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This static current is obviously undesirable, but it does not exist for true CMOS logic. This is one of the main reasons for the popularity of CMOS in low power applications. Another situation that can lead to static power dissipation in CMOS is when a degraded voltage level (e.g., the “high” output level of a nMOS pass transistor) is applied to the inputs of a CMOS gate. A degraded voltage level may leave both the nMOS and pMOS transistors in a conducting state, leading to continuous flow of short-circuit current. This again is undesirable and care should be taken to avoid it in practice. Reducing Power Consumption The capacitive switching power (P switching), as given by the formula in Eq. (14.1), is the dominant source of power consumption in CMOS circuits today. Research and design efforts aimed at low power are therefore largely focussed on reducing P switching. The parameters in its formula V dd, f, C, N provide avenues for power reduction. The idea is to either reduce each of the parameters individually without adversely impacting the others, or to trade them off against each other. It should be noted that f is also a measure of the performance (speed) of a system. Therefore, reduction in power through simply a reduction in f is an option only if it is acceptable to trade off speed for power. Power is proportional to the square of V dd. This makes reduction in V dd as the most effective way for power reduction. This has motivated the acceptance of 3.3 V as the standard supply voltage, down from 5 V. The downward trend in V dd continues, with processors with 1.5 V internal supply voltage and lower, already being shipped. The problem with reducing V dd is that it leads to an increase in circuit delay. Circuit delay is inversely proportional to V dd as a first order of approximation. The increased delay can be overcome if device dimensions are also scaled down along with V dd. In particular, in constant-field scaling, V dd and the horizontal and vertical dimensions of devices are scaled down by the same factor k. This is done in order to maintain constant electric fields in the devices. To the first order of approximation, the power consumption scales down by k 2 , and the delays go up by k. Reducing device dimensions (or feature size reduction) is a very costly proposition, requiring changes in fabrication technology and semiconductor processes. The other problem is that circuit delay actually rises rapidly as V dd approaches the threshold voltage V t. As a general rule, V dd should be larger than 4V t, if speed is not to suffer excessively V t does not scale easily and, therefore, reducing V dd below V t will be difficult. The speed degradation (increase in delay) may be reduced by circuit technologies that allow lower V t; however, decrease in V t leads to a significant increase in subthreshold leakage current—every 0.1 V reduction in V t raises subthreshold leakage current by a factor of 10. A tradeoff is involved in choosing a very low V dd. Some design options in this regard are to either dynamically vary V t (lower V t when the circuit is active, higher when it is not) or using different V t for sub-circuits with different speed requirements. The speed degradation may also be compensated for by increasing the amount of parallelism in the system. This works well for applications such as digital signal processing, where throughput is used as the performance metric. It is also worth noting that V dd reduction only provides temporary relief in the course of technological change. Please refer back to Fig. 14.1 and Table 14.1. These processors shown represent recent data points for a trend that has persisted for over 25 years—increased performance through higher clock frequencies or increased number of transistors, or both. This, however, directly increases the power consumption. Reductions in supply voltage and feature size do help to offset the effect of increased clock frequency and to reduce power. For example, the original Intel Pentium processor had 0.8 µm feature size, 5 V supply voltage, 66 MHz clock frequency, and 16 W power consumption. Reduction in the feature size to 0.5 µm and voltage to 3.3 V, led to 10 W power consumption, even at 100 MHz. But such reductions are only temporary, since the march toward increased clock frequencies shows no signs of slowing. Thus, the power consumption of the 200 MHz Pentium climbed back to 17 W. © 2002 by CRC Press LLC
Also, the area made available from feature size reductions is immediately filled up with more transistors— for larger caches and increased instruction-level parallelism, in case of processors. For example, the Pentium Pro, the successor of the Pentium, has 70% more transistors and about 50% more power consumption at 200 MHz. The trend in special purpose ICs is also to push the limits of integration by integrating as much functionality on a chip as possible. The goal of a host of multimedia capabilities on a single chip was being sought in earnest. These capabilities are now real but power consumption has gone up. Integration helps to reduce the overall power for the system. A rule of thumb stated is that four devices incorporated into an IC consume only half as much power as would be the case if they were configured as discrete components; however, it also implies that the power dissipation burden on the resulting single IC will increase. Thus, the current trends indicate that the voltage and feature size reduction notwithstanding, the power consumption problem in ICs will only get worse in the future. Therefore, it is important to explore other avenues of power reduction as described below. Reduction of Switched Capacitance The parameters N and Cout in Eq. (14.2) provide the other set of avenues for power reduction. Their product N × C can be called the average switched capacitance per cycle (referred to as switched capacitance) of the circuit. Reduction in switched capacitance is in general orthogonal to the power reduction techniques described previously. It can therefore lead to power reductions beyond what is possible by voltage scaling alone. It may also be the only option if the large investments in time and money associated with the migration to newer processes and lower voltages are not feasible. Reduction in switched capacitance has thus been the subject of intense study in recent years since the last 10 years or so. Ideas and techniques at all levels of the design process are being developed. Figure 14.5 presents an overview of the salient directions that are being pursued in today’s designs. Some of these are aimed specifically at reducing N or N × Cout. Others represent well-established design/synthesis problem domains, in which N × Cout can be considered as an additional target metric. The aim of all of these is to reduce N × Cout. It should be kept in mind that these efforts are not isolated from one another. Thus, the impact of design decisions at any level cuts across other levels of the hierarchy too. Overviews of the published work in this area are available in several references [1,5,6]. FIGURE 14.5 Directions for reducing capacitance. © 2002 by CRC Press LLC -Choice of Hardware vs. Software -System Partitioning for reduced communication -Integrated vs discrete modules -Software design (system software, algorithms, code generation) -System power management -Combinational Optimizations (Technology dependent/independent) -Sequential optimizations -Gate resizing -Custom design for functional modules -Wasteful activity elimination -Low parasitic capacitance materials and processes. Silicon -Low capacitance packaging System Architecture Logic/RTL Trans Circuit Technology Levels of Abstraction -Instruction set design -Data representation and coding -Exploiting locality (cache hierarchy) -Algorithmic transformations -Sharing vs. partitioning -Selective power down -Gate and wire sizing -Floorplanning -Placement -Routing -Improved cell libraries
