U. Glaeser

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The cost impact of power consumption on packaging and cooling costs can be seen from the following data points. (The cost values are from the 1997 timeframe, but the relative trends still hold.) If the power consumption of a chip is under 1 W, a plastic package can be used for it, at the cost of about 1 cent per pin. If the power consumption is between 1 and 2 W, a plastic package can still be used, but special heat conductors are required. The cost for a package of this kind is approximately 2–3 cents per pin. Exceeding 2 W, however, requires the use of ceramic packages. These packages cost between 5 and 10 cents per pin. Exceeding 10 W requires external cooling (air or liquid cooling) and a further increase in cost. The package cost for a 200-pin device would therefore be either $2, $4–6, or $10–20, depending on whether its power consumption is below 1 W, between 1 and 2 W, or above 2 W. Moving up from one power consumption range to another is therefore accompanied by significant cost increases, which are significant if the devices are manufactured in large volumes. A specific consideration in this regard is to keep the power consumption below 2 W. This allows the use of plastic packages, which are much cheaper than the ceramic packages that are otherwise needed. Portable Systems The rising popularity of portable systems is primarily responsible for the upsurge in interest in power consumption in recent years. Portable systems include palmtop, laptop, notebook computers, telecommunication devices such as pagers, cellular phones, wireless modems, and consumer products such as audio players, video cameras, and electronic games. The defining characteristic of a portable system is that it is not connected to a fixed power source. It runs on the limited energy stored in a rechargeable battery. In any portable system, the length of battery driven operation (the battery life) is of prime importance. Longer battery life can provide a competitive advantage in the marketplace. In each of these applications, size, weight, and battery life are primary considerations. Low-power DSPs allow designers to extend battery life without the size and weight increases associated with more powerful batteries. The trend in portable devices is towards increased computational requirements. Portable computer users desire performance levels that are comparable to those of desktop systems. In addition, personal communication applications, with multimedia access supporting full-motion digital video and speech recognition capabilities are being proposed. What this implies is that portability can no longer be associated with limited computational rates. Meeting the increased energy requirements through use of larger and more batteries is not really an option. This increases the size and the weight—parameters that are also extremely important in portable systems. Increasing the amount of energy stored in the batteries (the battery capacity) is one way to solve the problem; however, growth in rechargeable battery capacity has been slow. Incremental improvements in nickel-cadmium (NiCd) technology, the mainstay of portable power, have led to about the doubling of capacity over the last 30 years. Newer battery chemistries, such as nickel-metal hydride (NiMH) are expected to have 20–30% higher capacity. Thus, battery capacity has increased by a factor of less than 4 over the last three decades. Recently, the ever-growing market for portable systems has motivated a faster rate of innovation in the battery industry. Lithium-ion, a newer technology, is rapidly gaining popularity since it allows lighter batteries with higher capacities. This may change with even newer battery technologies such as lithium-polymer, and zinc-air, which are claimed to have 2 and 10 times higher capacity than NiMH, respectively. In any case, growth in battery capacity lags far behind the rapid growth in microprocessor power consumption, which has gone from under 1 W to over 50 W over the last 20 years. Thus, improvements in battery technology alone cannot be relied upon to meet the constraints of portable systems. The energy demand on the batteries has to be reduced. A noteworthy research project was recently completed at UC Berkeley, California. A butane-powered Wankel internal combustion engine with a generator about as small as a chip-cooling fan was developed to power a laptop for longer durations while enabling a very small weight increase. Although it is amusing to note that an IC (internal combustion) engine is powering the IC (integrated circuit), it will be worth watching to see the evolution of practicality and application of this technology, in view of its safe and hazard-free use. The engine reportedly pollutes only as much as a human body. © 2002 by CRC Press LLC
Data Center Issues The growth of the Internet is driving increased awareness of power in the server, communication, and networking domains. The trend is to pack more and more computational resources in smaller spaces. A typical data center consists of racks of computation equipment, each rack with a maximum of 42 slots, each slot 1 inches high. Because data center space is at a premium, the desire is to pack more computational resources per rack and more racks per square yard. This drives the need for power efficiency mainly due to the following: First, when there are constraints on how much power a data center can draw from the public power grid, increasing computation density of a data center can only be done if the power efficiency of the equipment increases; second, it has been estimated that as much as 25% of the total cost of running a data center is directly related to power consumption (the cost of cooling, power delivery equipment, and the net consumption of electricity). Power has thus become a major design constraint for servers and high-performance communication and networking equipment. 3 /4 Reliability Issues Certain issues related to reliable operation of ICs are directly related to the power drain of the on-chip circuits. Electromigration is one such issue. Under high electrical currents, the atoms in the metal power supply line may migrate, leading to electrical shorts and breakages. Reliable design of the power grid therefore requires a careful analysis of the current flow in different parts of the power grid. Reliable operation of ICs also requires verifiable electrical behavior. Some electrical verification problems are directly related to power consumption. The first of these is voltage drops due to the resistance of power supply lines (also known as the iR problem). These drops lead to power supply DC voltage differences between the driver and receiver circuits. Thus, portions of the chip would receive a lower supply voltage than what they are designed for. In addition, transient currents drawn by one set of circuits causes transient noise in the supply rail of another and this noise can be only reduced by bulky capacitors. (But one cannot eliminate the perturbations.) The inductance of the power supply lines is the other problem. Rapid variation in the current flow on these lines can also lead to voltage variations (also known as the supply bounce or L .di/dt problem) that can affect the operation of the receiver circuits. The above problems necessitate specialized power analysis and design tools. They also require tools to help avoid these problems, e.g., power line sizing tools. Increasing frequencies and device counts, coupled with shrinking feature sizes, will only exacerbate these problems [2]. Reduction in the total power consumption, on the other hand, helps to alleviate the impact of these problems. Environmental Considerations Concerns about the environmental impact of the electricity consumed by computers are providing additional