U. Glaeser

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45.4 Summary Automatic test pattern generation yielding high fault coverage for CMOS circuits has received wide attention in industry and academia for a long time. Mixed-level test pattern generation offers advantages, since test generation from gate-level netlists has shortcomings regarding fault coverage in complex CMOS gates. A switch-level approach relying on the transistor structure only is too slow and impractical for larger circuits. The first part of this chapter describes automatic test pattern generation with a mixed switch-level and gate-level approach. It combines acceptable performance for large networks with a high fault coverage also for nontrivial transistor networks. Patterns generated this way are inherently capable to detect stuck-open faults and transition faults as well as various other fault models on different abstraction levels. In combination with local overcurrent detectors, also stuck-on and local bridging faults can be identified. To increase the efficiency of mixed-level test generation, a reconvergency analysis is performed and constraints are stored. An original approach to test generation for synchronous sequential circuits was presented. Two levels of hierarchy, the switch-level and the gate-level are supported. Inter-level backtracks between these two hierarchies are implemented. The number of inter-level backtracks is minimized using simple heuristics for constraint identification, which is a promising method for hierarchical test generation also on higher levels (RT or behavior level). A new efficient algorithm called FOGBUSTER for the forward propagation backward initialization technique handles synchronous sequential circuits. A 4-valued logic and a twostaged backtracking mechanism are used to handle the over-specification problem and to achieve completeness. Experimental results for the ISCAS ’85 and ISCAS ’89 benchmark circuits are encouraging. In comparison to the BACK-algorithm and to the HITEC approach, FOGBUSTER on the average has a significantly better performance. References 1. H. Fujiwara, T. Shimono: On the acceleration of test generation algorithms, IEEE Trans. on Computers (C-32), 1983, pp. 1137–1144. 2. M. H. Schulz, E. Trischler, T. M. Sarfert: SOCRATES: A highly efficient ATPG system, IEEE Trans. CAD, Vol. 7, Jan. 1988, pp. 126–137. 3. J. P. Roth: Diagnosis of Automata Failures: A calculus and a method, IBM Journal, 1966, pp. 278– 291. 4. M. H. Schulz, E. Auth: Essential: An efficient self-learning test pattern generation algorithm for sequential circuits, Proc. IEEE Int. Test Conf., 1989, pp. 28–37. 5. N. Gouders, R. Kaibel: Advanced techniques for sequential test generation, Proc. 2nd European Test Conf., Munich, 1991. 6. R. L. Wadsack: Fault modeling and logic simulation in CMOS and MOS integrated circuits, Bell Systems Technical Journal, May–June 1978, pp. 1449–1474. 7. F. Ferguson, J. Shen: Extraction and simulation of realistic CMOS faults under inductive fault analysis, Proc. IEEE Int. Test Conf., 1988, pp. 475–484. 8. H. T. Vierhaus: Testability of CMOS faults under realistic conditions, Microprocessing and Microprogramming, Vol. 27, pp. 681–686, 1989. 9. U. <strong>Glaeser</strong>, U. Hübner, H. T. Vierhaus: mixed level hierarchical test generation for transition faults and overcurrent related defects, Proc. ITC ’92, pp. 21–29. 10. U. <strong>Glaeser</strong>, H. T. Vierhaus: MILEF: an efficient approach to mixed level automatic test pattern generation, Proc. EURODAC ’92, pp. 318–321. 11. K. W. Chiag, Z. G. Vranesic: on fault detection in CMOS logic networks, Proc. IEEE Int. Test Conf., 1983, pp. 50–56. 12. C. Glover: Mixed mode ATPG under input constraints, Proc. IEEE Int. Test Conf., 1990. 13. M. L. Flottes, C. Landrault et al.: Mixed level automatic test pattern generation for CMOS, Proc. 2nd European Test Conf., Munich, 1991, pp. 273–282. © 2002 by CRC Press LLC
14. C.-H. Shen and J. A. Abraham: Mixed level sequential test generation using a nine valued relaxation algorithm, Proc. ICCAD-90, pp. 230–235. 15. K. J. Lee, C. A. Njinda, M. A. Breuer: SWITEST: a switch-level test generation system for CMOS combinational circuits, Proc. DAC ’92, pp. 26–29. 16. H. Cox and J. Rajski: Stuck-open and transition fault testing in CMOS complex gates, IEEE Int. Test Conf., 1988, pp. 688–694. 17. V. S. Iyengar, B. K. Rose, I. Spencer: Delay test generation I—concepts and coverage metrics,” Proc. Int. Test Conf., 1988. 18. E. S. Park, M. R. Mercer, T. W. Williams: Statistical delay fault coverage and defect level for delay faults, Proc. Int. Test Conf., 1988. 19. K. Fuchs, F. Fink, M. H. Schulz: DYNAMITE: An efficient automatic test pattern generation system for path delay faults, IEEE Trans. CAD, Oct. 1991. 20. M. Geilert, J. Alt, M. Zimmermann: On the efficiency of the transition fault model for delay faults, Proc. ICCAD-90, pp. 272–275. 21. S. Devadas, K. Keutzer: Design of integrated circuits fully testable for delay faults and multifaults, Proc. ITC ’90, pp. 284–293. 22. C. H. Chen, J. A. Abraham: Mixed-level sequential test generation using a nine-valued relaxation algorithm, Proc. ICCAD ’90, pp. 230–233. 23. W. Maly, P. Nigh: Built-in current testing—a feasibility study, Proc. IEEE ICCAD ’88, 1988, pp. 340–343. 24. T. Storey, W. Maly, J. Andrews, M. Miske: Comparing stuck fault and current testing via CMOS chip test, Proc. 2nd European Test Conf., Munich, 1991, pp. 149–156. 25. W. Cheng: The BACK-algorithm for sequential test generation, Proc. ICCD ’88, pp. 66–69. 26. R. Marlett: EBT: A comprehensive test generation technique for highly sequential circuits, Proc. DAC ‘78, pp. 335–339. 27. T. Ma, S. Devadas, A. R. Newton, A. Sangiovanni-Vincentelli: Test generation for sequential circuits, IEEE Trans. Computer Aided Design, 1888, pp. 1081–1093. 28. P. Camurati, F. Corno, P. Prinetto, M. Sonza Reorda: A Simulation-based approach to test pattern generation for synchronous sequential circuits, IEEE VLSI Test Symposium, 1992, pp. 263–267. 29. V. D. Agrawal, K. T. Cheng, P. Agrawal: A direct search method for test generation for sequential circuits, IEEE Trans. Computer-Aided Design, Feb. 1989, pp. 131–138. 30. U. Hübner, H. T. Vierhaus: Testmustergenerator für kombinatorische CMOS Schaltungen, GMD- Studie Nr. 155, GMD, St. Augustin, 1989, pp. 85–93. 31. U. Hübner, R. Camposano: Partitioning and analysis of static digital CMOS-circuits, Arbeitspapiere der GMD 761, July 1993. 32. D. T. Blaauw, R. B. Mueller-Thuns, D. G. Saab, P. Banerjee: SNELL: A switch level simulator using multiple levels of functional abstraction, Proc. ICCAD ’90, pp. 66–69. 33. U. Hübner, H. Hinsen, M. Hofebauer, H. T. Vierhaus: Mixed level test generation for high fault coverage, Microprocessing and Microprogramming, Vol. 32, No. 1–5, Aug. 1991, pp. 791–796. 34. U. Hübner, H. T. Vierhaus: Built-in current testing vs. delay fault testing—a case study, Proc. IEEE CompEuro ’92, Den Haag. 35. F. Brglez, P. Pownall, R. Hum: Applications of testability analysis: from ATPG to critical path tracing, Proc. ITC ’84, pp. 705–712. 36. A. Lioy, M. Mezzalama: On parameters affecting ATPG performance, Proc. CompEuro ’87, pp. 394– 397. 37. L. H. Goldstein: Controllability/observability measure for logic testability, IEEE Trans. Circuits and Systems, Vol. CAS-26, pp. 685–693, 1979. 38. S. M. Reddy, M. K. Reddy, V. D. Agrawal: Robust tests for stuck-open faults in CMOS combinational logic circuits, Proc. FTCS ’84, pp. 44–49. 39. W. Meyer, R. Camposano: Fast hierarchical multi-level fault simulation of sequential circuits with switch-level accuracy, Proc. DAC ’93, pp. 515–519. 40. L. N. Reddy, I. Pomeranz, S. M. Reddy: COMPACTEST-II: a method to generate two-pattern test sets for combinational logic circuits, Proc. ICCAD-92, pp. 568–574. © 2002 by CRC Press LLC