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© 2002 by CRC Press LLC
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© 2002 by CRC Press LLC Fernanda p
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Locating Your Topic Several avenues
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Krste Asanovic Massachusetts Instit
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7 8 9 Architectures for Low Power P
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SECTION VII Communications and Netw
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45 Testing of Synchronous Sequentia
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Hiroshi Iwai Tokyo Institute of Tec
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FIGURE 1.2 FIGURE 1.3 © 2002 by CR
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1.2 Downsizing below 0.1 © 2002 by
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FIGURE 1.9 Subthreshold leakage cur
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FIGURE 1.13 Epitaxial channel [9].
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gate length reduction was accelerat
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of the prediction. Until only sever
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FIGURE 1.22 Clarke number of elemen
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1.5 Source and Drain Figure 1.25 sh
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FIGURE 1.27 Retrograde profile. FIG
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TABLE 1.6 Trend of Interconnect by
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TABLE 1.9a Trend of DRAM Cell: Stac
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FIGURE 1.36 Trend of gate length. F
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References 1. D. Kahng and M. M. At
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40. B. H. Lee, R. Choi, L. Kang, S.
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outputs of the gate regardless of t
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FIGURE 2.4 circuit. This is the bas
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FIGURE 2.8 Two different realizatio
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FIGURE 2.12 Multifunction circuitry
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Dynamic Logic Circuits The basic id
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transistors in the pull-down networ
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In Fig. 2.21(d), the cross-coupled
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FIGURE 2.23 Different configuration
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In some literature, the authors lik
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Concluding Remarks The feature size
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FIGURE 2.30 Other pass-transistor c
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FIGURE 2.34 Dual-rail, pass-transis
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Shannon expansion, as shown below,
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FIGURE 2.41 Logic circuit for Out =
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FIGURE 2.45 Example decomposed BDD.
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FIGURE 2.50 Diffusion-area sharing
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FIGURE 2.54 Relationship between co
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29. Shiple, T. R., Hojati, R., Sang
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FIGURE 2.58 DTMOS devices: (a) stan
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the design into a BDD representatio
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FIGURE 2.63 Circuit diagram of 2-in
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FIGURE 2.67 Synthesis of 2-input AN
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pass-transistor logic, constrained
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16. Bryant, R., Graph-based algorit
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As shown in Fig. 2.79, the MOSFET d
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n + SiO 2 FIGURE 2.80 No reverse bo
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structures are a powerful solution
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SiO 2 Epitaxial Si Double Layered P
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PD-SOI Application to High-Performa
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LO FIGURE 2.91 History effects. sta
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weight, lower cost, a wireless inte
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TABLE 2.7 Performance of sub-1 V MT
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X X FIGURE 2.99 1 V A/D converter u
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When the communication range is 10
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13. Nakashima, S., et al., Thicknes
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FIGURE 3.1 Conventional ECL circuit
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FIGURE 3.4 FIGURE 3.5 IPULL-DOWN, f
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FIGURE 3.7 V REG voltage regulator
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FIGURE 3.10 Layout of inverter gate
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FIGURE 3.14 Power consumption versu
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I/O Pads, is 60 mW for the multiple
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FIGURE 3.21 Maximum data rate vs. V
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John C. McCallum National Universit
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enchmark took between 15.7 and 5115
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The improvements in line widths, ch
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performance. Extensive lists of SPE
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TABLE 4.6 Functions of Memory and S
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Memory Price ($/MB) FIGURE 4.3 Cost
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TABLE 4.8 Disk Drive Characteristic
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4.6 Summary The performance of comp
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53. Curnow, H. J., and Wichmann, B.