motivation for low power design. The U.S. Environmental Protection Agency (EPA) estimates that computers are a leading cause of the increased electricity demands in the U.S., accounting for about 5% of commercial demand (the figure is expected to reach 10% by the end of the decade). At present, PCs and their peripherals consume about $2 billion worth of electricity annually, and indirectly produce as much carbon-dioxide as 5 million cars. Also, of the total office equipment electricity consumption, 80% comes from PCs, monitors, and printers [2]. A large part of this is wasteful power consumption, coming from systems that are left turned on even when not in use. In order to encourage the development of power-saving systems, the EPA created the “Energy Star Program.” The requirements of this program state that each of a PC’s main elements (CPU unit, monitor, and printer) should consume less than 30 W when they are idle, i.e., not being used. In return, PC vendors can use the “Energy Star” logo and market their systems as being “Energy Star Compliant.” It is expected that being identified as an energy-wise or “Green” PC will provide a competitive edge over otherwise comparable, but “non-Green,” systems. There is even a political angle here. The President of the United States has declared a goal for the U.S. government to buy only PCs that qualify for the Energy Star Program. © 2002 by CRC Press LLC
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© 2002 by CRC Press LLC
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© 2002 by CRC Press LLC Fernanda p
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Locating Your Topic Several avenues
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Krste Asanovic Massachusetts Instit
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7 8 9 Architectures for Low Power P
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SECTION VII Communications and Netw
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45 Testing of Synchronous Sequentia
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Hiroshi Iwai Tokyo Institute of Tec
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FIGURE 1.2 FIGURE 1.3 © 2002 by CR
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1.2 Downsizing below 0.1 © 2002 by
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FIGURE 1.9 Subthreshold leakage cur
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FIGURE 1.13 Epitaxial channel [9].
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gate length reduction was accelerat
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of the prediction. Until only sever
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FIGURE 1.22 Clarke number of elemen
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1.5 Source and Drain Figure 1.25 sh
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FIGURE 1.27 Retrograde profile. FIG
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TABLE 1.6 Trend of Interconnect by
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TABLE 1.9a Trend of DRAM Cell: Stac
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FIGURE 1.36 Trend of gate length. F
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References 1. D. Kahng and M. M. At
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40. B. H. Lee, R. Choi, L. Kang, S.
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outputs of the gate regardless of t
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FIGURE 2.4 circuit. This is the bas
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FIGURE 2.8 Two different realizatio
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FIGURE 2.12 Multifunction circuitry
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Dynamic Logic Circuits The basic id
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transistors in the pull-down networ
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In Fig. 2.21(d), the cross-coupled
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FIGURE 2.23 Different configuration
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In some literature, the authors lik
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Concluding Remarks The feature size
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FIGURE 2.30 Other pass-transistor c
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FIGURE 2.34 Dual-rail, pass-transis
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Shannon expansion, as shown below,
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FIGURE 2.41 Logic circuit for Out =
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FIGURE 2.45 Example decomposed BDD.
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FIGURE 2.50 Diffusion-area sharing
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FIGURE 2.54 Relationship between co
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29. Shiple, T. R., Hojati, R., Sang
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FIGURE 2.58 DTMOS devices: (a) stan
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the design into a BDD representatio
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FIGURE 2.63 Circuit diagram of 2-in
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FIGURE 2.67 Synthesis of 2-input AN
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pass-transistor logic, constrained
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16. Bryant, R., Graph-based algorit
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As shown in Fig. 2.79, the MOSFET d
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n + SiO 2 FIGURE 2.80 No reverse bo
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structures are a powerful solution
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SiO 2 Epitaxial Si Double Layered P
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PD-SOI Application to High-Performa
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LO FIGURE 2.91 History effects. sta
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weight, lower cost, a wireless inte
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TABLE 2.7 Performance of sub-1 V MT
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X X FIGURE 2.99 1 V A/D converter u
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When the communication range is 10
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13. Nakashima, S., et al., Thicknes
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FIGURE 3.1 Conventional ECL circuit
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FIGURE 3.4 FIGURE 3.5 IPULL-DOWN, f
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FIGURE 3.7 V REG voltage regulator
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FIGURE 3.10 Layout of inverter gate
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FIGURE 3.14 Power consumption versu
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I/O Pads, is 60 mW for the multiple
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FIGURE 3.21 Maximum data rate vs. V
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John C. McCallum National Universit
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enchmark took between 15.7 and 5115
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The improvements in line widths, ch
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performance. Extensive lists of SPE
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TABLE 4.6 Functions of Memory and S
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Memory Price ($/MB) FIGURE 4.3 Cost
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TABLE 4.8 Disk Drive Characteristic
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4.6 Summary The performance of comp
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53. Curnow, H. J., and Wichmann, B.
