Abstracts Book - IMRC 2018

• SF5-P033
STUDY ON COMPRESSION MOLDING OF Ti6Al4V FIBER FOR
PRODUCTION OF POROUS IMPLANT WITH CONTROLLED-RELEASE
CAPACITY
Seongsik Lim 1 , Hyunjong Kim 2 , Kiho Jung 1 , Youngchul Shin 1 , Hojoon Choi 1 , Seongjoo Lim 1
1 Korea Institute of Industrial Technology, Metal Forming R&D group, South Korea. 2 Korea
Institute of Industrial Technology, Surface treatment R&D group, South Korea.
A porous implant with controlled-release capacity is capable of containing
materials in its pores including anti-inflammatory agents, bone morphogenic
proteins, stem cells, and arthritis drugs. After being inserted into the body, the
porous implant starts to release the materials that it contains to prevent
inflammation in the treatment area and accelerate the desired therapeutic
effects. For that reason, this technology has been drawing intense interest as a
next-generation implant. This study was conducted as basic research to
investigate the manufacturing of this type of porous implant. To produce an
implant with a higher porosity rate than implants produced using existing
methods, Ti 6 Al 4 V, a material with proven biocompatibility, was selected. The
material was compressed into fiber form, and a large number of these fibers
were shaped into a compacted sample with a diameter of 10 mm. Subsequently,
these compacted samples were examined. The authors designed and built their
own compression mold, customized for the compression tests conducted in the
present study. Ti 6 Al 4 V fibers of different diameters, i.e., 50, 100, 200, and 500
ï•m, were mixed at a specific ratio, and compressed into compaction
samples. Subsequently, the porosity rate change and flexural strength of these
samples were measured according to compression load. Also, a cell proliferation
test was conducted on the compacted samples, which had been compressionmolded
under various conditions, to indirectly assess their adhesion strength
and other properties when inserted into the body.
Keywords: Ti6Al4V Fiber, Implant, compression test
Presenting authors email: sslim@kitech.re.kr