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Computer Systems and Architecture
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advances that have been made in dev
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Server Types Servers are optimized
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Total Cost of Ownership Another con
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edundant memory-bit steering, and s
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majority of the users. Hardware opt
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processor implementations. In later
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FIGURE 5.7 an operand. For larger c
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Example 2 This example contrasts th
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Unlike the Defoe, the IA-64 archite
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This 3-phase approach fails to expl
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6. Scott Rixner, William J. Dally,
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Shared-memory vector architectures
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The vector ISA usually fixes the ma
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FIGURE 5.12 A vector unit construct
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use of loops optimized for certain
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9. Espasa, R., Advanced Vector Arch
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thread management (including run-ti
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In the message passing model, inter
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multithreaded hardware, possibly by
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synchronization) and usually contai
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a common register space, it is impo
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FIGURE 5.16 When a load request is
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list a few helpful references to wh
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38. S. Wallace, B. Calder, and D. T
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Of course, SIMD machines have limit
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computation, it will decrease execu
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FIGURE 5.19 An 8 × 8 baseline netw
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Since then, we have seen constant e
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Stack: Data: Text: Virtual Space FI
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FIGURE 5.25 Shared memory. Shared m
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0 2 GB Text Init. Data Bss Heap . .
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In general, if the necessary transl
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Mark Smotherman Clemson University
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Studies of Instruction-Level Parall
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Modern Designs Most high-performanc
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The principle of register renaming
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FIGURE 6.2 issued into the RS, (ii)
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Issue Dispatch FIGURE 6.4 The proce
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FIGURE 6.6 Scope of register renami
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FIGURE 6.9 State transition diagram
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Thus, the maximal number of instruc
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In addition, if rename buffers are
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it, whose role will be explained su
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As Fig. 6.13 shows, the latest proc
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for recovery. Both processors incor
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FIGURE C. The principle of direct i
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13. White, S. and Reysa, J., PowerP
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FIGURE 6.14 A branch flowing throug
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is that mispredictions limit the pr
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fetch engine to identify which inst
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FIGURE 6.17 A schematic for a bimod
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FIGURE 6.20 A schematic for a GAg g
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FIGURE 6.22 A schematic for a hybri
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time this branch is seen, those bit
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FIGURE 6.23 Branch prediction accur
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11. Price, C., MIPS IV Instruction
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transporting digital bits, whereas
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FIGURE 6.25 The system architecture
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Finally, because the main task of n
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Pradip Bose IBM T. J. Watson Resear
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frequency © 2002 by CRC Press LLC
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The “mips” metric for performan
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Hence, in this paper, we do not dwe
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FIGURE 7.4 Parallel SIMD architectu
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dynamic prediction of such idle mod
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FIGURE 7.7 High-level block-diagram
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(measured as a performance over pow
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Steady-state BIPS FIGURE 7.9 Perfor
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8. Larson, A. G., “Cost-effective
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Jozo J. Dujmović San Francisco Sta
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x FIGURE 8.1 Movement of the disk I
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The critical distance x ∗ is Ther
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Hence, the average seek time for th
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FIGURE 8.4 Four-parameter exponenti
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Access Time [ms] 2 0 0 FIGURE 8.6 M
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TABLE 8.1 Classification of Eight B
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The traditional load independent me
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Response Time [seconds] 290 270 250
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FIGURE 8.14 Prediction errors e(p)
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8.2 Performance Evaluation: Techniq
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is generally the most important mea
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tool to profile programs on the Alp
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driven simulation has two major pro
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A variety of profiling tools exist
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SPLASH, the SPLASH suite was create
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different types and complexity eith
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Table 8.8 provides sources for the
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37. MediaBench benchmarks, http://w
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(a) Instruction Cache (b) Trace Cac
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PE 0 Local Register File local bypa
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The large trace processor instructi
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11. S. Melvin, M. Shebanow, and Y.
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complement numbers. Sign magnitude
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where ak, bk, and ck are the inputs
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k + 1, etc. Extending to a third st
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a 12:15 b 12:15 4-Bit RCA s 12:15 F
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FIGURE 9.8 Two’s complement subtr
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FIGURE 9.10 Unsigned 6 by 6 array m
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Digit Recurrent Division The most c
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FIGURE 9.14 Nonrestoring division.