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Computer Systems and Architecture
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advances that have been made in dev
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Server Types Servers are optimized
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Total Cost of Ownership Another con
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edundant memory-bit steering, and s
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majority of the users. Hardware opt
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processor implementations. In later
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FIGURE 5.7 an operand. For larger c
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Example 2 This example contrasts th
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Unlike the Defoe, the IA-64 archite
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This 3-phase approach fails to expl
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6. Scott Rixner, William J. Dally,
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Shared-memory vector architectures
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The vector ISA usually fixes the ma
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FIGURE 5.12 A vector unit construct
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use of loops optimized for certain
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9. Espasa, R., Advanced Vector Arch
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thread management (including run-ti
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In the message passing model, inter
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multithreaded hardware, possibly by
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synchronization) and usually contai
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a common register space, it is impo
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FIGURE 5.16 When a load request is
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list a few helpful references to wh
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38. S. Wallace, B. Calder, and D. T
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Of course, SIMD machines have limit
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computation, it will decrease execu
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FIGURE 5.19 An 8 × 8 baseline netw
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Since then, we have seen constant e
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Stack: Data: Text: Virtual Space FI
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FIGURE 5.25 Shared memory. Shared m
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0 2 GB Text Init. Data Bss Heap . .
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In general, if the necessary transl
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Mark Smotherman Clemson University
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Studies of Instruction-Level Parall
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Modern Designs Most high-performanc
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The principle of register renaming
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FIGURE 6.2 issued into the RS, (ii)
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Issue Dispatch FIGURE 6.4 The proce
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FIGURE 6.6 Scope of register renami
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FIGURE 6.9 State transition diagram
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Thus, the maximal number of instruc
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In addition, if rename buffers are
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it, whose role will be explained su
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As Fig. 6.13 shows, the latest proc
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for recovery. Both processors incor
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FIGURE C. The principle of direct i
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13. White, S. and Reysa, J., PowerP
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FIGURE 6.14 A branch flowing throug
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is that mispredictions limit the pr
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fetch engine to identify which inst
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FIGURE 6.17 A schematic for a bimod
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FIGURE 6.20 A schematic for a GAg g
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FIGURE 6.22 A schematic for a hybri
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time this branch is seen, those bit
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FIGURE 6.23 Branch prediction accur
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11. Price, C., MIPS IV Instruction
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transporting digital bits, whereas
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FIGURE 6.25 The system architecture
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Finally, because the main task of n
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Pradip Bose IBM T. J. Watson Resear
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frequency © 2002 by CRC Press LLC
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The “mips” metric for performan
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Hence, in this paper, we do not dwe
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FIGURE 7.4 Parallel SIMD architectu
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dynamic prediction of such idle mod
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FIGURE 7.7 High-level block-diagram
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(measured as a performance over pow
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Steady-state BIPS FIGURE 7.9 Perfor
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8. Larson, A. G., “Cost-effective
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Jozo J. Dujmović San Francisco Sta
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x FIGURE 8.1 Movement of the disk I
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The critical distance x ∗ is Ther
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Hence, the average seek time for th
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FIGURE 8.4 Four-parameter exponenti
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Access Time [ms] 2 0 0 FIGURE 8.6 M
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TABLE 8.1 Classification of Eight B
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The traditional load independent me
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Response Time [seconds] 290 270 250
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FIGURE 8.14 Prediction errors e(p)
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8.2 Performance Evaluation: Techniq
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is generally the most important mea
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tool to profile programs on the Alp
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driven simulation has two major pro
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A variety of profiling tools exist
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SPLASH, the SPLASH suite was create
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different types and complexity eith
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Table 8.8 provides sources for the
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37. MediaBench benchmarks, http://w
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(a) Instruction Cache (b) Trace Cac
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PE 0 Local Register File local bypa
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The large trace processor instructi
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11. S. Melvin, M. Shebanow, and Y.
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complement numbers. Sign magnitude
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where ak, bk, and ck are the inputs
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k + 1, etc. Extending to a third st
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a 12:15 b 12:15 4-Bit RCA s 12:15 F
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FIGURE 9.8 Two’s complement subtr
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FIGURE 9.10 Unsigned 6 by 6 array m
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Digit Recurrent Division The most c
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FIGURE 9.14 Nonrestoring division.
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The Newton-Raphson division algorit
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FIGURE 9.18 Floating-point addition
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9.2 Fast Adders and Multipliers Gen
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FIGURE 9.20 Half-adder circuit. is
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gi pi FIGURE 9.22(b) Carry skip cir
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Assuming that a single level of the
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Array-Type Multiplier The simplest
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p1i,j p2i,j p3i,j p4i,j FIGURE 9.27
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The partial product PP j is to be c
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The sum SGN of the whole extended b
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FIGURE 9.31 54 × 54-bit parallel m
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6. Svensson, C. and Tjarnstrom, R.,
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Design Techniques III 10 Timing and
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FIGURE 10.1 Typical chip interface.
