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I/O Pads, is 60 mW for the multiplexer and 80 mW for the demultiplexer, both from −2 V power supply. The multiplexer occupies 0.132 mm 2 , and the demultiplexer occupies 0.163 mm 2 , both without I/O Pads. Measured eye diagrams at the outputs are also presented in Figs. 3.19 and 3.20. Figure 3.21 shows the error-free maximum operating speed of 1.65 Gb/s for the multiplexer and 1.80 Gb/s for the demultiplexer. The LV-ECL circuit tolerates ±5% variations in supply voltage with no significant degradation in speed. In these tests, a pseudo-random bit sequence of length 2 23 − 1 is applied at the input. V OH shows 1.4 mV/°C temperature dependence, the same as that in the conventional ECL. V OL exhibits −0.7 mV/°C over a range of 0–75°C, and 3 mV/°C for the range of 75–125°C. As a consequence, the output voltage swing is 0.17 V © 2002 by CRC Press LLC TABLE 3.1 4:1 MUX Gate Performance Comparison Min. VEE (V) Power (mW) Delay (ps) PD (pJ) Element Tran. Count Res. Conventional ECL 3-level series gating −4.0 5.6 440 2.46 29 9 2-level series gating −3.1 9.3 440 4.14 45 21 LV-ECL −2.0 3.2 460 1.47 26 21 FIGURE 3.17 4:1 MUX gate in LV-ECL. FIGURE 3.18 Toggle flip-flop in LV-ECL.
FIGURE 3.19 4:1 multiplexer block diagram and output eye diagram. FIGURE 3.20 1:4 demultiplexer block diagram and output eye diagram. at 0°C, 0.28 V at 50°C, and 0.24 V at 125°C. Bipolar transistors in the third level enter the soft saturation region above 75°C. If minimum |V EE| is 2.2 V, V CS can be 0.4 V and a bipolar current source circuit can be used instead of the resistor to provide much higher immunity to variations in supply voltage and temperature. SPICE simulation indicates tolerance to a ±10% variations in supply voltage can be obtained and the output voltage swing is 0.3 V over the range of 0–125°C. © 2002 by CRC Press LLC
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© 2002 by CRC Press LLC
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© 2002 by CRC Press LLC Fernanda p
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Locating Your Topic Several avenues
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Krste Asanovic Massachusetts Instit
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7 8 9 Architectures for Low Power P
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SECTION VII Communications and Netw
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45 Testing of Synchronous Sequentia
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Hiroshi Iwai Tokyo Institute of Tec
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FIGURE 1.2 FIGURE 1.3 © 2002 by CR
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1.2 Downsizing below 0.1 © 2002 by
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FIGURE 1.9 Subthreshold leakage cur
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FIGURE 1.13 Epitaxial channel [9].
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gate length reduction was accelerat
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of the prediction. Until only sever
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FIGURE 1.22 Clarke number of elemen
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1.5 Source and Drain Figure 1.25 sh
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FIGURE 1.27 Retrograde profile. FIG
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TABLE 1.6 Trend of Interconnect by
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TABLE 1.9a Trend of DRAM Cell: Stac
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FIGURE 1.36 Trend of gate length. F
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References 1. D. Kahng and M. M. At
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40. B. H. Lee, R. Choi, L. Kang, S.
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outputs of the gate regardless of t
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FIGURE 2.4 circuit. This is the bas
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FIGURE 2.8 Two different realizatio
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FIGURE 2.12 Multifunction circuitry
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Dynamic Logic Circuits The basic id
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transistors in the pull-down networ
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In Fig. 2.21(d), the cross-coupled
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FIGURE 2.23 Different configuration
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In some literature, the authors lik
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Concluding Remarks The feature size
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FIGURE 2.30 Other pass-transistor c
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FIGURE 2.34 Dual-rail, pass-transis
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Shannon expansion, as shown below,
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FIGURE 2.41 Logic circuit for Out =
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FIGURE 2.45 Example decomposed BDD.
