURE 34.27 Linearized
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10 −4 and 10 −2 . The steady-st
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16. J. Sonntag, et al., “A high s
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y a special sequence known as the a
Page 932 and 933:
FIGURE 34.36 An example of two Gray
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track n track n +1 FIGURE 34.38 The
Page 936 and 937:
FIGURE 34.40 The phase format. Posi
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increase linear density while mitig
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FIGURE 34.43 Two equivalent constra
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FIGURE 34.44 Possible pairs of sequ
Page 944 and 945:
Distance δ min,C can be bounded as
Page 946 and 947:
FIGURE 34.45 Standard concatenation
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30. E. Soljanin, “On-track and of
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The next block is PRE. What is PR?
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In the above example, we see that s
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FIGURE 34.52 Feedback detector. Cat
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FIGURE 34.54 Decision feedback equa
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esponse (this is also valid for dif
Page 960 and 961:
its use, while the computational, o
Page 962 and 963:
FIGURE 34.58 Viterbi algorithm dete
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Noise-Predictive Maximum Likelihood
Page 966 and 967:
The error event likelihoods are cal
Page 968 and 969:
Metric-First Algorithms Metric-firs
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termination at the same time. Howev
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13. J. Hagenauer, “Applications o
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Given a code C of length n and dime
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Notice that, although a code may ha
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Not many perfect codes exist. In th
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Theorem 1 (Shannon) For any � > 0
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If we write the codewords as polyno
Page 984 and 985:
Let © 2002 by CRC Press LLC 1 1 K
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which, in polynomial form, is Let E
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m Σl=0 because a l = (a m+1 − 1)
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Evaluating the syndromes, we obtain
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FIGURE 34.63 Interleaving m times o
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Operating System © 2002 by CRC Pre
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systems, the most notable example b
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35.3 Components of Distributed Oper
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Message-passing IPC shares many cha
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process at any arbitrary stage in i
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Few attempts were made in the past
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alternate years with SOSP), and the
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© 2002 by CRC Press LLC 42 Mobile
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FIGURE 36.1 were introduced; howeve
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FPGAs by providing on-chip memory f
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FIGURE 36.3 There is a considerable
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FIGURE 36.4 The general form of the
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FIGURE 36.6 If a VPB can cover all
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John Morris University of Western A
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FIGURE 37.1 Simplified block diagra
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inverters, and the programmable mul
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Programmable Active Memories (PAM)
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measured in megabits, not megabytes
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from modern FPGAs, e.g., Altera’s
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Regularity A processing pipeline wi
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Other Languages Other routes from h
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29. Bergmann, N.W., and Dawood, A.,
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FIGURE 37.8 Basic architectures for
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Selected Applications Several class
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Development Systems Developing appl
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implementation. Reconfigurable or r
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The designer starts the generation
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lock but allows multiple instructio
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data-types that are mapped to TIE r
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Conclusions Configurable and extens
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FIGURE 38.1 Average vehicle speed.
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AHS means advanced cruise-assist hi
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TABLE 38.3 navigation systems VICS
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FIGURE 38.9 FIGURE 38.10 a map data
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FIGURE 38.13 The four basic functio
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Support of Safe Driving System The
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System evaluation, the fourth issue
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FIGURE 38.18 Summarizing the three
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uilder tools serving to build MMI o
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FIGURE 38.23 FIGURE 38.24 automaker
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FIGURE 38.26 FIGURE 38.27 The first
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FIGURE 38.30 FIGURE 38.31 a kind of
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To Probe Further In this field, the
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FIGURE 39.1 of more versatile media
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1 • 3DNow! 1 [11,12] from AMD,
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FIGURE 39.6 In the packed add instr
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If saturation arithmetic is used in
Page 1088 and 1089:
TABLE 39.1 Examples of Operations T
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FIGURE 39.10 PAVG R c, R a, R b: Pa
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FIGURE 39.13 Packed compare instruc
Page 1094 and 1095:
FIGURE 39.17 Packed multiply high i
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FIGURE 39.20 Packed multiply left i
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FIGURE 39.23 In the packed multiply
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TABLE 39.4 Packed Integer Multiplic
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Subword Permutation Instructions In
Page 1104 and 1105:
is n log 2(n). Table 39.6 shows how
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FIGURE 39.33 Mix left instruction.
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TABLE 39.7 Subword Permutation Inst
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TABLE 39.9 IA-64 uses FPMA and FPMS
Page 1112 and 1113:
The two-bit result field is written
Page 1114 and 1115:
source register. These three FP mix
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13. Motorola, “AltiVec technology
Page 1118 and 1119:
FIGURE 39.48 ManArray 1 × 2 core e
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FIGURE 39.50 Hypercube interconnect
Page 1122 and 1123:
FIGURE 39.53 Host DSP software laye
Page 1124 and 1125:
Benchmark Data Type Performance 256
Page 1126 and 1127:
FIGURE 39.56 Simplified schematic o
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Gaming applications often require a
Page 1130 and 1131:
system, and the application program
Page 1132 and 1133:
FIGURE 39.60 FIGURE 39.61 FIGURE 39
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FIGURE 39.64 shifting place limits
Page 1136 and 1137:
FIGURE 39.66 pitch Address Looping
Page 1138 and 1139:
FIGURE 39.69 gain of the filter. It
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as a core to integrate onto the sam
Page 1142 and 1143:
7. Rossum, D., Constraint based aud
Page 1144 and 1145:
FIGURE 39.74 Procedure for simulate
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The fitness value of an individual
Page 1148 and 1149:
FIGURE 39.77 The tabu list can be v
Page 1150 and 1151:
Intermediate-term memory component
Page 1152 and 1153:
FIGURE 39.81 Selection. FIGURE 39.8
Page 1154 and 1155:
Work on parallelization of the tabu
Page 1156 and 1157:
Acknowledgment The authors acknowle
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47. L. K. Grover. A new Simulated A
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93. E. M. Rudnick, J. H. Patel, G.