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Loop Components PLLs and DLLs share
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delay is some fraction of the input
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esults from the voltage across the
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© 2002 by CRC Press LLC TABLE 10.2
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db(H( ω)) FIGURE 10.6 PLL closed-l
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ω )/G O) db(T(ω ph(T( )/π) FIGUR
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Phase Margin (deg) FIGURE 10.10 PLL
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FIGURE 10.11 Measured PLL jitter hi
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FIGURE 10.13 DLL output jitter sens
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FIGURE 10.18 PLL output jitter sens
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Active supply filters employ amplif
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FIGURE 10.19 Single-ended delay ele
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Frequency (GHz) FIGURE 10.23 Freque
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FIGURE 10.25 Push-pull charge pump.
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Circuit Summary In general, all DLL
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5. T. Lee, et al., “A 2.5V CMOS D
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introduced in [3], is used to repre
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FIGURE 10.31 Setup and hold time ti
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FIGURE 10.34 Max-timing diagrams fo
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FIGURE 10.37 Time borrowing for sin
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FIGURE 10.39 Max-timing for single-
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Min-Timing In contrast to max-timin
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FIGURE 10.46 Min-timing diagrams fo
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FIGURE 10.49 Edge-triggered, flip-f
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FIGURE 10.51 FIGURE 10.52 Max-timin
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FIGURE 10.53 Transparent-high latch
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FIGURE 10.57 Complementary TSPC tra
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FIGURE 10.61 A positive, edge-trigg
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FIGURE 10.66 Pulsed latches. FIGURE
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assigned, based on the subcircuit t
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FIGURE 10.71 Scan chain for dual-ph
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and SEB, which are complementary, c
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when used as a flip-flop, the NAND3
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FIGURE 10.75 Integrated memory for
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Memory Cell Bit# Bit FIGURE 10.78 A
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FIGURE 10.80 Modeling process varia
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FIGURE 10.83 A column circuit. FIGU
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advantage of this circuit, compared
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K. Wayne Current University of Cali
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11.2 Nonvolatile Multiple-Valued Me
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Multiple-Valued EEPROM and Flash Me
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Page 468 and 469: Current comparators are a critical
Page 470 and 471: FIGURE 11.4 Current-mode CMOS quate
Page 472 and 473: FIGURE 11.6 Current-mode CMOS quate
Page 474 and 475: observed with these circuits are ab
Page 476 and 477: FIGURE 11.11 Current-mode CMOS quat
Page 478 and 479: FIGURE 11.12 Current-mode CMOS latc
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Page 482 and 483: esults confirm the DC transfer func
Page 484 and 485: 19. T. T. Dao, “Threshold I2L and
Page 486 and 487: FIGURE 12.1 Device technologies use
Page 488 and 489: selected depending on the number of
Page 490 and 491: Architecture of Newer Generation FP
Page 492 and 493: FIGURE 12.6 An example of a simple
Page 494 and 495: tools, the + 1 operation is a speci
Page 496 and 497: download the programming data to th
Page 498 and 499: FIGURE 13.1 High-performance microp
Page 500 and 501: FIGURE 13.4 TABLE 13.1 combinationa
Page 502 and 503: accurate wire modelling while limit
Page 504 and 505: FIGURE 13.6 Dual-rail, multiple-out
Page 506 and 507: FIGURE 13.10 Effect of output inver
Page 508 and 509: FIGURE 13.11 Unfooted dynamic 4:1 m
Page 510 and 511: (4) the limit of designers to manag
Page 512 and 513: © 2002 by CRC Press LLC IV Design
Page 514 and 515: FIGURE 14.1 FIGURE 14.2 newer semic
Page 518 and 519: In any case, the move toward “Gre
Page 520 and 521: This static current is obviously un
Page 522 and 523: 14.2 Power Estimation As we saw in
Page 524 and 525: lock as a function of various param
Page 526 and 527: FIGURE 14.8 Sleep transistors to co
Page 528 and 529: FIGURE 14.12 Data enabling. In addi
Page 530 and 531: Power Reduction through CAD Tools P
Page 532 and 533: AMPS AMPS is a circuit power optimi
Page 534 and 535: Masayuki Miyazaki Hitachi, Ltd. 15.
Page 536 and 537: 15.3 Supply Voltage Management Supp
Page 538 and 539: FIGURE 15.4 MT-CMOS balloon circuit
Page 540 and 541: FIGURE 15.9 EVT-CMOS circuit design
Page 542 and 543: FIGURE 15.12 VT-CMOS block diagram
Page 544 and 545: FIGURE 15.15 SA-V t CMOS scheme wit
Page 546 and 547: FIGURE 15.17 Floating-point datapat
Page 548 and 549: Vivek De Intel Corporation Ali Kesh
Page 550 and 551: FIGURE 16.3 n-channel ID vs. VG sho
Page 552 and 553: Gate-Induced Drain Leakage (I 4) GI
Page 554 and 555: FIGURE 16.7 Two-nMOS stack in a two
Page 556 and 557: FIGURE 16.11 Four-input NAND NMOS s
Page 558 and 559: FIGURE 16.12 Distribution of standb
Page 560 and 561: Die count FIGURE 16.16 (a) Adaptive
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the parameter to be maximized since
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17.3 Dynamically Varying Voltage If
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The voltage converter required for
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FIGURE 17.7 DVS improvement for UI
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FIGURE 17.10 Measured throughput vs
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FIGURE 17.12 Sources of noise margi
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FIGURE 17.15 Ring oscillator adapti
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FIGURE 17.17 Sense-amp delay variat
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Christian Piguet CSEM: Centre Suiss
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Some Basic Rules There are some bas
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TABLE 18.2 Looped 8-bit Multiply Pr
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FIGURE 18.4 new architecture paradi
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FIGURE 18.6 FIGURE 18.7 the second
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FIGURE 18.9 FIGURE 18.10 With latch
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18.6 Low-Power Memories As memories
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connected to the main bitline (only
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is today only about a factor of 2 d
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Katsunori Seno SONY Corporation 19.