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The Newton-Raphson division algorit
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FIGURE 9.18 Floating-point addition
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9.2 Fast Adders and Multipliers Gen
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FIGURE 9.20 Half-adder circuit. is
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gi pi FIGURE 9.22(b) Carry skip cir
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Assuming that a single level of the
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Array-Type Multiplier The simplest
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p1i,j p2i,j p3i,j p4i,j FIGURE 9.27
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The partial product PP j is to be c
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The sum SGN of the whole extended b
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FIGURE 9.31 54 × 54-bit parallel m
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6. Svensson, C. and Tjarnstrom, R.,
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Design Techniques III 10 Timing and
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FIGURE 10.1 Typical chip interface.
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Loop Components PLLs and DLLs share
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delay is some fraction of the input
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esults from the voltage across the
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© 2002 by CRC Press LLC TABLE 10.2
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db(H( ω)) FIGURE 10.6 PLL closed-l
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ω )/G O) db(T(ω ph(T( )/π) FIGUR
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Phase Margin (deg) FIGURE 10.10 PLL
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FIGURE 10.11 Measured PLL jitter hi
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FIGURE 10.13 DLL output jitter sens
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FIGURE 10.18 PLL output jitter sens
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Active supply filters employ amplif
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FIGURE 10.19 Single-ended delay ele
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Frequency (GHz) FIGURE 10.23 Freque
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FIGURE 10.25 Push-pull charge pump.
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Circuit Summary In general, all DLL
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5. T. Lee, et al., “A 2.5V CMOS D
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introduced in [3], is used to repre
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FIGURE 10.31 Setup and hold time ti
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FIGURE 10.34 Max-timing diagrams fo
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FIGURE 10.37 Time borrowing for sin
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FIGURE 10.39 Max-timing for single-
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Min-Timing In contrast to max-timin
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FIGURE 10.46 Min-timing diagrams fo
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FIGURE 10.49 Edge-triggered, flip-f
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FIGURE 10.51 FIGURE 10.52 Max-timin
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FIGURE 10.53 Transparent-high latch
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FIGURE 10.57 Complementary TSPC tra
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FIGURE 10.61 A positive, edge-trigg
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FIGURE 10.66 Pulsed latches. FIGURE
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assigned, based on the subcircuit t
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FIGURE 10.71 Scan chain for dual-ph
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and SEB, which are complementary, c
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when used as a flip-flop, the NAND3
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FIGURE 10.75 Integrated memory for
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Memory Cell Bit# Bit FIGURE 10.78 A
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FIGURE 10.80 Modeling process varia
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FIGURE 10.83 A column circuit. FIGU
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advantage of this circuit, compared
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K. Wayne Current University of Cali
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11.2 Nonvolatile Multiple-Valued Me
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Multiple-Valued EEPROM and Flash Me
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direct properly scaled and logicall
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Current comparators are a critical
Page 470 and 471: FIGURE 11.4 Current-mode CMOS quate
Page 472 and 473: FIGURE 11.6 Current-mode CMOS quate
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Page 476 and 477: FIGURE 11.11 Current-mode CMOS quat
Page 478 and 479: FIGURE 11.12 Current-mode CMOS latc
Page 480 and 481: FIGURE 11.14 Current-mode CMOS anal
Page 482 and 483: esults confirm the DC transfer func
Page 484 and 485: 19. T. T. Dao, “Threshold I2L and
Page 486 and 487: FIGURE 12.1 Device technologies use
Page 488 and 489: selected depending on the number of
Page 490 and 491: Architecture of Newer Generation FP
Page 492 and 493: FIGURE 12.6 An example of a simple
Page 494 and 495: tools, the + 1 operation is a speci
Page 496 and 497: download the programming data to th
Page 498 and 499: FIGURE 13.1 High-performance microp
Page 500 and 501: FIGURE 13.4 TABLE 13.1 combinationa
Page 502 and 503: accurate wire modelling while limit
Page 504 and 505: FIGURE 13.6 Dual-rail, multiple-out
Page 506 and 507: FIGURE 13.10 Effect of output inver
Page 508 and 509: FIGURE 13.11 Unfooted dynamic 4:1 m
Page 510 and 511: (4) the limit of designers to manag
Page 512 and 513: © 2002 by CRC Press LLC IV Design
Page 514 and 515: FIGURE 14.1 FIGURE 14.2 newer semic
Page 516 and 517: The cost impact of power consumptio
Page 518 and 519: In any case, the move toward “Gre
Page 522 and 523: 14.2 Power Estimation As we saw in
Page 524 and 525: lock as a function of various param
Page 526 and 527: FIGURE 14.8 Sleep transistors to co
Page 528 and 529: FIGURE 14.12 Data enabling. In addi
Page 530 and 531: Power Reduction through CAD Tools P
Page 532 and 533: AMPS AMPS is a circuit power optimi
Page 534 and 535: Masayuki Miyazaki Hitachi, Ltd. 15.