Page 82 and 83: FIGURE 2.50 Diffusion-area sharing
Page 84 and 85: FIGURE 2.54 Relationship between co
Page 86 and 87: 29. Shiple, T. R., Hojati, R., Sang
Page 88 and 89: FIGURE 2.58 DTMOS devices: (a) stan
Page 90 and 91: the design into a BDD representatio
Page 92 and 93: FIGURE 2.63 Circuit diagram of 2-in
Page 94 and 95: FIGURE 2.67 Synthesis of 2-input AN
Page 96 and 97: pass-transistor logic, constrained
Page 98 and 99: 16. Bryant, R., Graph-based algorit
Page 100 and 101: As shown in Fig. 2.79, the MOSFET d
Page 102 and 103: n + SiO 2 FIGURE 2.80 No reverse bo
Page 104 and 105: structures are a powerful solution
Page 106 and 107: SiO 2 Epitaxial Si Double Layered P
Page 108 and 109: PD-SOI Application to High-Performa
Page 110 and 111: LO FIGURE 2.91 History effects. sta
Page 112 and 113: weight, lower cost, a wireless inte
Page 114 and 115: TABLE 2.7 Performance of sub-1 V MT
Page 116 and 117: X X FIGURE 2.99 1 V A/D converter u
Page 118 and 119: When the communication range is 10
Page 120 and 121: 13. Nakashima, S., et al., Thicknes
Page 122 and 123: FIGURE 3.1 Conventional ECL circuit
Page 124 and 125: FIGURE 3.4 FIGURE 3.5 IPULL-DOWN, f
Page 126 and 127: FIGURE 3.7 V REG voltage regulator
Page 128 and 129: FIGURE 3.10 Layout of inverter gate
Page 130 and 131: FIGURE 3.14 Power consumption versu
Page 134 and 135: FIGURE 3.21 Maximum data rate vs. V
Page 136 and 137: John C. McCallum National Universit
Page 138 and 139: enchmark took between 15.7 and 5115
Page 140 and 141: The improvements in line widths, ch
Page 142 and 143: performance. Extensive lists of SPE
Page 144 and 145: TABLE 4.6 Functions of Memory and S
Page 146 and 147: Memory Price ($/MB) FIGURE 4.3 Cost
Page 148 and 149: TABLE 4.8 Disk Drive Characteristic
Page 150 and 151: 4.6 Summary The performance of comp
Page 152 and 153: 53. Curnow, H. J., and Wichmann, B.
Page 154 and 155: Computer Systems and Architecture
Page 156 and 157: advances that have been made in dev
Page 158 and 159: Server Types Servers are optimized
Page 160 and 161: Total Cost of Ownership Another con
Page 162 and 163: edundant memory-bit steering, and s
Page 164 and 165: majority of the users. Hardware opt
Page 166 and 167: processor implementations. In later
Page 168 and 169: FIGURE 5.7 an operand. For larger c
Page 170 and 171: Example 2 This example contrasts th
Page 172 and 173: Unlike the Defoe, the IA-64 archite
Page 174 and 175: This 3-phase approach fails to expl
Page 176 and 177: 6. Scott Rixner, William J. Dally,
Page 178 and 179: Shared-memory vector architectures
Page 180 and 181: The vector ISA usually fixes the ma
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FIGURE 5.12 A vector unit construct
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use of loops optimized for certain
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9. Espasa, R., Advanced Vector Arch
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thread management (including run-ti
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In the message passing model, inter
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multithreaded hardware, possibly by
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synchronization) and usually contai
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a common register space, it is impo
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FIGURE 5.16 When a load request is
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list a few helpful references to wh
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38. S. Wallace, B. Calder, and D. T
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Of course, SIMD machines have limit
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computation, it will decrease execu
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FIGURE 5.19 An 8 × 8 baseline netw
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Since then, we have seen constant e
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Stack: Data: Text: Virtual Space FI
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FIGURE 5.25 Shared memory. Shared m
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0 2 GB Text Init. Data Bss Heap . .