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© 2002 by CRC Press LLC
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© 2002 by CRC Press LLC Fernanda p
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Locating Your Topic Several avenues
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Krste Asanovic Massachusetts Instit
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7 8 9 Architectures for Low Power P
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SECTION VII Communications and Netw
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45 Testing of Synchronous Sequentia
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Hiroshi Iwai Tokyo Institute of Tec
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FIGURE 1.2 FIGURE 1.3 © 2002 by CR
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1.2 Downsizing below 0.1 © 2002 by
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FIGURE 1.9 Subthreshold leakage cur
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FIGURE 1.13 Epitaxial channel [9].
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gate length reduction was accelerat
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of the prediction. Until only sever
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FIGURE 1.22 Clarke number of elemen
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1.5 Source and Drain Figure 1.25 sh
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FIGURE 1.27 Retrograde profile. FIG
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TABLE 1.6 Trend of Interconnect by
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TABLE 1.9a Trend of DRAM Cell: Stac
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FIGURE 1.36 Trend of gate length. F
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References 1. D. Kahng and M. M. At
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40. B. H. Lee, R. Choi, L. Kang, S.
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outputs of the gate regardless of t
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FIGURE 2.4 circuit. This is the bas
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FIGURE 2.8 Two different realizatio
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FIGURE 2.12 Multifunction circuitry
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Dynamic Logic Circuits The basic id
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transistors in the pull-down networ
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In Fig. 2.21(d), the cross-coupled
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FIGURE 2.23 Different configuration
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In some literature, the authors lik
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Concluding Remarks The feature size
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FIGURE 2.30 Other pass-transistor c
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FIGURE 2.34 Dual-rail, pass-transis
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Shannon expansion, as shown below,
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FIGURE 2.41 Logic circuit for Out =
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FIGURE 2.45 Example decomposed BDD.
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FIGURE 2.50 Diffusion-area sharing
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FIGURE 2.54 Relationship between co
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29. Shiple, T. R., Hojati, R., Sang
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FIGURE 2.58 DTMOS devices: (a) stan
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the design into a BDD representatio
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FIGURE 2.63 Circuit diagram of 2-in
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FIGURE 2.67 Synthesis of 2-input AN
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pass-transistor logic, constrained
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16. Bryant, R., Graph-based algorit
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As shown in Fig. 2.79, the MOSFET d
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n + SiO 2 FIGURE 2.80 No reverse bo
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structures are a powerful solution
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SiO 2 Epitaxial Si Double Layered P
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PD-SOI Application to High-Performa
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LO FIGURE 2.91 History effects. sta
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weight, lower cost, a wireless inte
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TABLE 2.7 Performance of sub-1 V MT
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X X FIGURE 2.99 1 V A/D converter u
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When the communication range is 10
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13. Nakashima, S., et al., Thicknes
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FIGURE 3.1 Conventional ECL circuit
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FIGURE 3.4 FIGURE 3.5 IPULL-DOWN, f
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FIGURE 3.7 V REG voltage regulator
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FIGURE 3.10 Layout of inverter gate
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FIGURE 3.14 Power consumption versu
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I/O Pads, is 60 mW for the multiple
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FIGURE 3.21 Maximum data rate vs. V
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John C. McCallum National Universit
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enchmark took between 15.7 and 5115
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The improvements in line widths, ch
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performance. Extensive lists of SPE
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TABLE 4.6 Functions of Memory and S
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Memory Price ($/MB) FIGURE 4.3 Cost
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TABLE 4.8 Disk Drive Characteristic
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4.6 Summary The performance of comp
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53. Curnow, H. J., and Wichmann, B.
