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U. Glaeser

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FIGURE 16.15 Dual threshold voltage domino logic gate.<br />

chosen to have low V t, while noncritical gates would have high V t’s, with correspondingly lower leakage<br />

currents [19]. This technique in general is only effective up to a certain point (diminishes with more critical<br />

paths in the circuit), and determining which paths can be made high V t is a complex CAD problem [20].<br />

An alternative application of dual V t technology that can be very useful in microprocessor design is<br />

dual V t domino logic [21]. In this style, individual gates utilize both high V t and low V t transistors, and<br />

the overall circuit will exhibit extremely low leakage in the standby mode, yet suffer no reduction in<br />

performance. This is achieved by exploiting the fixed transition directions in domino logic, and assigning<br />

a priori low-threshold voltages to only those devices in the critical charging/discharging paths. In effect,<br />

devices that can switch during the evaluate mode should be low V t devices, while those devices that<br />

switch during precharge modes should be high V t devices. Figure 16.15 shows a typical dual V t domino<br />

stage used in a clock-delayed domino methodology, consisting of a pull-down network, inverter (I 1),<br />

leaker device (P 1), and clock drivers (I 2, I 3), with the low V t devices shaded.<br />

During normal circuit operation, critical gate transitions occur only through low V t devices, so highperformance<br />

operation is maintained. On the other hand, precharge transitions occur only through high<br />

V t devices, but since precharge times in domino circuits are not in the critical path, slower transition<br />

times are acceptable. By having high V t precharge transistors, it is possible to place the dual V t domino<br />

gate into a very low leakage standby state merely by placing the clock in the evaluate mode and asserting<br />

the inputs. In a cascaded design with several levels of domino logic, the standby condition remains the<br />

same, requiring only an assertion of the first-level inputs. The correct polarity signal will then propagate<br />

throughout the logic to strongly turn off all high V t devices and ensure low subthreshold leakage currents.<br />

In summary, dual V t domino logic allows one to trade-off slower precharge time for improved standby<br />

leakage currents. As a result, using dual V t domino logic can achieve the performance of an all low V t<br />

design, while maintaining the low standby leakage current of an all high V t design.<br />

Adaptive Body Biasing (ABB)<br />

Another technique to control subthreshold leakage is to modulate transistor V t’s directly through body<br />

biasing. With application of maximum reverse body bias to transistors, threshold voltage increases,<br />

resulting in lower subthreshold leakage currents during standby mode, but because the threshold voltage<br />

can be set dynamically, this technique can also be used to adaptively bias a circuit block during the active<br />

mode. Adaptive body biasing can be used to help compensate for large inter-die and within-die parameter<br />

variations by tuning the threshold voltage so that a common target frequency is reached. By applying<br />

reverse body bias to unnecessarily fast circuits, subthreshold leakage in the active mode can then be<br />

reduced as well. In order to use this technique, the initial process V t should be targeted to a lower value<br />

than desired, and then reverse body bias can be applied to achieve a higher threshold voltage mean with<br />

lower variation.<br />

Adaptive body biasing can easily be applied to a die as a whole (single PMOS body and NMOS body<br />

bias values for the whole chip), which will tighten the distribution of chip delays and leakage currents<br />

for a collection of dies, but because die sizes and parameter variations are becoming larger with future<br />

scaling, within-die variation becomes a problem as well. ABB can be applied aggressively at the block<br />

level, where individual functional blocks within a chip, such as a multiplier or ALU, can be independently<br />

modulated to meet a common performance target. The following subsection, however, focuses on the<br />

© 2002 by CRC Press LLC<br />

Clk<br />

2<br />

n<br />

D n<br />

I 2<br />

P1<br />

I 3<br />

I 1<br />

Clk n+1<br />

D n+1

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