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In general, if the necessary transl
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Mark Smotherman Clemson University
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Studies of Instruction-Level Parall
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Modern Designs Most high-performanc
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The principle of register renaming
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FIGURE 6.2 issued into the RS, (ii)
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Issue Dispatch FIGURE 6.4 The proce
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FIGURE 6.6 Scope of register renami
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FIGURE 6.9 State transition diagram
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Thus, the maximal number of instruc
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In addition, if rename buffers are
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it, whose role will be explained su
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As Fig. 6.13 shows, the latest proc
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for recovery. Both processors incor
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FIGURE C. The principle of direct i
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13. White, S. and Reysa, J., PowerP
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FIGURE 6.14 A branch flowing throug
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is that mispredictions limit the pr
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fetch engine to identify which inst
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FIGURE 6.17 A schematic for a bimod
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FIGURE 6.20 A schematic for a GAg g
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FIGURE 6.22 A schematic for a hybri
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time this branch is seen, those bit
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FIGURE 6.23 Branch prediction accur
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11. Price, C., MIPS IV Instruction
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transporting digital bits, whereas
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FIGURE 6.25 The system architecture
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Finally, because the main task of n
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Pradip Bose IBM T. J. Watson Resear
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frequency © 2002 by CRC Press LLC
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The “mips” metric for performan
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Hence, in this paper, we do not dwe
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FIGURE 7.4 Parallel SIMD architectu
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dynamic prediction of such idle mod
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FIGURE 7.7 High-level block-diagram
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(measured as a performance over pow
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Steady-state BIPS FIGURE 7.9 Perfor
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8. Larson, A. G., “Cost-effective
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Jozo J. Dujmović San Francisco Sta
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x FIGURE 8.1 Movement of the disk I
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The critical distance x ∗ is Ther
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Hence, the average seek time for th
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FIGURE 8.4 Four-parameter exponenti
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Access Time [ms] 2 0 0 FIGURE 8.6 M
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TABLE 8.1 Classification of Eight B
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The traditional load independent me
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Response Time [seconds] 290 270 250
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FIGURE 8.14 Prediction errors e(p)
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8.2 Performance Evaluation: Techniq
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is generally the most important mea
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tool to profile programs on the Alp
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driven simulation has two major pro
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A variety of profiling tools exist
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SPLASH, the SPLASH suite was create
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different types and complexity eith
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Table 8.8 provides sources for the
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37. MediaBench benchmarks, http://w
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(a) Instruction Cache (b) Trace Cac
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PE 0 Local Register File local bypa
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The large trace processor instructi
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11. S. Melvin, M. Shebanow, and Y.
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complement numbers. Sign magnitude
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where ak, bk, and ck are the inputs
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k + 1, etc. Extending to a third st
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a 12:15 b 12:15 4-Bit RCA s 12:15 F
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FIGURE 9.8 Two’s complement subtr
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FIGURE 9.10 Unsigned 6 by 6 array m
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Digit Recurrent Division The most c
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FIGURE 9.14 Nonrestoring division.
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The Newton-Raphson division algorit
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FIGURE 9.18 Floating-point addition
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9.2 Fast Adders and Multipliers Gen
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FIGURE 9.20 Half-adder circuit. is
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gi pi FIGURE 9.22(b) Carry skip cir
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Assuming that a single level of the
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Array-Type Multiplier The simplest
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p1i,j p2i,j p3i,j p4i,j FIGURE 9.27
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The partial product PP j is to be c
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The sum SGN of the whole extended b
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FIGURE 9.31 54 × 54-bit parallel m
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6. Svensson, C. and Tjarnstrom, R.,
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Design Techniques III 10 Timing and
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FIGURE 10.1 Typical chip interface.
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Loop Components PLLs and DLLs share
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delay is some fraction of the input
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esults from the voltage across the
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© 2002 by CRC Press LLC TABLE 10.2
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db(H( ω)) FIGURE 10.6 PLL closed-l
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ω )/G O) db(T(ω ph(T( )/π) FIGUR
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Phase Margin (deg) FIGURE 10.10 PLL
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FIGURE 10.11 Measured PLL jitter hi
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FIGURE 10.13 DLL output jitter sens
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FIGURE 10.18 PLL output jitter sens
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Active supply filters employ amplif
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FIGURE 10.19 Single-ended delay ele
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Frequency (GHz) FIGURE 10.23 Freque
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FIGURE 10.25 Push-pull charge pump.
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Circuit Summary In general, all DLL
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5. T. Lee, et al., “A 2.5V CMOS D
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introduced in [3], is used to repre
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FIGURE 10.31 Setup and hold time ti
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FIGURE 10.34 Max-timing diagrams fo
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FIGURE 10.37 Time borrowing for sin
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FIGURE 10.39 Max-timing for single-
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Min-Timing In contrast to max-timin
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FIGURE 10.46 Min-timing diagrams fo