Page 536 and 537: 15.3 Supply Voltage Management Supp
Page 538 and 539: FIGURE 15.4 MT-CMOS balloon circuit
Page 540 and 541: FIGURE 15.9 EVT-CMOS circuit design
Page 542 and 543: FIGURE 15.12 VT-CMOS block diagram
Page 544 and 545: FIGURE 15.15 SA-V t CMOS scheme wit
Page 546 and 547: FIGURE 15.17 Floating-point datapat
Page 548 and 549: Vivek De Intel Corporation Ali Kesh
Page 550 and 551: FIGURE 16.3 n-channel ID vs. VG sho
Page 552 and 553: Gate-Induced Drain Leakage (I 4) GI
Page 554 and 555: FIGURE 16.7 Two-nMOS stack in a two
Page 556 and 557: FIGURE 16.11 Four-input NAND NMOS s
Page 558 and 559: FIGURE 16.12 Distribution of standb
Page 560 and 561: Die count FIGURE 16.16 (a) Adaptive
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Page 566 and 567: the parameter to be maximized since
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The voltage converter required for
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FIGURE 17.7 DVS improvement for UI
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FIGURE 17.10 Measured throughput vs
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FIGURE 17.12 Sources of noise margi
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FIGURE 17.15 Ring oscillator adapti
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FIGURE 17.17 Sense-amp delay variat
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Christian Piguet CSEM: Centre Suiss
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Some Basic Rules There are some bas
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TABLE 18.2 Looped 8-bit Multiply Pr
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FIGURE 18.4 new architecture paradi
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FIGURE 18.6 FIGURE 18.7 the second
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FIGURE 18.9 FIGURE 18.10 With latch
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18.6 Low-Power Memories As memories
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connected to the main bitline (only
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is today only about a factor of 2 d
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Katsunori Seno SONY Corporation 19.
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FIGURE 19.2 FIGURE 19.3 This is a c
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FIGURE 19.6 FIGURE 19.7 FPGA sacrif
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FIGURE 19.9 RAWn precharge FIGURE 1
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a fixed given standard. References
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Hendrawan Soeleman Purdue Universit
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for a short period of time when bot
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Total Average Power Putting togethe
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Signal Probability Calculation In c
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Example Given y = x 1 + x 2. Find P
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A B F FIGURE 20.7 Unfactorized and
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etween successive transitions is a
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FIGURE 20.9 A logic gate and its co
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Results Using Probabilistic Techniq
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FIGURE 20.12 Probabilistic and stat
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14. VLSI Microprocessors: A Guide t
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0 V to a voltage V in time T throug
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a small fraction of circuit nodes t
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FIGURE 21.6 (a) E-R latch, (b) timi
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FIGURE 21.8 Potential E-R latch for
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The only difference between the two
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FIGURE 21.14 (a) Clock-powered stat
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FIGURE 21.17 The three drivers used
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FIGURE 21.20 Energy-delay product (
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FIGURE 21.22 AC-1 clock-driver sche
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clock-powered nodes accounted for 8
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Two generations of clock-powered mi
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29. Athas, W. C., Tzartzanis, N., M
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Wayne Wolf Princeton University 22.
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so a CPU could be built in reconfig
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optimized processes. Although embed
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FIGURE 22.4 they are most useful wh
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• How should processes be allocat
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25 memory system activity. If the c
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Jonathan W. Valvano University of T
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FIGURE 23.2 6808, I/O ports A and B
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personnel so that they are proficie
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BDM can provide the ability to obse
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minor modifications to the finite s
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Many components are included in a d
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will saturate resulting in a bang-b
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Two approaches are used to synchron
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Fred J. Taylor University of Florid
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The output of a linear system havin
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FIGURE 24.2 Effects of windowing an
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frequency range ±f Nyquist = ±f s
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performance, complexity, and precis
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overflows of intermediate sums. Tha
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24.7 Applications “DSP” has bec
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DSP (Digital Signal Processor) or D
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PC as a Terminal (Modem) The PC is
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characteristics: • Fixed pictures
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HDTV (and Digital Television) If th
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Modem Banks This is the first of th
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25.7 Automotive, Industrial Althoug
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36. MITEL Semiconductor: www.semico
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26.2 Digital Filters The theory of
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|H | 1 FIGURE 26.1 Frequency select
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TABLE 26.1 Filter Design Comparison
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frequency response involves some al
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Impulse Response 0.2 0.15 0.1 0.05
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This constrained magnitude problem
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FIGURE 26.8 Block diagram of the ge
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11. Ikehara, M., Tanaka, H., and Ku
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Adam Dabrowski Poznan University To
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−12 2 The reference in this case
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FIGURE 27.1 Two-band filter bank: (
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FIGURE 27.5 Critical bandwidth and
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FIGURE 27.7 Threshold of audibility
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FIGURE 27.10 Critical band index in
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FIGURE 27.13 Simplified model of th
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All described masking effects are e
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where From Eqs. (27.32) and (27.33)
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eal-time. Although floating-point p
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FIGURE 27.19 Overlapped, power comp
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FIGURE 27.21 Symmetrical FIR filter