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FIGURE 19.2 FIGURE 19.3 This is a c
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FIGURE 19.6 FIGURE 19.7 FPGA sacrif
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FIGURE 19.9 RAWn precharge FIGURE 1
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a fixed given standard. References
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Hendrawan Soeleman Purdue Universit
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for a short period of time when bot
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Total Average Power Putting togethe
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Signal Probability Calculation In c
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Example Given y = x 1 + x 2. Find P
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A B F FIGURE 20.7 Unfactorized and
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etween successive transitions is a
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FIGURE 20.9 A logic gate and its co
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Results Using Probabilistic Techniq
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FIGURE 20.12 Probabilistic and stat
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14. VLSI Microprocessors: A Guide t
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0 V to a voltage V in time T throug
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a small fraction of circuit nodes t
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FIGURE 21.6 (a) E-R latch, (b) timi
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FIGURE 21.8 Potential E-R latch for
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The only difference between the two
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FIGURE 21.14 (a) Clock-powered stat
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FIGURE 21.17 The three drivers used
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FIGURE 21.20 Energy-delay product (
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FIGURE 21.22 AC-1 clock-driver sche
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clock-powered nodes accounted for 8
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Two generations of clock-powered mi
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29. Athas, W. C., Tzartzanis, N., M
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Wayne Wolf Princeton University 22.
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so a CPU could be built in reconfig
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optimized processes. Although embed
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FIGURE 22.4 they are most useful wh
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• How should processes be allocat
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25 memory system activity. If the c
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Jonathan W. Valvano University of T
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FIGURE 23.2 6808, I/O ports A and B
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personnel so that they are proficie
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BDM can provide the ability to obse
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minor modifications to the finite s
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Many components are included in a d
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will saturate resulting in a bang-b
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Two approaches are used to synchron
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Fred J. Taylor University of Florid
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The output of a linear system havin
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FIGURE 24.2 Effects of windowing an
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frequency range ±f Nyquist = ±f s
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performance, complexity, and precis
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overflows of intermediate sums. Tha
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24.7 Applications “DSP” has bec
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DSP (Digital Signal Processor) or D
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PC as a Terminal (Modem) The PC is
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characteristics: • Fixed pictures
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HDTV (and Digital Television) If th
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Modem Banks This is the first of th
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25.7 Automotive, Industrial Althoug
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36. MITEL Semiconductor: www.semico
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26.2 Digital Filters The theory of
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|H | 1 FIGURE 26.1 Frequency select
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TABLE 26.1 Filter Design Comparison
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frequency response involves some al
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Impulse Response 0.2 0.15 0.1 0.05
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This constrained magnitude problem
Page 724 and 725:
FIGURE 26.8 Block diagram of the ge
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11. Ikehara, M., Tanaka, H., and Ku
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Adam Dabrowski Poznan University To
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−12 2 The reference in this case
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FIGURE 27.1 Two-band filter bank: (
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FIGURE 27.5 Critical bandwidth and
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FIGURE 27.7 Threshold of audibility
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FIGURE 27.10 Critical band index in
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FIGURE 27.13 Simplified model of th
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All described masking effects are e
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where From Eqs. (27.32) and (27.33)
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eal-time. Although floating-point p
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FIGURE 27.19 Overlapped, power comp
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FIGURE 27.21 Symmetrical FIR filter
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In the MPEG-1 encoder an efficient
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These first two approaches can be m
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FIGURE 27.27 ADPCM: (a) encoder, (b
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FIGURE 27.30 General scheme of the
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A new standard MPEG-7, named the mu
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FIGURE 27.32 AC-3 encoder. FIGURE 2
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29. Marven, C. and Ewers, G., A sim
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FIGURE 28.1 FIGURE 28.2 of the huma
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FIGURE 28.5 image of reasonable qua
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Consider the case of a simple 2-D
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FIGURE 28.8 A sampled spatiotempora
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oth high spatial frequency componen
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If it were separable (that is, H(ξ
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The first hypothesis (the less plau
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FIGURE 28.17 The real (top) and ima
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FIGURE 28.18 The resolution of a ti
Page 784 and 785:
FIGURE 28.20 Motion estimation by b
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where the superscripts n and n + 1
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must be found via a finite set of o
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The methods in this subsection are
Page 792 and 793:
FIGURE 28.28 The split phase. Using
Page 794 and 795:
35. Y.-T. Wu, T. Kanade, J. Cohn, a
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29.2 Power Dissipation in Digital C
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additional power benefits. Efficien
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Power savings are higher than simpl
Page 802 and 803:
A priori knowledge of data stream d
Page 804 and 805:
FIGURE 29.7 DCT Chip [my DCT] avera
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19. S. Uramoto et al. A 100 MHz 2-D
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Anna Hać University of Hawaii 30.1
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Using TCP/IP also makes the network
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this is for one mobile host which i
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TDMA Time-division multiple access
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path delay. The two measures of the
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are under the control of the system
Page 820 and 821:
the bandwidth reserved in the targe
Page 822 and 823:
Chik-Kong Ken Yang University of Ca
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FIGURE 31.3 attenuation (dB) -3.0 -
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FIGURE 31.5 to handle large voltage
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p_o V bias FIGURE 31.8 High-impedan
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out[n] a0 FIGURE 31.11 Transmitter
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FIGURE 31.15 Receiver design using
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digitally by first feeding the inpu
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FIGURE 31.19 90 o locking using XOR
Page 838 and 839:
Power of these links is becoming an
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46. Takahashi, T. et al., “A CMOS
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Many computer programs exhibit some
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32.3 Related Memory Models, Hierarc
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32.6 External Sorting and Related P
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uns, each striped across the disks.