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Computer Systems and Architecture
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advances that have been made in dev
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Server Types Servers are optimized
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Total Cost of Ownership Another con
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edundant memory-bit steering, and s
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majority of the users. Hardware opt
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processor implementations. In later
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FIGURE 5.7 an operand. For larger c
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Example 2 This example contrasts th
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Unlike the Defoe, the IA-64 archite
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This 3-phase approach fails to expl
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6. Scott Rixner, William J. Dally,
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Shared-memory vector architectures
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The vector ISA usually fixes the ma
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FIGURE 5.12 A vector unit construct
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use of loops optimized for certain
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9. Espasa, R., Advanced Vector Arch
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thread management (including run-ti
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In the message passing model, inter
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multithreaded hardware, possibly by
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synchronization) and usually contai
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a common register space, it is impo
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FIGURE 5.16 When a load request is
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list a few helpful references to wh
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38. S. Wallace, B. Calder, and D. T
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Of course, SIMD machines have limit
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computation, it will decrease execu
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FIGURE 5.19 An 8 × 8 baseline netw
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Since then, we have seen constant e
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Stack: Data: Text: Virtual Space FI
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FIGURE 5.25 Shared memory. Shared m
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0 2 GB Text Init. Data Bss Heap . .
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In general, if the necessary transl
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Mark Smotherman Clemson University
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Studies of Instruction-Level Parall
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Modern Designs Most high-performanc
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The principle of register renaming
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FIGURE 6.2 issued into the RS, (ii)
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Issue Dispatch FIGURE 6.4 The proce
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FIGURE 6.6 Scope of register renami
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FIGURE 6.9 State transition diagram
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Thus, the maximal number of instruc
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In addition, if rename buffers are
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it, whose role will be explained su
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As Fig. 6.13 shows, the latest proc
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for recovery. Both processors incor
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FIGURE C. The principle of direct i
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13. White, S. and Reysa, J., PowerP
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FIGURE 6.14 A branch flowing throug
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is that mispredictions limit the pr
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fetch engine to identify which inst
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FIGURE 6.17 A schematic for a bimod
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FIGURE 6.20 A schematic for a GAg g
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FIGURE 6.22 A schematic for a hybri
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time this branch is seen, those bit
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FIGURE 6.23 Branch prediction accur
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11. Price, C., MIPS IV Instruction
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transporting digital bits, whereas
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FIGURE 6.25 The system architecture
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Finally, because the main task of n
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Pradip Bose IBM T. J. Watson Resear
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frequency © 2002 by CRC Press LLC
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The “mips” metric for performan
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Hence, in this paper, we do not dwe
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FIGURE 7.4 Parallel SIMD architectu
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dynamic prediction of such idle mod
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FIGURE 7.7 High-level block-diagram
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(measured as a performance over pow
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Steady-state BIPS FIGURE 7.9 Perfor
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8. Larson, A. G., “Cost-effective
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Jozo J. Dujmović San Francisco Sta
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x FIGURE 8.1 Movement of the disk I
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The critical distance x ∗ is Ther
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Hence, the average seek time for th
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FIGURE 8.4 Four-parameter exponenti
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Access Time [ms] 2 0 0 FIGURE 8.6 M
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TABLE 8.1 Classification of Eight B
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The traditional load independent me
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Response Time [seconds] 290 270 250
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FIGURE 8.14 Prediction errors e(p)
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8.2 Performance Evaluation: Techniq
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is generally the most important mea
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tool to profile programs on the Alp
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driven simulation has two major pro
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A variety of profiling tools exist
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SPLASH, the SPLASH suite was create
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different types and complexity eith
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Table 8.8 provides sources for the
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37. MediaBench benchmarks, http://w
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(a) Instruction Cache (b) Trace Cac
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PE 0 Local Register File local bypa
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The large trace processor instructi
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11. S. Melvin, M. Shebanow, and Y.
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complement numbers. Sign magnitude
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where ak, bk, and ck are the inputs
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k + 1, etc. Extending to a third st
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a 12:15 b 12:15 4-Bit RCA s 12:15 F
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FIGURE 9.8 Two’s complement subtr
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FIGURE 9.10 Unsigned 6 by 6 array m
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Digit Recurrent Division The most c
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FIGURE 9.14 Nonrestoring division.
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The Newton-Raphson division algorit
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FIGURE 9.18 Floating-point addition
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9.2 Fast Adders and Multipliers Gen
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FIGURE 9.20 Half-adder circuit. is
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gi pi FIGURE 9.22(b) Carry skip cir
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Assuming that a single level of the
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Array-Type Multiplier The simplest
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p1i,j p2i,j p3i,j p4i,j FIGURE 9.27
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The partial product PP j is to be c
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The sum SGN of the whole extended b
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FIGURE 9.31 54 × 54-bit parallel m
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6. Svensson, C. and Tjarnstrom, R.,
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Design Techniques III 10 Timing and
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FIGURE 10.1 Typical chip interface.
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Loop Components PLLs and DLLs share
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delay is some fraction of the input
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esults from the voltage across the
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© 2002 by CRC Press LLC TABLE 10.2
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db(H( ω)) FIGURE 10.6 PLL closed-l
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ω )/G O) db(T(ω ph(T( )/π) FIGUR
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Phase Margin (deg) FIGURE 10.10 PLL
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FIGURE 10.11 Measured PLL jitter hi
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FIGURE 10.13 DLL output jitter sens
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FIGURE 10.18 PLL output jitter sens
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Active supply filters employ amplif
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FIGURE 10.19 Single-ended delay ele
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Frequency (GHz) FIGURE 10.23 Freque
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FIGURE 10.25 Push-pull charge pump.