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In the MPEG-1 encoder an efficient
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These first two approaches can be m
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FIGURE 27.27 ADPCM: (a) encoder, (b
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FIGURE 27.30 General scheme of the
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A new standard MPEG-7, named the mu
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FIGURE 27.32 AC-3 encoder. FIGURE 2
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29. Marven, C. and Ewers, G., A sim
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FIGURE 28.1 FIGURE 28.2 of the huma
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FIGURE 28.5 image of reasonable qua
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Consider the case of a simple 2-D
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FIGURE 28.8 A sampled spatiotempora
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oth high spatial frequency componen
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If it were separable (that is, H(ξ
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The first hypothesis (the less plau
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FIGURE 28.17 The real (top) and ima
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FIGURE 28.18 The resolution of a ti
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FIGURE 28.20 Motion estimation by b
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where the superscripts n and n + 1
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must be found via a finite set of o
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The methods in this subsection are
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FIGURE 28.28 The split phase. Using
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35. Y.-T. Wu, T. Kanade, J. Cohn, a
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29.2 Power Dissipation in Digital C
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additional power benefits. Efficien
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Power savings are higher than simpl
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A priori knowledge of data stream d
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FIGURE 29.7 DCT Chip [my DCT] avera
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19. S. Uramoto et al. A 100 MHz 2-D
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Anna Hać University of Hawaii 30.1
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Using TCP/IP also makes the network
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this is for one mobile host which i
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TDMA Time-division multiple access
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path delay. The two measures of the
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are under the control of the system
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the bandwidth reserved in the targe
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Chik-Kong Ken Yang University of Ca
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FIGURE 31.3 attenuation (dB) -3.0 -
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FIGURE 31.5 to handle large voltage
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p_o V bias FIGURE 31.8 High-impedan
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out[n] a0 FIGURE 31.11 Transmitter
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FIGURE 31.15 Receiver design using
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digitally by first feeding the inpu
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FIGURE 31.19 90 o locking using XOR
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Power of these links is becoming an
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46. Takahashi, T. et al., “A CMOS
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Many computer programs exhibit some
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32.3 Related Memory Models, Hierarc
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32.6 External Sorting and Related P
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uns, each striped across the disks.
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Matrix transposition is the special
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of satellite images is over one ter
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TABLE 32.3 Best Known I/O Bounds fo
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e accessed directly in a single I/O
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implementations of priority queues
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By the reduction in [52], a data st
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set of experiments on various text
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3. A. Acharya, M. Uysal, and J. Sal
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44. J. L. Bentley and J. B. Saxe. D
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85. P. Ferragina and F. Luccio. Dyn
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128. V. Kumar and E. Schwabe. Impro
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173. H. Samet. The Design and Analy
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Peter J. Varman Rice University 33.
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need for fast transfers, up to 1 Gb
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In contrast to prefetching that mas
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The ERF algorithm was analyzed in [
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increment lowestPriorityOnDisk(disk
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External or out-of-core algorithms
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33. M. Kallahalla and P. J. Varman.
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advanced, reaching the point where
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FIGURE 34.3 FIGURE 34.4 defines the
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FIGURE 34.5 Trellis representation
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FIGURE 34.7 Data and servo sectors.
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References 1. S. H. Charrap, P. L.
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High-frequency noise is then remove
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The various components of (34.3) ar
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sequences are more complex, and occ
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ange of 10 −12 -10 −15 . Anothe
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strategies are reviewed, which have
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FIGURE 34.13 Magnitude response for
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taps as an approximation of the Typ
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FIGURE 34.18 CTF BER performance de
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TABLE 34.1 Examples of Equalizers I
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(i) Symbol rate VCO based timing re
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Symbol Rate Timing Recovery Schemes
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where B = B 1 + B 2 + 1 is the size
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in � out � d(k) FIGURE 34.26 Ti
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�(k) z -L FIGURE 34.27 Linearized
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10 −4 and 10 −2 . The steady-st
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16. J. Sonntag, et al., “A high s
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y a special sequence known as the a
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FIGURE 34.36 An example of two Gray
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track n track n +1 FIGURE 34.38 The
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FIGURE 34.40 The phase format. Posi
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increase linear density while mitig
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FIGURE 34.43 Two equivalent constra
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FIGURE 34.44 Possible pairs of sequ
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Distance δ min,C can be bounded as
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FIGURE 34.45 Standard concatenation
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30. E. Soljanin, “On-track and of
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The next block is PRE. What is PR?