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Matrix transposition is the special
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of satellite images is over one ter
Page 854 and 855:
TABLE 32.3 Best Known I/O Bounds fo
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e accessed directly in a single I/O
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implementations of priority queues
Page 860 and 861:
By the reduction in [52], a data st
Page 862 and 863:
set of experiments on various text
Page 864 and 865:
3. A. Acharya, M. Uysal, and J. Sal
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44. J. L. Bentley and J. B. Saxe. D
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85. P. Ferragina and F. Luccio. Dyn
Page 870 and 871:
128. V. Kumar and E. Schwabe. Impro
Page 872 and 873:
173. H. Samet. The Design and Analy
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Peter J. Varman Rice University 33.
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need for fast transfers, up to 1 Gb
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In contrast to prefetching that mas
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The ERF algorithm was analyzed in [
Page 882 and 883:
increment lowestPriorityOnDisk(disk
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External or out-of-core algorithms
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33. M. Kallahalla and P. J. Varman.
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advanced, reaching the point where
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FIGURE 34.3 FIGURE 34.4 defines the
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FIGURE 34.5 Trellis representation
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FIGURE 34.7 Data and servo sectors.
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References 1. S. H. Charrap, P. L.
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High-frequency noise is then remove
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The various components of (34.3) ar
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sequences are more complex, and occ
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ange of 10 −12 -10 −15 . Anothe
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strategies are reviewed, which have
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FIGURE 34.13 Magnitude response for
Page 910 and 911:
taps as an approximation of the Typ
Page 912 and 913:
FIGURE 34.18 CTF BER performance de
Page 914 and 915:
TABLE 34.1 Examples of Equalizers I
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(i) Symbol rate VCO based timing re
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Symbol Rate Timing Recovery Schemes
Page 920 and 921:
where B = B 1 + B 2 + 1 is the size
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in � out � d(k) FIGURE 34.26 Ti
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�(k) z -L FIGURE 34.27 Linearized
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10 −4 and 10 −2 . The steady-st
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16. J. Sonntag, et al., “A high s
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y a special sequence known as the a
Page 932 and 933:
FIGURE 34.36 An example of two Gray
Page 934 and 935:
track n track n +1 FIGURE 34.38 The
Page 936 and 937:
FIGURE 34.40 The phase format. Posi
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increase linear density while mitig
Page 940 and 941:
FIGURE 34.43 Two equivalent constra
Page 942 and 943:
FIGURE 34.44 Possible pairs of sequ
Page 944 and 945:
Distance δ min,C can be bounded as
Page 946 and 947:
FIGURE 34.45 Standard concatenation
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30. E. Soljanin, “On-track and of
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The next block is PRE. What is PR?
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In the above example, we see that s
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FIGURE 34.52 Feedback detector. Cat
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FIGURE 34.54 Decision feedback equa
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esponse (this is also valid for dif
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its use, while the computational, o
Page 962 and 963:
FIGURE 34.58 Viterbi algorithm dete
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Noise-Predictive Maximum Likelihood
Page 966 and 967:
The error event likelihoods are cal
Page 968 and 969:
Metric-First Algorithms Metric-firs
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termination at the same time. Howev
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13. J. Hagenauer, “Applications o
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Given a code C of length n and dime
Page 976 and 977:
Notice that, although a code may ha
Page 978 and 979:
Not many perfect codes exist. In th
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Theorem 1 (Shannon) For any � > 0
Page 982 and 983:
If we write the codewords as polyno
Page 984 and 985:
Let © 2002 by CRC Press LLC 1 1 K
Page 986 and 987:
which, in polynomial form, is Let E
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m Σl=0 because a l = (a m+1 − 1)
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Evaluating the syndromes, we obtain
Page 992 and 993:
FIGURE 34.63 Interleaving m times o
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Operating System © 2002 by CRC Pre
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systems, the most notable example b
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35.3 Components of Distributed Oper
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Message-passing IPC shares many cha
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process at any arbitrary stage in i
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Few attempts were made in the past
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alternate years with SOSP), and the
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© 2002 by CRC Press LLC 42 Mobile
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FIGURE 36.1 were introduced; howeve
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FPGAs by providing on-chip memory f
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FIGURE 36.3 There is a considerable
Page 1016 and 1017:
FIGURE 36.4 The general form of the
Page 1018 and 1019:
FIGURE 36.6 If a VPB can cover all
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John Morris University of Western A
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FIGURE 37.1 Simplified block diagra
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inverters, and the programmable mul
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Programmable Active Memories (PAM)
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measured in megabits, not megabytes
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from modern FPGAs, e.g., Altera’s
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Regularity A processing pipeline wi
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Other Languages Other routes from h
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29. Bergmann, N.W., and Dawood, A.,
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FIGURE 37.8 Basic architectures for
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Selected Applications Several class
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Development Systems Developing appl
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implementation. Reconfigurable or r
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The designer starts the generation
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lock but allows multiple instructio
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data-types that are mapped to TIE r
Page 1052 and 1053:
Conclusions Configurable and extens
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FIGURE 38.1 Average vehicle speed.
