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U. Glaeser

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Applications normally change with time, as customers demand new features. Adding new features<br />

expands the size and usually slows the speed of the application. But, since hardware performance normally<br />

improves much more than the loss of speed due to new features, the overall application performance<br />

generally improves with time.<br />

The characteristics of the main applications determine the important performance features for the<br />

supporting hardware technology. General-purpose computers must be capable of performing well on a<br />

variety of applications. Embedded systems may run only a single application. Business systems may require<br />

fast storage devices for transaction processing. Generally, however, fast speed, low cost, big memory and<br />

storage, and small physical size tend to be important for most applications.<br />

4.2 Computer and Integrated Circuit Technology<br />

Computers have used a variety of technologies: mechanics, electrical relays, vacuum tubes, electrostatics,<br />

transistors, integrated circuits, magnetic recording, and lasers. Changing technologies have allowed<br />

improved price-performance, resulting in faster speed, larger memories, smaller physical size, and lower<br />

cost. The main technologies where price-performance has increased dramatically are in processor performance,<br />

memory, and storage size.<br />

The driver of current price-performance improvements is complementary metal oxide semiconductor<br />

(CMOS) integrated circuit production technology [23]. An integrated circuit starts as a $300 slice of<br />

poly-silicon crystal. After processing, a 300 mm wafer is worth about $5000, but may contain several<br />

hundred circuits, depending on the size of the circuit. The price of a specific circuit is dependant mainly<br />

on the size of the circuit. The size and complexity of the circuit are the main factors determining the<br />

yield of the circuit. Many circuits do not function properly due to impurities in the wafer or due to<br />

defects in the manufacturing process.<br />

CMOS circuits make up the majority of all circuits for processors. Some special processes are required<br />

for producing specific types of circuits, such as memory chips, analog circuits, opto-electronic components,<br />

and ultra-high speed circuits. However, CMOS has become the main production technology over the last<br />

20 years [24]. CMOS technology has improved significantly with time and will continue to improve over<br />

the next several years with some effort [25,26]. Wafer sizes have grown, and the sizes of features (line widths)<br />

on the circuit have been reduced. The speed and cost of CMOS circuits improve with smaller line sizes.<br />

2<br />

As the feature size decreases by the scaling factor α,<br />

the gate area and chip size decrease by α , the speed<br />

increases (the gate delay decreases) by a factor of α,<br />

and the power decreases by a factor of α [23]. These scaling<br />

rules have been used for some time. However, with the small features sizes used now, other effects also limit<br />

the speed. Table 4.3 shows selected features about the improvement of integrated circuits over time [25–36].<br />

TABLE 4.3<br />

© 2002 by CRC Press LLC<br />

Integrated Circuit Process Improvement with Time<br />

Year Process Chip Size (mm) Features (microns) Wafer (mm) Sample IC Clock Metal Layers<br />

1958 Planar — 100 — First IC — —<br />

1961 — 1.5 × 1.5 25 25 First silicon IC — —<br />

1966 — 1.5 × 1.5 12 25 SSI — —<br />

1971 pMOS 2.5 × 2.5 10 50 i4004 .74 MHz 1<br />

1975 pMOS 5 × 5 8 75 i8080 2 MHz 1<br />

1978 nMOS 5 × 5 5 75 Z-80 4 MHz 1<br />

1982 HMOS 9 × 9 3 100 i8088 8 MHz 1<br />

1985 HMOS 12 × 12 1.50 125 i286 10 MHz 2<br />

1990 HCMOS 12 × 12 0.80 150 MC68040 25 MHz 3<br />

1995 CMOS 12 × 12 0.50 150 Pentium 100 MHz 4<br />

2000 CMOS 15 × 15 0.25 200 Pentium-III 1 GHz 6<br />

2001 CMOS 15 × 15 0.18 300 Pentium-4 1.5 GHz 7<br />

2005 CMOS 22 × 22 0.10 300 — 4 GHz 8<br />

2010 CMOS 25 × 25 0.06 300 — 10 GHz 9<br />

2015 CMOS 28 × 28 0.03 450 — 25 GHz 10

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