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Circuit Summary In general, all DLL
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5. T. Lee, et al., “A 2.5V CMOS D
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introduced in [3], is used to repre
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FIGURE 10.31 Setup and hold time ti
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FIGURE 10.34 Max-timing diagrams fo
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FIGURE 10.37 Time borrowing for sin
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FIGURE 10.39 Max-timing for single-
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Min-Timing In contrast to max-timin
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FIGURE 10.46 Min-timing diagrams fo
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FIGURE 10.49 Edge-triggered, flip-f
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FIGURE 10.51 FIGURE 10.52 Max-timin
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FIGURE 10.53 Transparent-high latch
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FIGURE 10.57 Complementary TSPC tra
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FIGURE 10.61 A positive, edge-trigg
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FIGURE 10.66 Pulsed latches. FIGURE
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assigned, based on the subcircuit t
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FIGURE 10.71 Scan chain for dual-ph
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and SEB, which are complementary, c
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when used as a flip-flop, the NAND3
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FIGURE 10.75 Integrated memory for
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Memory Cell Bit# Bit FIGURE 10.78 A
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FIGURE 10.80 Modeling process varia
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FIGURE 10.83 A column circuit. FIGU
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advantage of this circuit, compared
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K. Wayne Current University of Cali
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11.2 Nonvolatile Multiple-Valued Me
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Multiple-Valued EEPROM and Flash Me
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direct properly scaled and logicall
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Current comparators are a critical
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FIGURE 11.4 Current-mode CMOS quate
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FIGURE 11.6 Current-mode CMOS quate
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observed with these circuits are ab
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FIGURE 11.11 Current-mode CMOS quat
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FIGURE 11.12 Current-mode CMOS latc
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FIGURE 11.14 Current-mode CMOS anal
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esults confirm the DC transfer func
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19. T. T. Dao, “Threshold I2L and
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FIGURE 12.1 Device technologies use
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selected depending on the number of
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Architecture of Newer Generation FP
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FIGURE 12.6 An example of a simple
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tools, the + 1 operation is a speci
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download the programming data to th
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FIGURE 13.1 High-performance microp
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FIGURE 13.4 TABLE 13.1 combinationa
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accurate wire modelling while limit
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FIGURE 13.6 Dual-rail, multiple-out
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FIGURE 13.10 Effect of output inver
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FIGURE 13.11 Unfooted dynamic 4:1 m
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(4) the limit of designers to manag
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© 2002 by CRC Press LLC IV Design
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FIGURE 14.1 FIGURE 14.2 newer semic
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The cost impact of power consumptio
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In any case, the move toward “Gre
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This static current is obviously un
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14.2 Power Estimation As we saw in
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lock as a function of various param
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FIGURE 14.8 Sleep transistors to co
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FIGURE 14.12 Data enabling. In addi
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Power Reduction through CAD Tools P
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AMPS AMPS is a circuit power optimi
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Masayuki Miyazaki Hitachi, Ltd. 15.
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15.3 Supply Voltage Management Supp
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FIGURE 15.4 MT-CMOS balloon circuit
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FIGURE 15.9 EVT-CMOS circuit design
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FIGURE 15.12 VT-CMOS block diagram
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FIGURE 15.15 SA-V t CMOS scheme wit
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FIGURE 15.17 Floating-point datapat
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Vivek De Intel Corporation Ali Kesh
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FIGURE 16.3 n-channel ID vs. VG sho
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Gate-Induced Drain Leakage (I 4) GI
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FIGURE 16.7 Two-nMOS stack in a two
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FIGURE 16.11 Four-input NAND NMOS s
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FIGURE 16.12 Distribution of standb
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Die count FIGURE 16.16 (a) Adaptive
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due to adaptive body bias worsens w
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Thomas D. Burd University of Califo
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the parameter to be maximized since
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17.3 Dynamically Varying Voltage If
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The voltage converter required for
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FIGURE 17.7 DVS improvement for UI
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FIGURE 17.10 Measured throughput vs
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FIGURE 17.12 Sources of noise margi
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FIGURE 17.15 Ring oscillator adapti
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FIGURE 17.17 Sense-amp delay variat
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Christian Piguet CSEM: Centre Suiss
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Some Basic Rules There are some bas
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TABLE 18.2 Looped 8-bit Multiply Pr
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FIGURE 18.4 new architecture paradi
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FIGURE 18.6 FIGURE 18.7 the second
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FIGURE 18.9 FIGURE 18.10 With latch
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18.6 Low-Power Memories As memories
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connected to the main bitline (only
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is today only about a factor of 2 d
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Katsunori Seno SONY Corporation 19.
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FIGURE 19.2 FIGURE 19.3 This is a c
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FIGURE 19.6 FIGURE 19.7 FPGA sacrif
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FIGURE 19.9 RAWn precharge FIGURE 1
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a fixed given standard. References
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Hendrawan Soeleman Purdue Universit
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for a short period of time when bot
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Total Average Power Putting togethe
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Signal Probability Calculation In c
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Example Given y = x 1 + x 2. Find P
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A B F FIGURE 20.7 Unfactorized and
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etween successive transitions is a
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FIGURE 20.9 A logic gate and its co
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Results Using Probabilistic Techniq
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FIGURE 20.12 Probabilistic and stat
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14. VLSI Microprocessors: A Guide t
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0 V to a voltage V in time T throug
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a small fraction of circuit nodes t
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FIGURE 21.6 (a) E-R latch, (b) timi
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FIGURE 21.8 Potential E-R latch for
Page 640 and 641:
The only difference between the two
Page 642 and 643:
FIGURE 21.14 (a) Clock-powered stat
Page 644 and 645:
FIGURE 21.17 The three drivers used
Page 646 and 647:
FIGURE 21.20 Energy-delay product (
Page 648 and 649:
FIGURE 21.22 AC-1 clock-driver sche
Page 650 and 651:
clock-powered nodes accounted for 8
Page 652 and 653:
Two generations of clock-powered mi
Page 654 and 655:
29. Athas, W. C., Tzartzanis, N., M
Page 656 and 657:
Wayne Wolf Princeton University 22.