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FIGURE 10.49 Edge-triggered, flip-f
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FIGURE 10.51 FIGURE 10.52 Max-timin
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FIGURE 10.53 Transparent-high latch
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FIGURE 10.57 Complementary TSPC tra
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FIGURE 10.61 A positive, edge-trigg
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FIGURE 10.66 Pulsed latches. FIGURE
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assigned, based on the subcircuit t
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FIGURE 10.71 Scan chain for dual-ph
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and SEB, which are complementary, c
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when used as a flip-flop, the NAND3
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FIGURE 10.75 Integrated memory for
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Memory Cell Bit# Bit FIGURE 10.78 A
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FIGURE 10.80 Modeling process varia
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FIGURE 10.83 A column circuit. FIGU
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advantage of this circuit, compared
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K. Wayne Current University of Cali
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11.2 Nonvolatile Multiple-Valued Me
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Multiple-Valued EEPROM and Flash Me
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direct properly scaled and logicall
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Current comparators are a critical
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FIGURE 11.4 Current-mode CMOS quate
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FIGURE 11.6 Current-mode CMOS quate
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observed with these circuits are ab
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FIGURE 11.11 Current-mode CMOS quat
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FIGURE 11.12 Current-mode CMOS latc
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FIGURE 11.14 Current-mode CMOS anal
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esults confirm the DC transfer func
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19. T. T. Dao, “Threshold I2L and
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FIGURE 12.1 Device technologies use
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selected depending on the number of
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Architecture of Newer Generation FP
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FIGURE 12.6 An example of a simple
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tools, the + 1 operation is a speci
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download the programming data to th
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FIGURE 13.1 High-performance microp
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FIGURE 13.4 TABLE 13.1 combinationa
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accurate wire modelling while limit
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FIGURE 13.6 Dual-rail, multiple-out
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FIGURE 13.10 Effect of output inver
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FIGURE 13.11 Unfooted dynamic 4:1 m
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(4) the limit of designers to manag
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© 2002 by CRC Press LLC IV Design
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FIGURE 14.1 FIGURE 14.2 newer semic
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The cost impact of power consumptio
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In any case, the move toward “Gre
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This static current is obviously un
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14.2 Power Estimation As we saw in
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lock as a function of various param
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FIGURE 14.8 Sleep transistors to co
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FIGURE 14.12 Data enabling. In addi
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Power Reduction through CAD Tools P
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AMPS AMPS is a circuit power optimi
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Masayuki Miyazaki Hitachi, Ltd. 15.
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15.3 Supply Voltage Management Supp
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FIGURE 15.4 MT-CMOS balloon circuit
Page 540 and 541:
FIGURE 15.9 EVT-CMOS circuit design
Page 542 and 543:
FIGURE 15.12 VT-CMOS block diagram
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FIGURE 15.15 SA-V t CMOS scheme wit
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FIGURE 15.17 Floating-point datapat
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Vivek De Intel Corporation Ali Kesh
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FIGURE 16.3 n-channel ID vs. VG sho
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Gate-Induced Drain Leakage (I 4) GI
Page 554 and 555:
FIGURE 16.7 Two-nMOS stack in a two
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FIGURE 16.11 Four-input NAND NMOS s
Page 558 and 559:
FIGURE 16.12 Distribution of standb
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Die count FIGURE 16.16 (a) Adaptive
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due to adaptive body bias worsens w
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Thomas D. Burd University of Califo
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the parameter to be maximized since
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17.3 Dynamically Varying Voltage If
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The voltage converter required for
Page 572 and 573:
FIGURE 17.7 DVS improvement for UI
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FIGURE 17.10 Measured throughput vs
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FIGURE 17.12 Sources of noise margi
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FIGURE 17.15 Ring oscillator adapti
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FIGURE 17.17 Sense-amp delay variat
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Christian Piguet CSEM: Centre Suiss
Page 584 and 585:
Some Basic Rules There are some bas
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TABLE 18.2 Looped 8-bit Multiply Pr
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FIGURE 18.4 new architecture paradi
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FIGURE 18.6 FIGURE 18.7 the second
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FIGURE 18.9 FIGURE 18.10 With latch
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18.6 Low-Power Memories As memories
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connected to the main bitline (only
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is today only about a factor of 2 d
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Katsunori Seno SONY Corporation 19.
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FIGURE 19.2 FIGURE 19.3 This is a c
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FIGURE 19.6 FIGURE 19.7 FPGA sacrif
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FIGURE 19.9 RAWn precharge FIGURE 1
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a fixed given standard. References
Page 610 and 611:
Hendrawan Soeleman Purdue Universit
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for a short period of time when bot
Page 614 and 615:
Total Average Power Putting togethe
Page 616 and 617:
Signal Probability Calculation In c
Page 618 and 619:
Example Given y = x 1 + x 2. Find P
Page 620 and 621:
A B F FIGURE 20.7 Unfactorized and
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etween successive transitions is a
Page 624 and 625:
FIGURE 20.9 A logic gate and its co
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Results Using Probabilistic Techniq
Page 628 and 629:
FIGURE 20.12 Probabilistic and stat
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14. VLSI Microprocessors: A Guide t
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0 V to a voltage V in time T throug
Page 634 and 635:
a small fraction of circuit nodes t
Page 636 and 637:
FIGURE 21.6 (a) E-R latch, (b) timi
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FIGURE 21.8 Potential E-R latch for
Page 640 and 641:
The only difference between the two
Page 642 and 643:
FIGURE 21.14 (a) Clock-powered stat
Page 644 and 645:
FIGURE 21.17 The three drivers used
Page 646 and 647:
FIGURE 21.20 Energy-delay product (
Page 648 and 649:
FIGURE 21.22 AC-1 clock-driver sche
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clock-powered nodes accounted for 8
Page 652 and 653:
Two generations of clock-powered mi
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29. Athas, W. C., Tzartzanis, N., M
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Wayne Wolf Princeton University 22.