Page 1162 and 1163:
138. Youn-Long Lin, Yu-Chin Hsu, an
Page 1164 and 1165:
This architecture allowed for large
Page 1166 and 1167:
FIGURE 40.3 40.3 Application Server
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FIGURE 40.5 applications. CORBA cur
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FIGURE 40.8 The application server
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FIGURE 40.10 The proposed architect
Page 1174 and 1175:
cost at the front end. The ideal ap
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FIGURE 40.12 Client-server and netw
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Yoshiaki Hagiwara Sony Corporation
Page 1180 and 1181:
FIGURE 41.2 This corresponds to the
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FIGURE 41.5 Buried channel CCD stru
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FIGURE 41.8 Applications of CCD and
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sensor (1100 K pixel) Microphone ×
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�� FIGURE 41.14 Form com
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FIGURE 41.16 Stack technology. Link
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1st EmDRAM Product FIGURE 41.19 Emb
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FIGURE 41.23 Em-DRAM process techno
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John F. Alexander University of Nor
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Several reasons exist for mentionin
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sort of local area network. Support
Page 1202 and 1203:
Technological hurdles must be overc
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FIGURE 42.1 Block diagram of (a) ge
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FIGURE 42.3 Alternative FIR filter
Page 1208 and 1209:
FIGURE 42.5 Polyphase filter struct
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3. E. Dahlman, Bjorn Gudmundson, M.
Page 1212 and 1213:
TABLE 42.1 Categorizing Reusable Co
Page 1214 and 1215:
FIGURE 42.11 Internet growth. FIGUR
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FIGURE 42.13 Software for VoIP SoC.
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FIGURE 42.17 Bandwidth trends. FIGU
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The interconnections between the va
Page 1222 and 1223:
FIGURE 42.21 A typical communicatio
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carry information over longer dista
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however, it is not uncommon that so
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node, to which the user is connecte
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its information. Intuitively, this
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This issue is referred to as latenc
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Evolution of Standard Image/Video C
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FIGURE 42.26 Sequence of zigzag-cod
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FIGURE 42.29 150th Frame of origina
Page 1240 and 1241:
FIGURE 42.31 Data partitioning for
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for transmitting a predictively cod
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42.6 Pen-Based User Interfaces—An
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FIGURE 42.35 The handwriting recogn
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• No toggling between edit/contro
Page 1250 and 1251:
FIGURE 42.39 Boxplots of time to en
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0 … 9 ( ) -
Page 1254 and 1255:
is using the SMIL generic media ref
Page 1256 and 1257:
FIGURE 42.47 Example of pen-and-pap
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slots specifying pieces of informat
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most stringent demands for low-powe
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FIGURE 42.51 MIPS requirement of se
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FIGURE 42.54 von Neumann architectu
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FIGURE 42.57 Dual Mac architecture
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FIGURE 42.59 Two data path variatio
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FIGURE 42.60 Basic pipeline archite
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References 1. Bahl L., Cocke J., Je
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Random Oracle Model One direction o
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at the end of its usefulness. A new
Page 1278 and 1279:
function and verification function
Page 1280 and 1281:
underlies the Diffie-Hellman key ag
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31. Dolev, D., Dwork, C., and Naor,
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R. Chandramouli Synopsys Inc. 44.1
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many deficiencies in the design may
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impact the performance and test ove
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FIGURE 44.4 FIGURE 44.5 It becomes
Page 1292 and 1293:
SoC methodologies require synchroni
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This method, however, lacks the app
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FIGURE 45.2 Input formats of MILEF
Page 1298 and 1299:
FIGURE 45.3 FIGURE 45.4 Robustness
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FIGURE 45.5 In Fig. 45.5 a simple e
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difficult to identify for overcurre
Page 1304 and 1305:
General Approach in Comparison with
Page 1306 and 1307:
FIGURE 45.10 phase—the propagatio
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shorter test sequence could possibl
Page 1310 and 1311:
Looking at results of Table 45.6, i
Page 1312 and 1313:
45.4 Summary Automatic test pattern
Page 1314 and 1315:
41. F. Brglez, H. Fujiwara: A neutr
Page 1316 and 1317:
FIGURE 46.1 Rule of ten in testing
Page 1318 and 1319:
FIGURE 46.5 FIGURE 46.6 of the DUT.
Page 1320 and 1321:
FIGURE 46.7 generate tests for ever
Page 1322 and 1323:
FIGURE 46.9 FIGURE 46.10 behavioral
Page 1324 and 1325:
Z. Stamenković University of N. St
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FIGURE 47.2 Murphy’s Model The mo
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where k is the total number of crit
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FIGURE 47.5 Definition of IC critic
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distribution [34,35]: © 2002 by CR
Page 1334 and 1335:
and, in the case of w = X 2 − X 1
Page 1336 and 1337:
Algorithm • Input: a singly linke
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TRACIF takes a CIF file as input an
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TABLE 47.2 Critical Area Extraction
Page 1342 and 1343:
Also, the critical areas for lithog
Page 1344 and 1345:
(enhancement of the process cleanli
Page 1346 and 1347:
28. Corsi, F. and Martino, S., Defe
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U. Glaeser

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