Page 658 and 659:
so a CPU could be built in reconfig
Page 660 and 661:
optimized processes. Although embed
Page 662 and 663:
FIGURE 22.4 they are most useful wh
Page 664 and 665:
• How should processes be allocat
Page 666 and 667:
25 memory system activity. If the c
Page 668 and 669:
Jonathan W. Valvano University of T
Page 670 and 671:
FIGURE 23.2 6808, I/O ports A and B
Page 672 and 673:
personnel so that they are proficie
Page 674 and 675:
BDM can provide the ability to obse
Page 676 and 677:
minor modifications to the finite s
Page 678 and 679:
Many components are included in a d
Page 680 and 681:
will saturate resulting in a bang-b
Page 682 and 683:
Two approaches are used to synchron
Page 684 and 685:
Fred J. Taylor University of Florid
Page 686 and 687:
The output of a linear system havin
Page 688 and 689:
FIGURE 24.2 Effects of windowing an
Page 690 and 691:
frequency range ±f Nyquist = ±f s
Page 692 and 693:
performance, complexity, and precis
Page 694 and 695:
overflows of intermediate sums. Tha
Page 696 and 697:
24.7 Applications “DSP” has bec
Page 698 and 699:
DSP (Digital Signal Processor) or D
Page 700 and 701:
PC as a Terminal (Modem) The PC is
Page 702 and 703:
characteristics: • Fixed pictures
Page 704 and 705:
HDTV (and Digital Television) If th
Page 706 and 707:
Modem Banks This is the first of th
Page 708 and 709:
25.7 Automotive, Industrial Althoug
Page 710 and 711:
36. MITEL Semiconductor: www.semico
Page 712 and 713:
26.2 Digital Filters The theory of
Page 714 and 715:
|H | 1 FIGURE 26.1 Frequency select
Page 716 and 717:
TABLE 26.1 Filter Design Comparison
Page 718 and 719:
frequency response involves some al
Page 720 and 721:
Impulse Response 0.2 0.15 0.1 0.05
Page 722 and 723:
This constrained magnitude problem
Page 724 and 725:
FIGURE 26.8 Block diagram of the ge
Page 726 and 727:
11. Ikehara, M., Tanaka, H., and Ku
Page 728 and 729:
Adam Dabrowski Poznan University To
Page 730 and 731:
−12 2 The reference in this case
Page 732 and 733:
FIGURE 27.1 Two-band filter bank: (
Page 734 and 735:
FIGURE 27.5 Critical bandwidth and
Page 736 and 737:
FIGURE 27.7 Threshold of audibility
Page 738 and 739:
FIGURE 27.10 Critical band index in
Page 740 and 741:
FIGURE 27.13 Simplified model of th
Page 742 and 743:
All described masking effects are e
Page 744 and 745:
where From Eqs. (27.32) and (27.33)
Page 746 and 747:
eal-time. Although floating-point p
Page 748 and 749:
FIGURE 27.19 Overlapped, power comp
Page 750 and 751:
FIGURE 27.21 Symmetrical FIR filter
Page 752 and 753:
In the MPEG-1 encoder an efficient
Page 754 and 755:
These first two approaches can be m
Page 756 and 757:
FIGURE 27.27 ADPCM: (a) encoder, (b
Page 758 and 759:
FIGURE 27.30 General scheme of the
Page 760 and 761:
A new standard MPEG-7, named the mu
Page 762 and 763:
FIGURE 27.32 AC-3 encoder. FIGURE 2
Page 764 and 765:
29. Marven, C. and Ewers, G., A sim
Page 766 and 767:
FIGURE 28.1 FIGURE 28.2 of the huma
Page 768 and 769:
FIGURE 28.5 image of reasonable qua
Page 770 and 771:
Consider the case of a simple 2-D
Page 772 and 773:
FIGURE 28.8 A sampled spatiotempora
Page 774 and 775:
oth high spatial frequency componen
Page 776 and 777:
If it were separable (that is, H(ξ
Page 778 and 779:
The first hypothesis (the less plau
Page 780 and 781:
FIGURE 28.17 The real (top) and ima
Page 782 and 783:
FIGURE 28.18 The resolution of a ti
Page 784 and 785:
FIGURE 28.20 Motion estimation by b
Page 786 and 787:
where the superscripts n and n + 1
Page 788 and 789:
must be found via a finite set of o
Page 790 and 791:
The methods in this subsection are
Page 792 and 793:
FIGURE 28.28 The split phase. Using
Page 794 and 795:
35. Y.-T. Wu, T. Kanade, J. Cohn, a
Page 796 and 797:
29.2 Power Dissipation in Digital C
Page 798 and 799:
additional power benefits. Efficien
Page 800 and 801:
Power savings are higher than simpl
Page 802 and 803:
A priori knowledge of data stream d
Page 804 and 805:
FIGURE 29.7 DCT Chip [my DCT] avera
Page 806 and 807:
19. S. Uramoto et al. A 100 MHz 2-D
Page 808 and 809:
Anna Hać University of Hawaii 30.1
Page 810 and 811:
Using TCP/IP also makes the network
Page 812 and 813:
this is for one mobile host which i
Page 814 and 815:
TDMA Time-division multiple access
Page 816 and 817:
path delay. The two measures of the
Page 818 and 819:
are under the control of the system
Page 820 and 821:
the bandwidth reserved in the targe
Page 822 and 823:
Chik-Kong Ken Yang University of Ca
Page 824 and 825:
FIGURE 31.3 attenuation (dB) -3.0 -
Page 826 and 827:
FIGURE 31.5 to handle large voltage
Page 828 and 829:
p_o V bias FIGURE 31.8 High-impedan
Page 830 and 831:
out[n] a0 FIGURE 31.11 Transmitter
Page 832 and 833:
FIGURE 31.15 Receiver design using
Page 834 and 835:
digitally by first feeding the inpu
Page 836 and 837:
FIGURE 31.19 90 o locking using XOR
Page 838 and 839:
Power of these links is becoming an
Page 840 and 841:
46. Takahashi, T. et al., “A CMOS
Page 842 and 843:
Many computer programs exhibit some
Page 844 and 845:
32.3 Related Memory Models, Hierarc
Page 846 and 847:
32.6 External Sorting and Related P
Page 848 and 849:
uns, each striped across the disks.