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so a CPU could be built in reconfig
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optimized processes. Although embed
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FIGURE 22.4 they are most useful wh
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• How should processes be allocat
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25 memory system activity. If the c
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Jonathan W. Valvano University of T
Page 670 and 671:
FIGURE 23.2 6808, I/O ports A and B
Page 672 and 673:
personnel so that they are proficie
Page 674 and 675:
BDM can provide the ability to obse
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minor modifications to the finite s
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Many components are included in a d
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will saturate resulting in a bang-b
Page 682 and 683:
Two approaches are used to synchron
Page 684 and 685:
Fred J. Taylor University of Florid
Page 686 and 687:
The output of a linear system havin
Page 688 and 689:
FIGURE 24.2 Effects of windowing an
Page 690 and 691:
frequency range ±f Nyquist = ±f s
Page 692 and 693:
performance, complexity, and precis
Page 694 and 695:
overflows of intermediate sums. Tha
Page 696 and 697:
24.7 Applications “DSP” has bec
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DSP (Digital Signal Processor) or D
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PC as a Terminal (Modem) The PC is
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characteristics: • Fixed pictures
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HDTV (and Digital Television) If th
Page 706 and 707:
Modem Banks This is the first of th
Page 708 and 709:
25.7 Automotive, Industrial Althoug
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36. MITEL Semiconductor: www.semico
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26.2 Digital Filters The theory of
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|H | 1 FIGURE 26.1 Frequency select
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TABLE 26.1 Filter Design Comparison
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frequency response involves some al
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Impulse Response 0.2 0.15 0.1 0.05
Page 722 and 723:
This constrained magnitude problem
Page 724 and 725:
FIGURE 26.8 Block diagram of the ge
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11. Ikehara, M., Tanaka, H., and Ku
Page 728 and 729:
Adam Dabrowski Poznan University To
Page 730 and 731:
−12 2 The reference in this case
Page 732 and 733:
FIGURE 27.1 Two-band filter bank: (
Page 734 and 735:
FIGURE 27.5 Critical bandwidth and
Page 736 and 737:
FIGURE 27.7 Threshold of audibility
Page 738 and 739:
FIGURE 27.10 Critical band index in
Page 740 and 741:
FIGURE 27.13 Simplified model of th
Page 742 and 743:
All described masking effects are e
Page 744 and 745:
where From Eqs. (27.32) and (27.33)
Page 746 and 747:
eal-time. Although floating-point p
Page 748 and 749:
FIGURE 27.19 Overlapped, power comp
Page 750 and 751:
FIGURE 27.21 Symmetrical FIR filter
Page 752 and 753:
In the MPEG-1 encoder an efficient
Page 754 and 755:
These first two approaches can be m
Page 756 and 757:
FIGURE 27.27 ADPCM: (a) encoder, (b
Page 758 and 759:
FIGURE 27.30 General scheme of the
Page 760 and 761:
A new standard MPEG-7, named the mu
Page 762 and 763:
FIGURE 27.32 AC-3 encoder. FIGURE 2
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29. Marven, C. and Ewers, G., A sim
Page 766 and 767:
FIGURE 28.1 FIGURE 28.2 of the huma
Page 768 and 769:
FIGURE 28.5 image of reasonable qua
Page 770 and 771:
Consider the case of a simple 2-D
Page 772 and 773:
FIGURE 28.8 A sampled spatiotempora
Page 774 and 775:
oth high spatial frequency componen
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If it were separable (that is, H(ξ
Page 778 and 779:
The first hypothesis (the less plau
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FIGURE 28.17 The real (top) and ima
Page 782 and 783:
FIGURE 28.18 The resolution of a ti
Page 784 and 785:
FIGURE 28.20 Motion estimation by b
Page 786 and 787:
where the superscripts n and n + 1
Page 788 and 789:
must be found via a finite set of o
Page 790 and 791:
The methods in this subsection are
Page 792 and 793:
FIGURE 28.28 The split phase. Using
Page 794 and 795:
35. Y.-T. Wu, T. Kanade, J. Cohn, a
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29.2 Power Dissipation in Digital C
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additional power benefits. Efficien
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Power savings are higher than simpl
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A priori knowledge of data stream d
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FIGURE 29.7 DCT Chip [my DCT] avera
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19. S. Uramoto et al. A 100 MHz 2-D
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Anna Hać University of Hawaii 30.1
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Using TCP/IP also makes the network
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this is for one mobile host which i
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TDMA Time-division multiple access
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path delay. The two measures of the
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are under the control of the system
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the bandwidth reserved in the targe
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Chik-Kong Ken Yang University of Ca
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FIGURE 31.3 attenuation (dB) -3.0 -
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FIGURE 31.5 to handle large voltage
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p_o V bias FIGURE 31.8 High-impedan
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out[n] a0 FIGURE 31.11 Transmitter
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FIGURE 31.15 Receiver design using
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digitally by first feeding the inpu
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FIGURE 31.19 90 o locking using XOR
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Power of these links is becoming an
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46. Takahashi, T. et al., “A CMOS
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Many computer programs exhibit some
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32.3 Related Memory Models, Hierarc
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32.6 External Sorting and Related P
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uns, each striped across the disks.