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AHS means advanced cruise-assist hi
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TABLE 38.3 navigation systems VICS
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FIGURE 38.9 FIGURE 38.10 a map data
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FIGURE 38.13 The four basic functio
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Support of Safe Driving System The
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System evaluation, the fourth issue
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FIGURE 38.18 Summarizing the three
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uilder tools serving to build MMI o
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FIGURE 38.23 FIGURE 38.24 automaker
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FIGURE 38.26 FIGURE 38.27 The first
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FIGURE 38.30 FIGURE 38.31 a kind of
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To Probe Further In this field, the
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FIGURE 39.1 of more versatile media
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1 • 3DNow! 1 [11,12] from AMD,
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FIGURE 39.6 In the packed add instr
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If saturation arithmetic is used in
Page 1088 and 1089:
TABLE 39.1 Examples of Operations T
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FIGURE 39.10 PAVG R c, R a, R b: Pa
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FIGURE 39.13 Packed compare instruc
Page 1094 and 1095:
FIGURE 39.17 Packed multiply high i
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FIGURE 39.20 Packed multiply left i
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FIGURE 39.23 In the packed multiply
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TABLE 39.4 Packed Integer Multiplic
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Subword Permutation Instructions In
Page 1104 and 1105:
is n log 2(n). Table 39.6 shows how
Page 1106 and 1107:
FIGURE 39.33 Mix left instruction.
Page 1108 and 1109:
TABLE 39.7 Subword Permutation Inst
Page 1110 and 1111:
TABLE 39.9 IA-64 uses FPMA and FPMS
Page 1112 and 1113:
The two-bit result field is written
Page 1114 and 1115:
source register. These three FP mix
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13. Motorola, “AltiVec technology
Page 1118 and 1119:
FIGURE 39.48 ManArray 1 × 2 core e
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FIGURE 39.50 Hypercube interconnect
Page 1122 and 1123:
FIGURE 39.53 Host DSP software laye
Page 1124 and 1125:
Benchmark Data Type Performance 256
Page 1126 and 1127:
FIGURE 39.56 Simplified schematic o
Page 1128 and 1129:
Gaming applications often require a
Page 1130 and 1131:
system, and the application program
Page 1132 and 1133:
FIGURE 39.60 FIGURE 39.61 FIGURE 39
Page 1134 and 1135:
FIGURE 39.64 shifting place limits
Page 1136 and 1137:
FIGURE 39.66 pitch Address Looping
Page 1138 and 1139:
FIGURE 39.69 gain of the filter. It
Page 1140 and 1141:
as a core to integrate onto the sam
Page 1142 and 1143:
7. Rossum, D., Constraint based aud
Page 1144 and 1145:
FIGURE 39.74 Procedure for simulate
Page 1146 and 1147:
The fitness value of an individual
Page 1148 and 1149:
FIGURE 39.77 The tabu list can be v
Page 1150 and 1151:
Intermediate-term memory component
Page 1152 and 1153:
FIGURE 39.81 Selection. FIGURE 39.8
Page 1154 and 1155:
Work on parallelization of the tabu
Page 1156 and 1157:
Acknowledgment The authors acknowle
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47. L. K. Grover. A new Simulated A
Page 1160 and 1161:
93. E. M. Rudnick, J. H. Patel, G.
Page 1162 and 1163:
138. Youn-Long Lin, Yu-Chin Hsu, an
Page 1164 and 1165:
This architecture allowed for large
Page 1166 and 1167:
FIGURE 40.3 40.3 Application Server
Page 1168 and 1169:
FIGURE 40.5 applications. CORBA cur
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FIGURE 40.8 The application server
Page 1172 and 1173:
FIGURE 40.10 The proposed architect
Page 1174 and 1175:
cost at the front end. The ideal ap
Page 1176 and 1177:
FIGURE 40.12 Client-server and netw
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Yoshiaki Hagiwara Sony Corporation
Page 1180 and 1181:
FIGURE 41.2 This corresponds to the
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FIGURE 41.5 Buried channel CCD stru
Page 1184 and 1185:
FIGURE 41.8 Applications of CCD and
Page 1186 and 1187:
sensor (1100 K pixel) Microphone ×
Page 1188 and 1189:
�� FIGURE 41.14 Form com
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FIGURE 41.16 Stack technology. Link
Page 1192 and 1193:
1st EmDRAM Product FIGURE 41.19 Emb
Page 1194 and 1195:
FIGURE 41.23 Em-DRAM process techno
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John F. Alexander University of Nor
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Several reasons exist for mentionin
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sort of local area network. Support
Page 1202 and 1203:
Technological hurdles must be overc
Page 1204 and 1205:
FIGURE 42.1 Block diagram of (a) ge
Page 1206 and 1207:
FIGURE 42.3 Alternative FIR filter
Page 1208 and 1209:
FIGURE 42.5 Polyphase filter struct
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3. E. Dahlman, Bjorn Gudmundson, M.