Page 850 and 851:
Matrix transposition is the special
Page 852 and 853:
of satellite images is over one ter
Page 854 and 855:
TABLE 32.3 Best Known I/O Bounds fo
Page 856 and 857:
e accessed directly in a single I/O
Page 858 and 859:
implementations of priority queues
Page 860 and 861:
By the reduction in [52], a data st
Page 862 and 863:
set of experiments on various text
Page 864 and 865:
3. A. Acharya, M. Uysal, and J. Sal
Page 866 and 867:
44. J. L. Bentley and J. B. Saxe. D
Page 868 and 869:
85. P. Ferragina and F. Luccio. Dyn
Page 870 and 871:
128. V. Kumar and E. Schwabe. Impro
Page 872 and 873:
173. H. Samet. The Design and Analy
Page 874 and 875:
Peter J. Varman Rice University 33.
Page 876 and 877:
need for fast transfers, up to 1 Gb
Page 878 and 879:
In contrast to prefetching that mas
Page 880 and 881:
The ERF algorithm was analyzed in [
Page 882 and 883:
increment lowestPriorityOnDisk(disk
Page 884 and 885:
External or out-of-core algorithms
Page 886 and 887:
33. M. Kallahalla and P. J. Varman.
Page 888 and 889:
advanced, reaching the point where
Page 890 and 891:
FIGURE 34.3 FIGURE 34.4 defines the
Page 892 and 893:
FIGURE 34.5 Trellis representation
Page 894 and 895:
FIGURE 34.7 Data and servo sectors.
Page 896 and 897:
References 1. S. H. Charrap, P. L.
Page 898 and 899:
High-frequency noise is then remove
Page 900 and 901:
The various components of (34.3) ar
Page 902 and 903:
sequences are more complex, and occ
Page 904 and 905:
ange of 10 −12 -10 −15 . Anothe
Page 906 and 907:
strategies are reviewed, which have
Page 908 and 909:
FIGURE 34.13 Magnitude response for
Page 910 and 911:
taps as an approximation of the Typ
Page 912 and 913:
FIGURE 34.18 CTF BER performance de
Page 914 and 915:
TABLE 34.1 Examples of Equalizers I
Page 916 and 917:
(i) Symbol rate VCO based timing re
Page 918 and 919:
Symbol Rate Timing Recovery Schemes
Page 920 and 921:
where B = B 1 + B 2 + 1 is the size
Page 922 and 923:
in � out � d(k) FIGURE 34.26 Ti
Page 924 and 925:
�(k) z -L FIGURE 34.27 Linearized
Page 926 and 927:
10 −4 and 10 −2 . The steady-st
Page 928 and 929:
16. J. Sonntag, et al., “A high s
Page 930 and 931:
y a special sequence known as the a
Page 932 and 933:
FIGURE 34.36 An example of two Gray
Page 934 and 935:
track n track n +1 FIGURE 34.38 The
Page 936 and 937:
FIGURE 34.40 The phase format. Posi
Page 938 and 939:
increase linear density while mitig
Page 940 and 941:
FIGURE 34.43 Two equivalent constra
Page 942 and 943:
FIGURE 34.44 Possible pairs of sequ
Page 944 and 945:
Distance δ min,C can be bounded as
Page 946 and 947:
FIGURE 34.45 Standard concatenation
Page 948 and 949:
30. E. Soljanin, “On-track and of
Page 950 and 951:
The next block is PRE. What is PR?
Page 952 and 953:
In the above example, we see that s
Page 954 and 955:
FIGURE 34.52 Feedback detector. Cat
Page 956 and 957:
FIGURE 34.54 Decision feedback equa
Page 958 and 959:
esponse (this is also valid for dif
Page 960 and 961:
its use, while the computational, o
Page 962 and 963:
FIGURE 34.58 Viterbi algorithm dete
Page 964 and 965:
Noise-Predictive Maximum Likelihood
Page 966 and 967:
The error event likelihoods are cal
Page 968 and 969:
Metric-First Algorithms Metric-firs
Page 970 and 971:
termination at the same time. Howev
Page 972 and 973:
13. J. Hagenauer, “Applications o
Page 974 and 975:
Given a code C of length n and dime
Page 976 and 977:
Notice that, although a code may ha
Page 978 and 979:
Not many perfect codes exist. In th
Page 980 and 981:
Theorem 1 (Shannon) For any � > 0
Page 982 and 983:
If we write the codewords as polyno
Page 984 and 985:
Let © 2002 by CRC Press LLC 1 1 K
Page 986 and 987:
which, in polynomial form, is Let E
Page 988 and 989:
m Σl=0 because a l = (a m+1 − 1)
Page 990 and 991:
Evaluating the syndromes, we obtain
Page 992 and 993:
FIGURE 34.63 Interleaving m times o
Page 994 and 995:
Operating System © 2002 by CRC Pre
Page 996 and 997:
systems, the most notable example b
Page 998 and 999:
35.3 Components of Distributed Oper
Page 1000 and 1001:
Message-passing IPC shares many cha
Page 1002 and 1003:
process at any arbitrary stage in i
Page 1004 and 1005:
Few attempts were made in the past
Page 1006 and 1007:
alternate years with SOSP), and the
Page 1008 and 1009:
© 2002 by CRC Press LLC 42 Mobile
Page 1010 and 1011:
FIGURE 36.1 were introduced; howeve
Page 1012 and 1013:
FPGAs by providing on-chip memory f
Page 1014 and 1015:
FIGURE 36.3 There is a considerable
Page 1016 and 1017:
FIGURE 36.4 The general form of the
Page 1018 and 1019:
FIGURE 36.6 If a VPB can cover all
Page 1020 and 1021:
John Morris University of Western A
Page 1022 and 1023:
FIGURE 37.1 Simplified block diagra
Page 1024 and 1025:
inverters, and the programmable mul
Page 1026 and 1027:
Programmable Active Memories (PAM)
Page 1028 and 1029:
measured in megabits, not megabytes
Page 1030 and 1031:
from modern FPGAs, e.g., Altera’s
Page 1032 and 1033:
Regularity A processing pipeline wi
Page 1034 and 1035:
Other Languages Other routes from h
Page 1036 and 1037:
29. Bergmann, N.W., and Dawood, A.,
Page 1038 and 1039:
FIGURE 37.8 Basic architectures for
Page 1040 and 1041:
Selected Applications Several class
Page 1042 and 1043:
Development Systems Developing appl
Page 1044 and 1045:
implementation. Reconfigurable or r
Page 1046 and 1047:
The designer starts the generation
Page 1048 and 1049:
lock but allows multiple instructio
Page 1050 and 1051:
data-types that are mapped to TIE r
Page 1052 and 1053:
Conclusions Configurable and extens
Page 1054 and 1055:
FIGURE 38.1 Average vehicle speed.