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Matrix transposition is the special
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of satellite images is over one ter
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TABLE 32.3 Best Known I/O Bounds fo
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e accessed directly in a single I/O
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implementations of priority queues
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By the reduction in [52], a data st
Page 862 and 863:
set of experiments on various text
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3. A. Acharya, M. Uysal, and J. Sal
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44. J. L. Bentley and J. B. Saxe. D
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85. P. Ferragina and F. Luccio. Dyn
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128. V. Kumar and E. Schwabe. Impro
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173. H. Samet. The Design and Analy
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Peter J. Varman Rice University 33.
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need for fast transfers, up to 1 Gb
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In contrast to prefetching that mas
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The ERF algorithm was analyzed in [
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increment lowestPriorityOnDisk(disk
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External or out-of-core algorithms
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33. M. Kallahalla and P. J. Varman.
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advanced, reaching the point where
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FIGURE 34.3 FIGURE 34.4 defines the
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FIGURE 34.5 Trellis representation
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FIGURE 34.7 Data and servo sectors.
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References 1. S. H. Charrap, P. L.
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High-frequency noise is then remove
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The various components of (34.3) ar
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sequences are more complex, and occ
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ange of 10 −12 -10 −15 . Anothe
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strategies are reviewed, which have
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FIGURE 34.13 Magnitude response for
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taps as an approximation of the Typ
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FIGURE 34.18 CTF BER performance de
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TABLE 34.1 Examples of Equalizers I
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(i) Symbol rate VCO based timing re
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Symbol Rate Timing Recovery Schemes
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where B = B 1 + B 2 + 1 is the size
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in � out � d(k) FIGURE 34.26 Ti
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�(k) z -L FIGURE 34.27 Linearized
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10 −4 and 10 −2 . The steady-st
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16. J. Sonntag, et al., “A high s
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y a special sequence known as the a
Page 932 and 933:
FIGURE 34.36 An example of two Gray
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track n track n +1 FIGURE 34.38 The
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FIGURE 34.40 The phase format. Posi
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increase linear density while mitig
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FIGURE 34.43 Two equivalent constra
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FIGURE 34.44 Possible pairs of sequ
Page 944 and 945:
Distance δ min,C can be bounded as
Page 946 and 947:
FIGURE 34.45 Standard concatenation
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30. E. Soljanin, “On-track and of
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The next block is PRE. What is PR?
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In the above example, we see that s
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FIGURE 34.52 Feedback detector. Cat
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FIGURE 34.54 Decision feedback equa
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esponse (this is also valid for dif
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its use, while the computational, o
Page 962 and 963:
FIGURE 34.58 Viterbi algorithm dete
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Noise-Predictive Maximum Likelihood
Page 966 and 967:
The error event likelihoods are cal
Page 968 and 969:
Metric-First Algorithms Metric-firs
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termination at the same time. Howev
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13. J. Hagenauer, “Applications o
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Given a code C of length n and dime
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Notice that, although a code may ha
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Not many perfect codes exist. In th
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Theorem 1 (Shannon) For any � > 0
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If we write the codewords as polyno
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Let © 2002 by CRC Press LLC 1 1 K
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which, in polynomial form, is Let E
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m Σl=0 because a l = (a m+1 − 1)
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Evaluating the syndromes, we obtain
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FIGURE 34.63 Interleaving m times o
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Operating System © 2002 by CRC Pre
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systems, the most notable example b
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35.3 Components of Distributed Oper
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Message-passing IPC shares many cha
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process at any arbitrary stage in i
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Few attempts were made in the past
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alternate years with SOSP), and the
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© 2002 by CRC Press LLC 42 Mobile
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FIGURE 36.1 were introduced; howeve
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FPGAs by providing on-chip memory f
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FIGURE 36.3 There is a considerable
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FIGURE 36.4 The general form of the
Page 1018 and 1019:
FIGURE 36.6 If a VPB can cover all
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John Morris University of Western A
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FIGURE 37.1 Simplified block diagra
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inverters, and the programmable mul
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Programmable Active Memories (PAM)
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measured in megabits, not megabytes
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from modern FPGAs, e.g., Altera’s
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Regularity A processing pipeline wi
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Other Languages Other routes from h
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29. Bergmann, N.W., and Dawood, A.,
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FIGURE 37.8 Basic architectures for
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Selected Applications Several class
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Development Systems Developing appl
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implementation. Reconfigurable or r
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The designer starts the generation
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lock but allows multiple instructio
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data-types that are mapped to TIE r
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Conclusions Configurable and extens
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FIGURE 38.1 Average vehicle speed.