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In the above example, we see that s
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FIGURE 34.52 Feedback detector. Cat
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FIGURE 34.54 Decision feedback equa
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esponse (this is also valid for dif
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its use, while the computational, o
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FIGURE 34.58 Viterbi algorithm dete
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Noise-Predictive Maximum Likelihood
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The error event likelihoods are cal
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Metric-First Algorithms Metric-firs
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termination at the same time. Howev
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13. J. Hagenauer, “Applications o
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Given a code C of length n and dime
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Notice that, although a code may ha
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Not many perfect codes exist. In th
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Theorem 1 (Shannon) For any � > 0
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If we write the codewords as polyno
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Let © 2002 by CRC Press LLC 1 1 K
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which, in polynomial form, is Let E
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m Σl=0 because a l = (a m+1 − 1)
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Evaluating the syndromes, we obtain
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FIGURE 34.63 Interleaving m times o
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Operating System © 2002 by CRC Pre
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systems, the most notable example b
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35.3 Components of Distributed Oper
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Message-passing IPC shares many cha
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process at any arbitrary stage in i
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Few attempts were made in the past
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alternate years with SOSP), and the
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© 2002 by CRC Press LLC 42 Mobile
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FIGURE 36.1 were introduced; howeve
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FPGAs by providing on-chip memory f
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FIGURE 36.3 There is a considerable
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FIGURE 36.4 The general form of the
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FIGURE 36.6 If a VPB can cover all
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John Morris University of Western A
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FIGURE 37.1 Simplified block diagra
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inverters, and the programmable mul
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Programmable Active Memories (PAM)
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measured in megabits, not megabytes
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from modern FPGAs, e.g., Altera’s
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Regularity A processing pipeline wi
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Other Languages Other routes from h
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29. Bergmann, N.W., and Dawood, A.,
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FIGURE 37.8 Basic architectures for
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Selected Applications Several class
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Development Systems Developing appl
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implementation. Reconfigurable or r
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The designer starts the generation
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lock but allows multiple instructio
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data-types that are mapped to TIE r
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Conclusions Configurable and extens
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FIGURE 38.1 Average vehicle speed.
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AHS means advanced cruise-assist hi
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TABLE 38.3 navigation systems VICS
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FIGURE 38.9 FIGURE 38.10 a map data
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FIGURE 38.13 The four basic functio
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Support of Safe Driving System The
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System evaluation, the fourth issue
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FIGURE 38.18 Summarizing the three
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uilder tools serving to build MMI o
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FIGURE 38.23 FIGURE 38.24 automaker
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FIGURE 38.26 FIGURE 38.27 The first
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FIGURE 38.30 FIGURE 38.31 a kind of
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To Probe Further In this field, the
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FIGURE 39.1 of more versatile media
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1 • 3DNow! 1 [11,12] from AMD,
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FIGURE 39.6 In the packed add instr
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If saturation arithmetic is used in
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TABLE 39.1 Examples of Operations T
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FIGURE 39.10 PAVG R c, R a, R b: Pa
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FIGURE 39.13 Packed compare instruc
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FIGURE 39.17 Packed multiply high i
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FIGURE 39.20 Packed multiply left i
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FIGURE 39.23 In the packed multiply
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TABLE 39.4 Packed Integer Multiplic
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Subword Permutation Instructions In
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is n log 2(n). Table 39.6 shows how
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FIGURE 39.33 Mix left instruction.
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TABLE 39.7 Subword Permutation Inst
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TABLE 39.9 IA-64 uses FPMA and FPMS
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The two-bit result field is written
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source register. These three FP mix
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13. Motorola, “AltiVec technology
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FIGURE 39.48 ManArray 1 × 2 core e
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FIGURE 39.50 Hypercube interconnect
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FIGURE 39.53 Host DSP software laye
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Benchmark Data Type Performance 256
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FIGURE 39.56 Simplified schematic o
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Gaming applications often require a
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system, and the application program
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FIGURE 39.60 FIGURE 39.61 FIGURE 39
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FIGURE 39.64 shifting place limits
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FIGURE 39.66 pitch Address Looping
Page 1138 and 1139:
FIGURE 39.69 gain of the filter. It
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as a core to integrate onto the sam
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7. Rossum, D., Constraint based aud
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FIGURE 39.74 Procedure for simulate
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The fitness value of an individual
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FIGURE 39.77 The tabu list can be v
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Intermediate-term memory component
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FIGURE 39.81 Selection. FIGURE 39.8
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Work on parallelization of the tabu
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Acknowledgment The authors acknowle
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47. L. K. Grover. A new Simulated A
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93. E. M. Rudnick, J. H. Patel, G.