Page 1212 and 1213:
TABLE 42.1 Categorizing Reusable Co
Page 1214 and 1215:
FIGURE 42.11 Internet growth. FIGUR
Page 1216 and 1217:
FIGURE 42.13 Software for VoIP SoC.
Page 1218 and 1219:
FIGURE 42.17 Bandwidth trends. FIGU
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The interconnections between the va
Page 1222 and 1223:
FIGURE 42.21 A typical communicatio
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carry information over longer dista
Page 1226 and 1227:
however, it is not uncommon that so
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node, to which the user is connecte
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its information. Intuitively, this
Page 1232 and 1233:
This issue is referred to as latenc
Page 1234 and 1235:
Evolution of Standard Image/Video C
Page 1236 and 1237:
FIGURE 42.26 Sequence of zigzag-cod
Page 1238 and 1239:
FIGURE 42.29 150th Frame of origina
Page 1240 and 1241:
FIGURE 42.31 Data partitioning for
Page 1242 and 1243:
for transmitting a predictively cod
Page 1244 and 1245:
42.6 Pen-Based User Interfaces—An
Page 1246 and 1247:
FIGURE 42.35 The handwriting recogn
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• No toggling between edit/contro
Page 1250 and 1251:
FIGURE 42.39 Boxplots of time to en
Page 1252 and 1253:
0 … 9 ( ) -
Page 1254 and 1255:
is using the SMIL generic media ref
Page 1256 and 1257:
FIGURE 42.47 Example of pen-and-pap
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slots specifying pieces of informat
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most stringent demands for low-powe
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FIGURE 42.51 MIPS requirement of se
Page 1264 and 1265:
FIGURE 42.54 von Neumann architectu
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FIGURE 42.57 Dual Mac architecture
Page 1268 and 1269:
FIGURE 42.59 Two data path variatio
Page 1270 and 1271:
FIGURE 42.60 Basic pipeline archite
Page 1272 and 1273:
References 1. Bahl L., Cocke J., Je
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Random Oracle Model One direction o
Page 1276 and 1277:
at the end of its usefulness. A new
Page 1278 and 1279:
function and verification function
Page 1280 and 1281:
underlies the Diffie-Hellman key ag
Page 1282 and 1283:
31. Dolev, D., Dwork, C., and Naor,
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R. Chandramouli Synopsys Inc. 44.1
Page 1286 and 1287:
many deficiencies in the design may
Page 1288 and 1289:
impact the performance and test ove
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FIGURE 44.4 FIGURE 44.5 It becomes
Page 1292 and 1293:
SoC methodologies require synchroni
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This method, however, lacks the app
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FIGURE 45.2 Input formats of MILEF
Page 1298 and 1299:
FIGURE 45.3 FIGURE 45.4 Robustness
Page 1300 and 1301:
FIGURE 45.5 In Fig. 45.5 a simple e
Page 1302 and 1303:
difficult to identify for overcurre
Page 1304 and 1305:
General Approach in Comparison with
Page 1306 and 1307:
FIGURE 45.10 phase—the propagatio
Page 1308 and 1309:
shorter test sequence could possibl
Page 1310 and 1311:
Looking at results of Table 45.6, i
Page 1312 and 1313:
45.4 Summary Automatic test pattern
Page 1314 and 1315:
41. F. Brglez, H. Fujiwara: A neutr
Page 1316 and 1317:
FIGURE 46.1 Rule of ten in testing
Page 1318 and 1319:
FIGURE 46.5 FIGURE 46.6 of the DUT.
Page 1320 and 1321:
FIGURE 46.7 generate tests for ever
Page 1322 and 1323:
FIGURE 46.9 FIGURE 46.10 behavioral
Page 1324 and 1325:
Z. Stamenković University of N. St
Page 1326 and 1327:
FIGURE 47.2 Murphy’s Model The mo
Page 1328 and 1329:
where k is the total number of crit
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FIGURE 47.5 Definition of IC critic
Page 1332 and 1333:
distribution [34,35]: © 2002 by CR
Page 1334 and 1335:
and, in the case of w = X 2 − X 1
Page 1336 and 1337:
Algorithm • Input: a singly linke
Page 1338 and 1339:
TRACIF takes a CIF file as input an
Page 1340 and 1341:
TABLE 47.2 Critical Area Extraction
Page 1342 and 1343:
Also, the critical areas for lithog
Page 1344 and 1345:
(enhancement of the process cleanli
Page 1346 and 1347:
28. Corsi, F. and Martino, S., Defe
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