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AHS means advanced cruise-assist hi
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TABLE 38.3 navigation systems VICS
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FIGURE 38.9 FIGURE 38.10 a map data
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FIGURE 38.13 The four basic functio
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Support of Safe Driving System The
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System evaluation, the fourth issue
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FIGURE 38.18 Summarizing the three
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uilder tools serving to build MMI o
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FIGURE 38.23 FIGURE 38.24 automaker
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FIGURE 38.26 FIGURE 38.27 The first
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FIGURE 38.30 FIGURE 38.31 a kind of
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To Probe Further In this field, the
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FIGURE 39.1 of more versatile media
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1 • 3DNow! 1 [11,12] from AMD,
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FIGURE 39.6 In the packed add instr
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If saturation arithmetic is used in
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TABLE 39.1 Examples of Operations T
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FIGURE 39.10 PAVG R c, R a, R b: Pa
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FIGURE 39.13 Packed compare instruc
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FIGURE 39.17 Packed multiply high i
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FIGURE 39.20 Packed multiply left i
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FIGURE 39.23 In the packed multiply
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TABLE 39.4 Packed Integer Multiplic
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Subword Permutation Instructions In
Page 1104 and 1105:
is n log 2(n). Table 39.6 shows how
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FIGURE 39.33 Mix left instruction.
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TABLE 39.7 Subword Permutation Inst
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TABLE 39.9 IA-64 uses FPMA and FPMS
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The two-bit result field is written
Page 1114 and 1115:
source register. These three FP mix
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13. Motorola, “AltiVec technology
Page 1118 and 1119:
FIGURE 39.48 ManArray 1 × 2 core e
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FIGURE 39.50 Hypercube interconnect
Page 1122 and 1123:
FIGURE 39.53 Host DSP software laye
Page 1124 and 1125:
Benchmark Data Type Performance 256
Page 1126 and 1127:
FIGURE 39.56 Simplified schematic o
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Gaming applications often require a
Page 1130 and 1131:
system, and the application program
Page 1132 and 1133:
FIGURE 39.60 FIGURE 39.61 FIGURE 39
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FIGURE 39.64 shifting place limits
Page 1136 and 1137:
FIGURE 39.66 pitch Address Looping
Page 1138 and 1139:
FIGURE 39.69 gain of the filter. It
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as a core to integrate onto the sam
Page 1142 and 1143:
7. Rossum, D., Constraint based aud
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FIGURE 39.74 Procedure for simulate
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The fitness value of an individual
Page 1148 and 1149:
FIGURE 39.77 The tabu list can be v
Page 1150 and 1151:
Intermediate-term memory component
Page 1152 and 1153:
FIGURE 39.81 Selection. FIGURE 39.8
Page 1154 and 1155:
Work on parallelization of the tabu
Page 1156 and 1157:
Acknowledgment The authors acknowle
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47. L. K. Grover. A new Simulated A
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93. E. M. Rudnick, J. H. Patel, G.
Page 1162 and 1163:
138. Youn-Long Lin, Yu-Chin Hsu, an
Page 1164 and 1165:
This architecture allowed for large
Page 1166 and 1167:
FIGURE 40.3 40.3 Application Server
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FIGURE 40.5 applications. CORBA cur
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FIGURE 40.8 The application server
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FIGURE 40.10 The proposed architect
Page 1174 and 1175:
cost at the front end. The ideal ap
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FIGURE 40.12 Client-server and netw
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Yoshiaki Hagiwara Sony Corporation
Page 1180 and 1181:
FIGURE 41.2 This corresponds to the
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FIGURE 41.5 Buried channel CCD stru
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FIGURE 41.8 Applications of CCD and
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sensor (1100 K pixel) Microphone ×
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�� FIGURE 41.14 Form com
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FIGURE 41.16 Stack technology. Link
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1st EmDRAM Product FIGURE 41.19 Emb
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FIGURE 41.23 Em-DRAM process techno
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John F. Alexander University of Nor
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Several reasons exist for mentionin
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sort of local area network. Support
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Technological hurdles must be overc
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FIGURE 42.1 Block diagram of (a) ge
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FIGURE 42.3 Alternative FIR filter
Page 1208 and 1209:
FIGURE 42.5 Polyphase filter struct
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3. E. Dahlman, Bjorn Gudmundson, M.