Page 1056 and 1057:
AHS means advanced cruise-assist hi
Page 1058 and 1059:
TABLE 38.3 navigation systems VICS
Page 1060 and 1061:
FIGURE 38.9 FIGURE 38.10 a map data
Page 1062 and 1063:
FIGURE 38.13 The four basic functio
Page 1064 and 1065:
Support of Safe Driving System The
Page 1066 and 1067:
System evaluation, the fourth issue
Page 1068 and 1069:
FIGURE 38.18 Summarizing the three
Page 1070 and 1071:
uilder tools serving to build MMI o
Page 1072 and 1073:
FIGURE 38.23 FIGURE 38.24 automaker
Page 1074 and 1075:
FIGURE 38.26 FIGURE 38.27 The first
Page 1076 and 1077:
FIGURE 38.30 FIGURE 38.31 a kind of
Page 1078 and 1079:
To Probe Further In this field, the
Page 1080 and 1081:
FIGURE 39.1 of more versatile media
Page 1082 and 1083:
1 • 3DNow! 1 [11,12] from AMD,
Page 1084 and 1085:
FIGURE 39.6 In the packed add instr
Page 1086 and 1087:
If saturation arithmetic is used in
Page 1088 and 1089:
TABLE 39.1 Examples of Operations T
Page 1090 and 1091:
FIGURE 39.10 PAVG R c, R a, R b: Pa
Page 1092 and 1093:
FIGURE 39.13 Packed compare instruc
Page 1094 and 1095:
FIGURE 39.17 Packed multiply high i
Page 1096 and 1097:
FIGURE 39.20 Packed multiply left i
Page 1098 and 1099:
FIGURE 39.23 In the packed multiply
Page 1100 and 1101:
TABLE 39.4 Packed Integer Multiplic
Page 1102 and 1103:
Subword Permutation Instructions In
Page 1104 and 1105:
is n log 2(n). Table 39.6 shows how
Page 1106 and 1107:
FIGURE 39.33 Mix left instruction.
Page 1108 and 1109:
TABLE 39.7 Subword Permutation Inst
Page 1110 and 1111:
TABLE 39.9 IA-64 uses FPMA and FPMS
Page 1112 and 1113:
The two-bit result field is written
Page 1114 and 1115:
source register. These three FP mix
Page 1116 and 1117:
13. Motorola, “AltiVec technology
Page 1118 and 1119:
FIGURE 39.48 ManArray 1 × 2 core e
Page 1120 and 1121:
FIGURE 39.50 Hypercube interconnect
Page 1122 and 1123:
FIGURE 39.53 Host DSP software laye
Page 1124 and 1125:
Benchmark Data Type Performance 256
Page 1126 and 1127:
FIGURE 39.56 Simplified schematic o
Page 1128 and 1129:
Gaming applications often require a
Page 1130 and 1131:
system, and the application program
Page 1132 and 1133:
FIGURE 39.60 FIGURE 39.61 FIGURE 39
Page 1134 and 1135:
FIGURE 39.64 shifting place limits
Page 1136 and 1137:
FIGURE 39.66 pitch Address Looping
Page 1138 and 1139:
FIGURE 39.69 gain of the filter. It
Page 1140 and 1141:
as a core to integrate onto the sam
Page 1142 and 1143:
7. Rossum, D., Constraint based aud
Page 1144 and 1145:
FIGURE 39.74 Procedure for simulate
Page 1146 and 1147:
The fitness value of an individual
Page 1148 and 1149:
FIGURE 39.77 The tabu list can be v
Page 1150 and 1151:
Intermediate-term memory component
Page 1152 and 1153:
FIGURE 39.81 Selection. FIGURE 39.8
Page 1154 and 1155:
Work on parallelization of the tabu
Page 1156 and 1157:
Acknowledgment The authors acknowle
Page 1158 and 1159:
47. L. K. Grover. A new Simulated A
Page 1160 and 1161:
93. E. M. Rudnick, J. H. Patel, G.
Page 1162 and 1163:
138. Youn-Long Lin, Yu-Chin Hsu, an
Page 1164 and 1165:
This architecture allowed for large
Page 1166 and 1167:
FIGURE 40.3 40.3 Application Server
Page 1168 and 1169:
FIGURE 40.5 applications. CORBA cur
Page 1170 and 1171:
FIGURE 40.8 The application server
Page 1172 and 1173:
FIGURE 40.10 The proposed architect
Page 1174 and 1175:
cost at the front end. The ideal ap
Page 1176 and 1177:
FIGURE 40.12 Client-server and netw
Page 1178 and 1179:
Yoshiaki Hagiwara Sony Corporation
Page 1180 and 1181:
FIGURE 41.2 This corresponds to the
Page 1182 and 1183:
FIGURE 41.5 Buried channel CCD stru
Page 1184 and 1185:
FIGURE 41.8 Applications of CCD and
Page 1186 and 1187:
sensor (1100 K pixel) Microphone ×
Page 1188 and 1189:
�� FIGURE 41.14 Form com
Page 1190 and 1191:
FIGURE 41.16 Stack technology. Link
Page 1192 and 1193:
1st EmDRAM Product FIGURE 41.19 Emb
Page 1194 and 1195:
FIGURE 41.23 Em-DRAM process techno
Page 1196 and 1197:
John F. Alexander University of Nor
Page 1198 and 1199:
Several reasons exist for mentionin
Page 1200 and 1201:
sort of local area network. Support
Page 1202 and 1203:
Technological hurdles must be overc
Page 1204 and 1205:
FIGURE 42.1 Block diagram of (a) ge
Page 1206 and 1207:
FIGURE 42.3 Alternative FIR filter
Page 1208 and 1209:
FIGURE 42.5 Polyphase filter struct
Page 1210 and 1211:
3. E. Dahlman, Bjorn Gudmundson, M.
Page 1212 and 1213:
TABLE 42.1 Categorizing Reusable Co
Page 1214 and 1215:
FIGURE 42.11 Internet growth. FIGUR
Page 1216 and 1217:
FIGURE 42.13 Software for VoIP SoC.
Page 1218 and 1219:
FIGURE 42.17 Bandwidth trends. FIGU
Page 1220 and 1221:
The interconnections between the va
Page 1222 and 1223:
FIGURE 42.21 A typical communicatio
Page 1224 and 1225:
carry information over longer dista
Page 1226 and 1227:
however, it is not uncommon that so
Page 1228 and 1229:
node, to which the user is connecte
Page 1230 and 1231:
its information. Intuitively, this
Page 1232 and 1233:
This issue is referred to as latenc
Page 1234 and 1235:
Evolution of Standard Image/Video C
Page 1236 and 1237:
FIGURE 42.26 Sequence of zigzag-cod
Page 1238 and 1239:
FIGURE 42.29 150th Frame of origina
Page 1240 and 1241:
FIGURE 42.31 Data partitioning for
Page 1242 and 1243:
for transmitting a predictively cod
Page 1244 and 1245:
42.6 Pen-Based User Interfaces—An
Page 1246 and 1247:
FIGURE 42.35 The handwriting recogn
Page 1248 and 1249:
• No toggling between edit/contro
Page 1250 and 1251:
FIGURE 42.39 Boxplots of time to en
Page 1252 and 1253:
0 … 9 ( ) -
Page 1254 and 1255:
is using the SMIL generic media ref
Page 1256 and 1257:
FIGURE 42.47 Example of pen-and-pap
Page 1258 and 1259:
slots specifying pieces of informat
Page 1260 and 1261:
most stringent demands for low-powe
Page 1262 and 1263: FIGURE 42.51 MIPS requirement of se
Page 1264 and 1265: FIGURE 42.54 von Neumann architectu
Page 1266 and 1267: FIGURE 42.57 Dual Mac architecture
Page 1268 and 1269: FIGURE 42.59 Two data path variatio
Page 1270 and 1271: FIGURE 42.60 Basic pipeline archite
Page 1272 and 1273: References 1. Bahl L., Cocke J., Je
Page 1274 and 1275: Random Oracle Model One direction o
Page 1276 and 1277: at the end of its usefulness. A new
Page 1278 and 1279: function and verification function
Page 1280 and 1281: underlies the Diffie-Hellman key ag
Page 1282 and 1283: 31. Dolev, D., Dwork, C., and Naor,
Page 1284 and 1285: R. Chandramouli Synopsys Inc. 44.1
Page 1286 and 1287: many deficiencies in the design may
Page 1288 and 1289: impact the performance and test ove
Page 1290 and 1291: FIGURE 44.4 FIGURE 44.5 It becomes
Page 1292 and 1293: SoC methodologies require synchroni
Page 1294 and 1295: This method, however, lacks the app
Page 1296 and 1297: FIGURE 45.2 Input formats of MILEF
Page 1298 and 1299: FIGURE 45.3 FIGURE 45.4 Robustness
Page 1300 and 1301: FIGURE 45.5 In Fig. 45.5 a simple e
Page 1302 and 1303: difficult to identify for overcurre
Page 1304 and 1305: General Approach in Comparison with
Page 1306 and 1307: FIGURE 45.10 phase—the propagatio
Page 1308 and 1309: shorter test sequence could possibl
Page 1310 and 1311: Looking at results of Table 45.6, i
Page 1314 and 1315: 41. F. Brglez, H. Fujiwara: A neutr
Page 1316 and 1317: FIGURE 46.1 Rule of ten in testing
Page 1318 and 1319: FIGURE 46.5 FIGURE 46.6 of the DUT.
Page 1320 and 1321: FIGURE 46.7 generate tests for ever
Page 1322 and 1323: FIGURE 46.9 FIGURE 46.10 behavioral
Page 1324 and 1325: Z. Stamenković University of N. St
Page 1326 and 1327: FIGURE 47.2 Murphy’s Model The mo
Page 1328 and 1329: where k is the total number of crit
Page 1330 and 1331: FIGURE 47.5 Definition of IC critic
Page 1332 and 1333: distribution [34,35]: © 2002 by CR
Page 1334 and 1335: and, in the case of w = X 2 − X 1
Page 1336 and 1337: Algorithm • Input: a singly linke
Page 1338 and 1339: TRACIF takes a CIF file as input an
Page 1340 and 1341: TABLE 47.2 Critical Area Extraction
Page 1342 and 1343: Also, the critical areas for lithog
Page 1344 and 1345: (enhancement of the process cleanli
Page 1346 and 1347: 28. Corsi, F. and Martino, S., Defe
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