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138. Youn-Long Lin, Yu-Chin Hsu, an
Page 1164 and 1165:
This architecture allowed for large
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FIGURE 40.3 40.3 Application Server
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FIGURE 40.5 applications. CORBA cur
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FIGURE 40.8 The application server
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FIGURE 40.10 The proposed architect
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cost at the front end. The ideal ap
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FIGURE 40.12 Client-server and netw
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Yoshiaki Hagiwara Sony Corporation
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FIGURE 41.2 This corresponds to the
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FIGURE 41.5 Buried channel CCD stru
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FIGURE 41.8 Applications of CCD and
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sensor (1100 K pixel) Microphone ×
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�� FIGURE 41.14 Form com
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FIGURE 41.16 Stack technology. Link
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1st EmDRAM Product FIGURE 41.19 Emb
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FIGURE 41.23 Em-DRAM process techno
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John F. Alexander University of Nor
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Several reasons exist for mentionin
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sort of local area network. Support
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Technological hurdles must be overc
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FIGURE 42.1 Block diagram of (a) ge
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FIGURE 42.3 Alternative FIR filter
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FIGURE 42.5 Polyphase filter struct
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3. E. Dahlman, Bjorn Gudmundson, M.
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TABLE 42.1 Categorizing Reusable Co
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FIGURE 42.11 Internet growth. FIGUR
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FIGURE 42.13 Software for VoIP SoC.
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FIGURE 42.17 Bandwidth trends. FIGU
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The interconnections between the va
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FIGURE 42.21 A typical communicatio
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carry information over longer dista
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however, it is not uncommon that so
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node, to which the user is connecte
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its information. Intuitively, this
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This issue is referred to as latenc
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Evolution of Standard Image/Video C
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FIGURE 42.26 Sequence of zigzag-cod
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FIGURE 42.29 150th Frame of origina
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FIGURE 42.31 Data partitioning for
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for transmitting a predictively cod
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42.6 Pen-Based User Interfaces—An
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FIGURE 42.35 The handwriting recogn
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• No toggling between edit/contro
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FIGURE 42.39 Boxplots of time to en
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0 … 9 ( ) -
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is using the SMIL generic media ref
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FIGURE 42.47 Example of pen-and-pap
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slots specifying pieces of informat
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most stringent demands for low-powe
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FIGURE 42.51 MIPS requirement of se
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FIGURE 42.54 von Neumann architectu
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FIGURE 42.57 Dual Mac architecture
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FIGURE 42.59 Two data path variatio
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FIGURE 42.60 Basic pipeline archite
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References 1. Bahl L., Cocke J., Je
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Random Oracle Model One direction o
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at the end of its usefulness. A new
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function and verification function
Page 1280 and 1281:
underlies the Diffie-Hellman key ag
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31. Dolev, D., Dwork, C., and Naor,
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R. Chandramouli Synopsys Inc. 44.1
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many deficiencies in the design may
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impact the performance and test ove
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FIGURE 44.4 FIGURE 44.5 It becomes
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SoC methodologies require synchroni
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This method, however, lacks the app
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FIGURE 45.2 Input formats of MILEF
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FIGURE 45.3 FIGURE 45.4 Robustness
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FIGURE 45.5 In Fig. 45.5 a simple e
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difficult to identify for overcurre
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General Approach in Comparison with
Page 1306 and 1307:
FIGURE 45.10 phase—the propagatio
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shorter test sequence could possibl
Page 1310 and 1311:
Looking at results of Table 45.6, i
Page 1312 and 1313:
45.4 Summary Automatic test pattern
Page 1314 and 1315:
41. F. Brglez, H. Fujiwara: A neutr
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FIGURE 46.1 Rule of ten in testing
Page 1318 and 1319:
FIGURE 46.5 FIGURE 46.6 of the DUT.
Page 1320 and 1321:
FIGURE 46.7 generate tests for ever
Page 1322 and 1323:
FIGURE 46.9 FIGURE 46.10 behavioral
Page 1324 and 1325:
Z. Stamenković University of N. St
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FIGURE 47.2 Murphy’s Model The mo
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where k is the total number of crit
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FIGURE 47.5 Definition of IC critic
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distribution [34,35]: © 2002 by CR
Page 1334 and 1335:
and, in the case of w = X 2 − X 1
Page 1336 and 1337:
Algorithm • Input: a singly linke
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TRACIF takes a CIF file as input an
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TABLE 47.2 Critical Area Extraction
Page 1342 and 1343:
Also, the critical areas for lithog
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(enhancement of the process cleanli
Page 1346 and 1347:
28. Corsi, F. and Martino, S., Defe
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U. Glaeser

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