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TABLE 42.1 Categorizing Reusable Co
Page 1214 and 1215:
FIGURE 42.11 Internet growth. FIGUR
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FIGURE 42.13 Software for VoIP SoC.
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FIGURE 42.17 Bandwidth trends. FIGU
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The interconnections between the va
Page 1222 and 1223:
FIGURE 42.21 A typical communicatio
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carry information over longer dista
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however, it is not uncommon that so
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node, to which the user is connecte
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its information. Intuitively, this
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This issue is referred to as latenc
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Evolution of Standard Image/Video C
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FIGURE 42.26 Sequence of zigzag-cod
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FIGURE 42.29 150th Frame of origina
Page 1240 and 1241:
FIGURE 42.31 Data partitioning for
Page 1242 and 1243:
for transmitting a predictively cod
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42.6 Pen-Based User Interfaces—An
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FIGURE 42.35 The handwriting recogn
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• No toggling between edit/contro
Page 1250 and 1251:
FIGURE 42.39 Boxplots of time to en
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0 … 9 ( ) -
Page 1254 and 1255:
is using the SMIL generic media ref
Page 1256 and 1257:
FIGURE 42.47 Example of pen-and-pap
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slots specifying pieces of informat
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most stringent demands for low-powe
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FIGURE 42.51 MIPS requirement of se
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FIGURE 42.54 von Neumann architectu
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FIGURE 42.57 Dual Mac architecture
Page 1268 and 1269:
FIGURE 42.59 Two data path variatio
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FIGURE 42.60 Basic pipeline archite
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References 1. Bahl L., Cocke J., Je
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Random Oracle Model One direction o
Page 1276 and 1277:
at the end of its usefulness. A new
Page 1278 and 1279:
function and verification function
Page 1280 and 1281:
underlies the Diffie-Hellman key ag
Page 1282 and 1283:
31. Dolev, D., Dwork, C., and Naor,
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R. Chandramouli Synopsys Inc. 44.1
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many deficiencies in the design may
Page 1288 and 1289:
impact the performance and test ove
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FIGURE 44.4 FIGURE 44.5 It becomes
Page 1292 and 1293:
SoC methodologies require synchroni
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This method, however, lacks the app
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FIGURE 45.2 Input formats of MILEF
Page 1298 and 1299:
FIGURE 45.3 FIGURE 45.4 Robustness
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FIGURE 45.5 In Fig. 45.5 a simple e
Page 1302 and 1303:
difficult to identify for overcurre
Page 1304 and 1305:
General Approach in Comparison with
Page 1306 and 1307:
FIGURE 45.10 phase—the propagatio
Page 1308 and 1309:
shorter test sequence could possibl
Page 1310 and 1311:
Looking at results of Table 45.6, i
Page 1312 and 1313:
45.4 Summary Automatic test pattern
Page 1314 and 1315:
41. F. Brglez, H. Fujiwara: A neutr
Page 1316 and 1317:
FIGURE 46.1 Rule of ten in testing
Page 1318 and 1319:
FIGURE 46.5 FIGURE 46.6 of the DUT.
Page 1320 and 1321:
FIGURE 46.7 generate tests for ever
Page 1322 and 1323:
FIGURE 46.9 FIGURE 46.10 behavioral
Page 1324 and 1325:
Z. Stamenković University of N. St
Page 1326 and 1327:
FIGURE 47.2 Murphy’s Model The mo
Page 1328 and 1329:
where k is the total number of crit
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FIGURE 47.5 Definition of IC critic
Page 1332 and 1333:
distribution [34,35]: © 2002 by CR
Page 1334 and 1335:
and, in the case of w = X 2 − X 1
Page 1336 and 1337:
Algorithm • Input: a singly linke
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TRACIF takes a CIF file as input an
Page 1340 and 1341:
TABLE 47.2 Critical Area Extraction
Page 1342 and 1343:
Also, the critical areas for lithog
Page 1344 and 1345:
(enhancement of the process cleanli
Page 1346 and 1347:
28. Corsi, F. and Martino, S., Defe
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U. Glaeser

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